ANSI IEEE 1156.2-1996 Environmental Specifications for Computer Systems (IEEE Computer Society)《计算机系统的环境规范标准》.pdf

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1、Recognized as anAmerican National Standard (ANSI)The Institute of Electrical and Electronics Engineers, Inc.345 East 47th Street, New York, NY 10017-2394, USACopyright 1996 by the Institute of Electrical and Electronics Engineers, Inc.All rights reserved. Published 1996. Printed in the United States

2、 of AmericaISBN 1-55937-749-6No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permission of the publisher.IEEE Std 1156.2-1996(R2003)(Stabilized 2009)IEEE Standard for Environmental Specifications for Computer System

3、sSponsorMicroprocessor and Microcomputer Standards Subcommitteeof theIEEE Computer SocietyStabilized 19 March 2009Reaffirmed 11 September 2003Approved 20 June 1996IEEE Standards BoardReaffirmed 29 December 2003Approved 5 June 1997American National Standards InstituteAbstract: This standard is design

4、ed for use in conjunction with other documents such as the IEEE1101 group of standards, the IEEE 896 group of standards, the IEEE 1596 group of standards, theIEEE 1014 group of standards, and ISO/IEC 10861: 1994. This standard is one of the IEEEP1156.x series for environmental specifications. It is

5、intended to be used as a core specification. Itcontains minimum environmental withstand conditions applicable to computer systems and all oftheir associated components. It has been created to provide general environmental withstandconditions for one or more of the above listed computer busses or int

6、erconnect standards, andelectronic equipment in general.Keywords: atmospheric stress, computer systems, conducted immunity, corrosion, drop heights,earthquake protection, electrical stress, electromagnetic induction (EMI), electrostatic discharge(ESD), environmental specifications, environmental tes

7、ting, environmental withstand, fire resis-tance, flammability, humidity, mechanical stress, performance level qualification, shock, sinusoidalvibration, thermal shock, thermal testing, vibrationIEEE Standards documents are developed within the IEEE Societies and the Standards Coordinating Committees

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23、andards Board445 Hoes LanePiscataway, NJ 08854USAAuthorization to photocopy portions of any individual standard for internal or personal use is granted by the Institute ofElectrical and Electronics Engineers, Inc., provided that the appropriate fee is paid to Copyright Clearance Center. Toarrange fo

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25、roduction (This introduction is not part of IEEE Std 1156.2-1996, IEEE Standard for Environmental Specifications for Computer Systems.) With the introduction of numerous standards for computer hardware, components, circuit packs, backplanes, systems, etc., the Microprocessor and Microcomputer Standa

26、rds Subcommittee of the IEEE Computer Society found it appropriate to write a separate standard for core environmental withstand conditions for computers. This standard provides design engineers and system engineers with requirements for core environmental conditions that computer systems should be

27、able to withstand, depending upon their environment. These include (but are not limited to) thermal, atmospheric, shock, vibration, flammability, and corrosion stresses during storage and operation. At the time this standard was approved, the P1156.2 working group had the following membership: Rudol

28、f Schubert, Chair David Moore, Vice Chair Elwood Parsons, Vice Chair Cory Ackerman Ed Jacqucs Gene Schramrn Harry A. Andreas Shigeo Kabayashi James F. Simon Edmund Baulsir Kristian Mnrtinson Patricia Smith Andrew J. Brough Rcnc A. Mosqucra Richard Spratt Kim Clohessy John Ogborn Nobuaki Sugiura Mike

29、 Dorsett Katsuyuki Okada Mike Thompson J. J. Dumont Calvin Olscn Joeseph Toy Robert Fluhrer Bill Panter Joe Trainer Paul Fulton Gary D. Pash Dean VanDeWalker Rodger Hinsdale Fernando Rnmircz, Eike Waltz Mark Hontz Jack Rosenberg Don Wilson Frcd E. Sauer The following persons were on the balloting co

30、mmittee: Dharma P. Agrawal Andrew Fraser Malcolm J. Airst Jcrry V. Gilbert Ray S. Alderman Julio Gonale San7 Richard P. Ames John Griflilh Harry A. Andreas Petcr B. Gutparts Keith D. Anthony R. J. Hellweg Alan Beverly Roger Hinsdale Christus Bezirtzoglou Edgar Jacques Lim Boon Lum Richard Kalish Dav

31、id Brearley Thomas M. Kurihara Charles Brill Conrad A. Laurvick Hakon Ording Bugge Per Lindman Robert S. Crowder Rollins Linser Mike Dorsett Joe Macura Jean-Jacque Dumont William C. McDonald Wayne P. Fischer Klaus-Dieter Mueller Gordon Force Hans Muller Michael Munroe Larry Nielsen Elwood Parsons Do

32、uglas H. Patterson Mira Pauker Donald Pavlovich Brian Samelson Frederick E. Sauer Rudolf Schubert Richard C. Spratt Fred J. Strauss Nobuaki Sugiura Michael G. Thompson Udo Voges Paul Waker Eike G. Waltz Robert Widlicka David L. Wright . 111 When the IEEE Standards Eioard approved this standard on 20

