ANSI TIA EIA 455-4C-2002 Fiber Optics - Component Temperature Life Test《纤维光学元件温度寿命试验》.pdf

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1、 TIA/EIA STANDARD ANSI/TIA/EIA-455-4C-2002 Approved: June 6, 2002 TIA/EIA-455-4C FOTP-4 Fiber Optic Component Temperature Life Test TIA/EIA-455-4C (Revision of TIA/EIA-455-4B) JUNE 2002 TELECOMMUNICATIONS INDUSTRY ASSOCIATION Representing the telecommunications industry in association with the Elect

2、ronic Industries Alliance Copyright Electronic Industries Alliance Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-NOTICE TIA/EIA Engineering Standards and Publications are designed to serve the public interest through eliminat

3、ing misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any

4、 respect preclude any member or nonmember of TIA/EIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than TIA/EIA members, whether the standard is to be us

5、ed either domestically or internationally. Standards and Publications are adopted by TIA/EIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, TIA/EIA does not assume any liability to any patent owner, nor does it assume any obligation whatever to par

6、ties adopting the Standard or Publication. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the

7、applicability of regulatory limitations before its use. (From Standards Proposal No. 3-4467-RV3, formulated under the cognizance of the TIA FO-6.3 Subcommittee on Interconnecting Devices and Passive Components.) Published by TELECOMMUNICATIONS INDUSTRY ASSOCIATION 2002 Standards and Technology Depar

8、tment 2500 Wilson Boulevard Arlington, VA 22201 U.S.A. PRICE: Please refer to current Catalog of EIA ELECTRONIC INDUSTRIES ALLIANCE STANDARDS and ENGINEERING PUBLICATIONS or call Global Engineering Documents, USA and Canada (1-800-854-7179) International (303-397-7956) All rights reserved Printed in

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10、may obtain permission to reproduce a limited number of copies through entering into a license agreement. For information, contact: Global Engineering Documents 15 Inverness Way East Englewood, CO 80112-5704 U.S.A. or call U.S.A. and Canada 1-800-854-7179, International (303) 397-7956 Copyright Elect

11、ronic Industries Alliance Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-NOTICE OF DISCLAIMER AND LIMITATION OF LIABILITY The document to which this Notice is affixed has been prepared by one or more Engineering Committees of

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13、rdance with the TIA Engineering Manual (“Manual”), the current and predecessor versions of which are available at http:/www.tiaonline.org/standards/sfg/engineering_manual.cfm. TIAs function is to administer the process, but not the content, of document preparation in accordance with the Manual and,

14、when appropriate, the policies and procedures of the American National Standards Institute (“ANSI”). THE USE OR PRACTICE OF CONTENTS OF THIS DOCUMENT MAY INVOLVE THE USE OF INTELLECTUAL PROPERTY RIGHTS (“IPR”), INCLUDING PENDING OR ISSUED PATENTS, OR COPYRIGHTS, OWNED BY ONE OR MORE PARTIES. TIA MAK

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18、ALL NOT BE LIABLE FOR ANY AND ALL DAMAGES, DIRECT OR INDIRECT, ARISING FROM OR RELATING TO ANY USE OF THE CONTENTS CONTAINED HEREIN, INCLUDING WITHOUT LIMITATION ANY AND ALL INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF BUSINESS, LOSS OF PROFITS, LITIGATION, O

19、R THE LIKE), WHETHER BASED UPON BREACH OF CONTRACT, BREACH OF WARRANTY, TORT (INCLUDING NEGLIGENCE), PRODUCT LIABILITY OR OTHERWISE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. THE FOREGOING NEGATION OF DAMAGES IS A FUNDAMENTAL ELEMENT OF THE USE OF THE CONTENTS HEREOF, AND THESE CONTENTS WO

20、ULD NOT BE PUBLISHED BY TIA WITHOUT SUCH LIMITATIONS. Copyright Electronic Industries Alliance Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-TIA/EIA-455-4C iFOTP-4 Fiber Optic Component Temperature Life Test Contents Foreword

