ANSI ASTM D1867-2013 Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring《印制电路用镀铜热固层压板的规范》.pdf
《ANSI ASTM D1867-2013 Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring《印制电路用镀铜热固层压板的规范》.pdf》由会员分享,可在线阅读,更多相关《ANSI ASTM D1867-2013 Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring《印制电路用镀铜热固层压板的规范》.pdf(5页珍藏版)》请在麦多课文档分享上搜索。
1、Designation: D1867 13Standard Specification forCopper-Clad Thermosetting Laminates for Printed Wiring1This standard is issued under the fixed designation D1867; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year of last revis
2、ion. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope*1.1 This specification covers twelve grades of thermosettinglaminate with copper foil bonded to one or both surfaces. Thesecombinat
3、ion forms are intended primarily for use in fabricationof printed (etched) wiring or circuit boards.1.2 The values stated in inch-pound units are to be regardedas the standard. The values given in parentheses are forinformation only.1.3 This standard does not purport to address all of thesafety conc
4、erns, if any, associated with its use. It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:2D709 Specification for Laminated Thermo
5、setting MaterialsD1711 Terminology Relating to Electrical InsulationD3636 Practice for Sampling and Judging Quality of SolidElectrical Insulating MaterialsD5109 Test Methods for Copper-Clad Thermosetting Lami-nates for Printed Wiring Boards2.2 Other Standards:MIL-P-13949 Plastic Sheet, Laminated, Me
6、tal Clad (forPrinted Wiring Boards)3NEMA Publication Number LI-143. Terminology3.1 For definitions of terms used in this standard, refer toTerminology D1711.4. Classification4.1 Base Laminate GradesWhere applicable, the dielec-tric material forming the base of the copper-clad laminate ofthe types li
7、sted in Table 1 and Table 2 shall conform to theproperty requirements of that specific grade shown in Specifi-cation D709.4.2 Copper Foil SurfacesThe surfaces shall be copperfoil, either rolled or electrodeposited, having a minimum purityof 99.50 % (silver considered as equal to copper). The thick-n
8、ess tolerances of the copper foil shall conform to therequirements of Table 3.4.3 Thickness Tolerance ClassesCopper-clad laminatesare available in two classes of thickness tolerance. Class Irepresents those tolerances of standard manufacturing practice.Class II represents a closer tolerance product
9、than Class I. Anyspecified class shall conform to the requirements shown inTable 4.4.3.1 For sheets of laminate equal to or greater than 18 by18 in. (approximately 2.3 ft2) at least 90 % of all thickness testmeasurements made upon any sheet of laminate shall be withinthe limits specified in Table 4.
10、 For metric size sheets this 90 %requirement shall apply to sheet sizes of 0.5 by 0.5 m or 0.25m2area.4.3.2 The deviation of any single thickness test measure-ment value (see Practice D3636) from the nominal overallthickness listed in Table 4 shall not exceed 125 % of thetolerance listed in Table 4.
11、4.3.3 Any overall laminate thickness not listed in Table 4shall meet the tolerance requirements of the next highestnominal thickness listed in Table 4.4.3.4 For cut panels (for example, laminate sheets cut toarea less than 2.3 ft2or less than 0.25 m2) at least 98 % of allthickness test measurements
12、shall be within the specifiedoverall laminate thickness tolerance values of Table 4.5. Ordering Information5.1 Orders for copper-clad laminates shall specify the gradeof laminate base (see 4.1); the type of copper foil (either rolledor electrodeposited); the nominal weight of the copper foil (see4.2
13、); one- or two-side cladding; nominal overall laminatethickness; and the thickness tolerance class (see 4.3).1This specification is under the jurisdiction of the ASTM Committee D09 onElectrical and Electronic Insulating Materials and is the direct responsibility ofSubcommittee D09.07 on Flexible and
14、 Rigid Insulating Materials.Current edition approved Nov. 1, 2013. Published November 2013. Originallyapproved in 1961. Last previous edition approved in 2007 as D1867 07. DOI:10.1520/D1867-13.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at se
15、rviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.3Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700Robbins Ave., Philadelphia, PA 19111-5094, Attn: NPODS.4Available from National Electrical M
16、anufacturers Association, 2101 L St.,N.W., Washington, DC 20037.*A Summary of Changes section appears at the end of this standardCopyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States16. Detailed Requirements6.1 The laminate shall meet the r
17、equirements shown inTable 5.7. Warp or Twist7.1 The warp or twist of copper-clad laminate shall meet therequirements of Table 6. The maximum values shown in Table6 are percentage values applicable only to sheet sizes asmanufactured and to sheets cut such that neither length norwidth is less than 18
18、in. (457 mm). The values shown arepercentages based upon 36-in. (914-mm) dimension sheets.8. Blistering8.1 No blistering shall occur due to exposure of specimensof the material to air at the temperatures and times shown inTable 7. This requirement applies to copper-clad specimensand to laminate from
19、 which all of the copper has been etched.9. Workmanship and Surface Requirements9.1 Grades XXXP, XXXPC, FR-2 and FR-6 Only:9.1.1 Copper surfaces shall be free from defects which havethe potential to affect serviceability of the laminate. Suchdefects in copper surfaces include blisters, wrinkles, cra
20、cks,dents, and scratches.9.1.2 The copper shall not contain any pin holes havingaverage diameter greater than 0.015 in. (0.381 mm).9.1.3 Pin holes in the copper exceeding average diameter0.005 in. (0.127 mm) shall not be present in concentrationexceeding one per ft2.9.1.4 The number of inclusions in
21、 copper which are largerthan 0.020 in. (0.508 mm) in length shall be limited in a singleft2of laminate and in any single sheet of approximately 0.5 m2size. The limits are:9.1.4.1 5 in any one ft2, and9.1.4.2 10 in any one 0.5 m2size sheet.9.1.5 The unclad laminate surface shall have a semi-gloss ord
22、ull finish.9.2 Grades FR-3, FR-4, FR-5, CEM-1, CEM-3, G-10, andG-11:9.2.1 Copper surfaces shall be free from defects which havethe potential to affect serviceability. Such defects includeblisters, wrinkles, and cracks. The copper surfaces shall be freefrom other defects as required in 9.2.2.9.2.2 Pi
23、ts are small holes occurring as imperfections that donot penetrate entirely through the copper foil. Dents aredepressions in the copper foil that do not significantly decreasethe thickness of the copper foil. Pits and dents are limited by apoint count system in which the maximum total allowablepoint
24、 count for pits and dents is 35 per ft2(377/m2). Pits anddents carry various point counts depending upon the longestdimension of the pit or dent. Table 8 provides point countvalues for various dimensions.9.2.3 Pinholes are small holes occurring as imperfectionsthat penetrate entirely through the cop
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