ARINC 671-2006 GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING MAINTENANCE AND REPAIR《转变到焊接维护和修理指南》.pdf

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1、 AN DOCUMENT Prepared by AIRLINES ELECTRONIC ENGINEERING COMMITTEE Published by AERONAUTICAL RADIO, INC. 2551 RIVA ROAD, ANNAPOLIS, MARYLAND 21401-7435 GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR ARINC REPORT 671 PUBLISHED: MARCH 15, 2006 DISCLAIMER THIS DOCUMENT IS B

2、ASED ON MATERIAL SUBMITTED BY VARIOUS PARTICIPANTS DURING THE DRAFTING PROCESS. NEITHER AEEC NOR ARINC HAS MADE ANY DETERMINATION WHETHER THESE MATERIALS COULD BE SUBJECT TO VALID CLAIMS OF PATENT, COPYRIGHT OR OTHER PROPRIETARY RIGHTS BY THIRD PARTIES, AND NO REPRESENTATION OR WARRANTY, EXPRESS OR

3、IMPLIED, IS MADE IN THIS REGARD. AEEC USES REASONABLE EFFORTS TO DEVELOP AND MAINTAIN THESE DOCUMENTS. HOWEVER, NO CERTIFICATION OR WARRANTY IS MADE AS TO THE TECHNICAL ACCURACY OR SUFFICIENCY OF THE DOCUMENTS, THE ADEQUACY, MERCHANTABILITY, FITNESS FOR INTENDED PURPOSE OR SAFETY OF ANY PRODUCTS, CO

4、MPONENTS, OR SYSTEMS DESIGNED, TESTED, RATED, INSTALLED OR OPERATED IN ACCORDANCE WITH ANY ASPECT OF THIS DOCUMENT OR THE ABSENCE OF RISK OR HAZARD ASSOCIATED WITH SUCH PRODUCTS, COMPONENTS, OR SYSTEMS. THE USER OF THIS DOCUMENT ACKNOWLEDGES THAT IT SHALL BE SOLELY RESPONSIBLE FOR ANY LOSS, CLAIM OR

5、 DAMAGE THAT IT MAY INCUR IN CONNECTION WITH ITS USE OF OR RELIANCE ON THIS DOCUMENT, AND SHALL HOLD ARINC, AEEC, AND ANY PARTY THAT PARTICIPATED IN THE DRAFTING OF THE DOCUMENT HARMLESS AGAINST ANY CLAIM ARISING FROM ITS USE OF THE STANDARD. THE USE IN THIS DOCUMENT OF ANY TERM, SUCH AS SHALL OR MU

6、ST, IS NOT INTENDED TO AFFECT THE STATUS OF THIS DOCUMENT AS A VOLUNTARY STANDARD OR IN ANY WAY TO MODIFY THE ABOVE DISCLAIMER. NOTHING HEREIN SHALL BE DEEMED TO REQUIRE ANY PROVIDER OF EQUIPMENT TO INCORPORATE ANY ELEMENT OF THIS STANDARD IN ITS PRODUCT. HOWEVER, VENDORS WHICH REPRESENT THAT THEIR

7、PRODUCTS ARE COMPLIANT WITH THIS STANDARD SHALL BE DEEMED ALSO TO HAVE REPRESENTED THAT THEIR PRODUCTS CONTAIN OR CONFORM TO THE FEATURES THAT ARE DESCRIBED AS MUST OR SHALL IN THE STANDARD. ANY USE OF OR RELIANCE ON THIS DOCUMENT SHALL CONSTITUTE AN ACCEPTANCE THEREOF “AS IS” AND BE SUBJECT TO THIS

8、 DISCLAIMER. 2006 BY AERONAUTICAL RADIO, INC. 2551 RIVA ROAD ANNAPOLIS, MARYLAND 21401-7435 USA Prepared by the Airlines Electronic Engineering Committee Report 671 Adopted by the Airlines Electronic Engineering Committee January 20, 2006 ARINC REPORT 671 GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOL

9、DERING, MAINTENANCE, AND REPAIR Published: March 15, 2006ii FOREWORD Aeronautical Radio, Inc., the AEEC, and ARINC Standards Aeronautical Radio, Inc. (ARINC) was incorporated in 1929 by four fledgling airlines in the United States as a privately-owned company dedicated to serving the communications