33、 June 1996, it had the following membership: Donald C. Loughry, Chair Richard J. Holleman, Wce Chair Andrew G. Salem, Secretary Gilles A. Baril Clyde R. Camp Joseph A. Cannatelli Stephen L. Diamond Harold E. Epstein Donald C. Fleckenstein Jay Forster* Donald N. Heirman Ben C. Johnson E. G. “Al” Kien

34、er Joseph L. Koepfinger* Lawrence V. McCall L. Bruce McClung Marco W. Migliaro Mary Lou Padgett John W. Pope Jose R. Ramos Arthur K. Reilly Ronald H. Reimer Gary S. Robinson Ingo Rusch John S. Ryan Chee Kiow Tan Leonard L. Tripp Howard L. Wolfman *Member Emeritus Also included are the following nonv

35、oting IEEE Standards Board liaisons: Satish K. Aggarwal Alan H. Cookson Chester C. Taylor Valerie E. Zelenty IEEE Standards Project Editor Futurebusc is a registered trademark of the Institute of Electrical and Electronics Engineers, Inc. iv Contents CLAUSE 1 . 2 . 3 . 4 . 5 . 6 . 7 . PAGE Overview

36、1 1.1 Scope 1 1.2 Purpose . 2 References 2 Terminology . 3 Performance level qualification . 4 Common testing conditions . 4 5.1 Normal operation . 4 5.2 Maximum power 5 5.3 Mounting 5 5.5 Initial and final measurements 5 5.4 Tcst duration . 5 Nonoperating environmental core conditions 5 6.1 6.2 6.3

37、 6.4 Humidity (noiioi)“r;lfin:r/sfol.apc) . 7 6.5 Free fall (noiiopcra1i ng/soragc) 7 6.6 Vibration ( 11 () 11 ()pc ri I 1 i ng / (m 2 c ) . . 9 6.7 Shock (nonoperating/storage) 10 6.8 . 11 6.10 Flammability (nonoperating/stor 11 Low temperature (nonoperating/storage) 5 High tempcriiturc (nonoperati

38、np/sloric) . 6 Thermal hock (rioiiopcnitin/.tonlgc) . 6 Mixed flowing gas corrosion (nonoperating/storage) . 11 6.9 Fungus (nonoperating/storage) 6.11 Electrostatic discharge (ESD) (nonoperating/storage) . 12 Operating environmental conditions 12 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 Low temperature (oper

39、ating) . 12 High temperature (operating) . 13 Sinusoidal vibration (operating) 14 Shock (operating) . 14 Low air pressure (operating) 15 Electrostatic discharge (ESD) (operating) . 15 Electromagnetic induction (EMI) (operating) . 15 Earthquake protection 16 Annex A Annex B (informative) Thermal test

40、ing of forced convection-cooled modules . 17 (informative) Shock and vibration fixtures 18 V IEEE Standard for Env ronmental Specifications for Computer Systems 1. Overview This standard contains fundamental information on minimum environmental withstand conditions. It is intended to be used in thos

41、e cases where a generic or detailed specification for a certain system has been prepared. This standard is intended to achieve uniformity and reproducibility in the test conditions for all systems that are purported to have a rated environmental performance level. The terms environmental withstarid

42、;ind cvrirnnmental testing cover the natural and artificial environments to which systems may be exposetl 40 iha1 ill1 assessment of their performance can be made under conditions of use, transport, and storage to hich 11iq iiiay be exposed in practice. These conditions include (but are not limited

43、to) thermal, mechanical, clectrical, flammability, corrosion, and atmospheric stresses. The requirements for the performance of the systcms are not lisled in this standard. The relevant specifica- tion for the system under test defines its minimum permissible performance limits. A list of suggested

44、tests for electronic cquipment is given in Appendix A of IEC 512-1 (1994) Particular test sequences shall be specified in the relevant system document dctailcd specification. 1.1 Scope This standard is designed for use in conjunction with other standards such as the IEEE 1101 group of standards (Mec

45、hanical Specification for Microconnectors and Eurocard Form Factors), the IEEE 896 group of standards (Futurebus+), the IEEE 1596 group of standards (Scalable Coherent Interface), the IEEE 1014 group of standards (VMEBus), and ISO/IEC 10861: 1994 (MULTIBUS 11). This standard is one of the IEEE P1156

46、.x series for environmental specifications. It is intended to be used as a core specification. It contains minimum environmental withstand conditions applicable to computer systems and all of their associated components. It has been created to provide general environmental withstand conditions for o

47、ne or more of the above listed computer busses or interconnect standards, and electronic equipment in general. Information on references can be found in clause 2. 1 IEEE Std 11 56.2-1 996 IEEE STANDARD FOR ENVIRONMENTAL While this standard was specifically created for use with IEEE Computer Society

48、bus standards, nothing herein is intended to restrict its use for other applications, where applicable. A supplier and user may agree to more or less restrictive environmental specifications than those listed below. However, if their specifica- tions are less restrictive than those listed herein, ne

49、ither supplier nor user may claim conformance to this standard. 1.2 Purpose It is the purpose of this standard to provide a core specification for physical integrity and environmental performance levels for computer systems. It is the responsibility of the system designer to evaluate the relationship between module- and component- level environmental specification and the system-level environmental specification for the enclosure that contains the modules. For example, the modules are conduction or convection cooled and a system-level thermal “model” is required to determin