21、 iii 1 Introduction .1 2 Applicable documents.1 3 Apparatus .2 4 Sampling and specimens3 5 Procedure .4 6 Calculations or interpretation of results.8 7 Documentation8 8 Specification information.9 Annex A (informative) Comparison between FOTP-4 and IEC, ISO, and CCIT requirements.11 Copyright Electr

22、onic Industries Alliance Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-TIA/EIA-455-4C iiThis page left blank. Copyright Electronic Industries Alliance Provided by IHS under license with EIANot for ResaleNo reproduction or net

23、working permitted without license from IHS-,-,-TIA/EIA-455-4C iiiFOTP-4 Fiber Optic Component Temperature Life Test Foreword (This foreword is informative and is not part of this standard.) From TIA Standards Proposal No. 4467-RV3, formulated under the cognizance of TIA FO-6.3, Subcommittee on Fiber

24、 Optic Interconnecting Devices. This FOTP is part of the series of test procedures included within Recommended Standard TIA/EIA-455. NOTE This FOTP was previously published in TIA/EIA-455-4B as FOTP-4. Copyright Electronic Industries Alliance Provided by IHS under license with EIANot for ResaleNo re

25、production or networking permitted without license from IHS-,-,-TIA/EIA-455-4C ivThis page left blank. Copyright Electronic Industries Alliance Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-TIA/EIA-455-4C 11 Introduction 1.1

26、Intent The intent of this test is to determine the effects on the optical and mechanical characteristics of fiber optic components resulting from exposure to an elevated temperature for a specific length of time.1The procedure is applicable to all types of fiber optic devices including connectors, s

27、plices, passive branching devices (couplers), etc. 1.2 Failure Modes Potential failure modes for this test include, but are not limited to: a. Loss of optical continuity, either during or at the end of the test, b. Fiber breakage or damage, c. Breakage of other components, d. Loss of component integ

28、rity, e. Degradation of optical transmission and/or reflection characteristics. 2 Applicable documents The following documents form a part of this FOTP to the extent specified herein: TIA/EIA-455-B Standard Test Procedure for Fiber Optic Fibers, Cables, Transducers, Sensors, Connecting and Terminati

29、ng Devices, and Other Fiber Optic Components FOTP-6 (EIA/TIA-455-6B) Cable Retention Test Procedure for Fiber Optic Cable Interconnecting Devices 1This method is similar to method 1005.1 of MIL-STD-1344A, except that this procedure includes supplementary measurements. Copyright Electronic Industries

30、 Alliance Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-TIA/EIA-455-4C 2FOTP-13 (TIA/EIA-455-13A) Visual and Mechanical Inspection of Fiber Optic Components, Devices, and Assemblies FOTP-20 (TIA/EIA-455-20A) Measurement of Ch

31、ange in Optical Transmittance FOTP-34 (TIA/EIA-455-34A) Interconnection Device Insertion Loss Test FOTP-107 (TIA/EIA-455-107A) Determination of Component Reflectance or Link/System Return Loss Using a Loss Test Set MIL-STD-1344A Test Methods for Electrical Connectors IEC 60068-2-2 Environmental test

32、ing Part 2: Tests. Tests B: Dry heat IEC 61300-2-18 Fibre optic interconnecting devices and passive components Basic test and measurement procedures Part 2-18: Tests - Dry heat High temperature endurance 3 Apparatus The following apparatus and equipment are required to perform this test: 3.1 Chamber

33、 and Associated Equipment Use a suitable chamber and associated equipment capable of maintaining, monitoring, and recording the test temperature to the tolerance specified and for the duration specified (Tables 1 and 2). Temperature measurements shall be made in a manner that will indicate the compo

34、nent exposure temperature rather than the chamber source temperature. The chamber size or capacity shall be such that when components are under test, the chamber is capable of dissipating any internally generated heat (such heat can arise in a connector, for example, from power contact millivolt dro

35、p losses or from system power, in the case of active devices). Use thermocouples for monitoring internal temperature when necessary. Heat sinks may be required. Copyright Electronic Industries Alliance Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted withou

36、t license from IHS-,-,-TIA/EIA-455-4C 33.2 Other Equipment Optical and other test and inspection equipment shall be available as required by FOTPs -13, -20, -34, or -107, as appropriate. Refer to the required FOTP for details. 4 Sampling and specimens 4.1 Samples Select samples randomly from product

37、ion lots of the component to be tested as defined by the Detail Specification. 4.2 Specimen Preparation Sampled components shall be fully assembled as intended for use in accordance with the manufacturers instruction. If the component is a connector, it shall be mated, and with the specified number

38、of contacts and termini. Sealing plugs, optical fiber cables, strain relief attachments and other hardware, and other end preparation requirements shall be as specified in the Detail Specification. 4.3 Specimen Placement and Hookup After 5.1 is completed, and unless otherwise specified, the specimen

39、s and any attached optical, electrical, or composite cables, together with associated test fixtures, shall be normally positioned in the chamber so that there will be no restriction of the air flow. if required, for composite components containing both optical and electrical transmission members, th

40、e monitoring and wiring of electrical channels shall be specified in the Detail Specification. All optical channels shall each be monitored separately. If optical or electrical measurements are to be made at elevated temperatures (5.6), extend necessary cables and leads out of the chamber through ac

41、cess ports. Splices and connectors used for optical connection to the specimen shall be outside the temperature chamber. Copyright Electronic Industries Alliance Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-TIA/EIA-455-4C 45

42、 Procedure 5.1 Pre-Exposure Inspection Before installing specimens in the test chamber, make a visual and physical examination of each specimen in accordance with FOTP-13 to assure that specimens have not been obviously damaged before test. 5.2 Installation in Chamber In turn, install each specimen

43、to be tested in the test chamber (see 4.3). and test in accordance with 5.3 through 5.8. 5.3 Pre-Exposure Testing Perform any pre-exposure optical and electrical tests required by the Detail Specification. Unless otherwise required by the Detail Specification, measure the optical transmittance of al

44、l fibers in accordance with the requirements of FOTP-20. (Use of FOTP-34 to measure insertion loss may be specified by the Detail Specification as an alternative to FOTP-20. Additionally, the Detail Specification may require FOTP-107 be used to measure return loss.) Record results. Seal the test cha

45、mber. 5.4 Severity The severity of the test is determined by the combination of the temperature and the duration of exposure. Tables 1 and 2 list nonmandatory preferred temperatures and test durations that may be specified by the Detail Specification. When the component to be tested is a composite d

46、evice (optical and electrical), having provisions for electrical contacts, the internal temperature of the component shall not exceed that specified in Table 1, or as specified in the Detail Specification, when the test is performed under electrical load conditions. Copyright Electronic Industries A

47、lliance Provided by IHS under license with EIANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-TIA/EIA-455-4C 5Table 1 Preferred Temperature Exposures Exposure Temperature and Tolerance Device Internal Temperature Maximum C Former Codes Designation Number230 2 C 36

48、- 40 2 C 48 - 49 2 C 59 - 55 2 C 65 1 70 2 C 84 2 85 2 C 102 3 100 2 C 120 - 105 2 C 125 4 125 2 C 150 5 155 2 C 185 - 175 5 C 206 6 200 5 C 238 7 250 as specified3288 - 315 as specified3 363 -350 as specified3 400 8 400 as specified3 460 -500 as specified3 575 9 The continuous or duty cycle dc curr

49、ent shall be regulated and recorded, and the current shall not exceed the rated current for the electrical contacts in the composite device. NOTE Prior to specifying the test temperature, a user should consider factors, such as, the component application and the melting temperatures of any materials tha