10、needs of the air transport industry. Today, the major U.S. airlines remain the Companys principal shareholders. Other shareholders include a number of non-U.S. airlines and other aircraft operators. ARINC sponsors aviation industry committees and participates in related industry activities that bene

11、fit aviation at large by providing technical leadership and guidance and frequency management. These activities directly support airline goals: promote safety, efficiency, regularity, and cost-effectiveness in aircraft operations. The Airlines Electronic Engineering Committee (AEEC) is an internatio

12、nal body of airline technical professionals that leads the development of technical standards for airborne electronic equipment-including avionics and in-flight entertainment equipment-used in commercial, military, and business aviation. The AEEC establishes consensus-based, voluntary form, fit, fun

13、ction, and interface standards that are published by ARINC and are known as ARINC Standards. The use of ARINC Standards results in substantial benefits to airlines by allowing avionics interchangeability and commonality and reducing avionics cost by promoting competition. There are three classes of

14、ARINC Standards: a) ARINC Characteristics Define the form, fit, function, and interfaces of avionics and other airline electronic equipment. ARINC Characteristics indicate to prospective manufacturers of airline electronic equipment the considered and coordinated opinion of the airline technical com

15、munity concerning the requisites of new equipment including standardized physical and electrical characteristics to foster interchangeability and competition. b) ARINC Specifications Are principally used to define either the physical packaging or mounting of avionics equipment, data communication st

16、andards, or a high-level computer language. c) ARINC Reports Provide guidelines or general information found by the airlines to be good practices, often related to avionics maintenance and support. The release of an ARINC Standard does not obligate any airline or ARINC to purchase equipment so descr

17、ibed, nor does it establish or indicate recognition or the existence of an operational requirement for such equipment, nor does it constitute endorsement of any manufacturers product designed or built to meet the ARINC Standard. In order to facilitate the continuous product improvement of this ARINC

18、 Standard, two items are included in the back of this volume: An Errata Report solicits any corrections to the text or diagrams in this ARINC Standard. An ARINC IA Project Initiation/Modification (APIM) form solicits any recommendations for addition of substantive material to this volume which would

19、 be the subject of a new Supplement. ARINC CHARACTERISTIC 671 TABLE OF CONTENTS iii 1.0 INTRODUCTION .1 1.1 Introduction1 1.2 Overview and Background.1 1.3 Scope 1 1.4 Related Documents .2 2.0 ROLES AND RESPONSIBILITIES.4 2.1 Introduction4 2.2 Airframe/Engine Manufacturer .4 2.3 Equipment Manufactur

20、ers4 2.4 Maintenance and Repair Organization (MRO) .5 3.0 CONFIGURATION CONTROL AND PRODUCT IDENTIFICATION.6 3.1 Introduction6 3.2 Configuration Control Requirements6 3.2.1 LRU.6 3.2.2 Soldered Assemblies.6 3.3 Production Identification.7 4.0 MAINTENANCE AND REPAIR PROCESSES .8 4.1 Introduction8 4.2

21、 Materials and Processes8 4.3 Tools8 4.4 Quality Assurance Provisions 8 5.0 DOCUMENTATION REQUIREMENTS9 5.1 Introduction9 5.2 Manufacturers Service Documents (MSDs) 9 5.3 MROs Soldering Program Documents 9 APPENDICES A Glossary 10 B Acronyms.11 ARINC Errata Report ARINC IA Project Initiation/Modific

22、ation (APIM) ARINC REPORT 671 - Page 1 1.0 INTRODUCTION 1.1 Introduction The global transition to lead-free solder has a significant impact on the electronics industry. The transition is disruptive to the aerospace industry, which requires products with continued high performance and maintainability

23、. The aerospace industry represents a small segment of the global electronics market, and has limited control of the solder alloy compositions used to manufacture and repair electronic equipment. As a result, the aerospace industry can neither drive nor resist the transition to lead-free solder. Thi

24、s document recognizes that the aerospace industry is impacted by the transition of the global electronics industry to lead-free solder and, therefore, must accommodate the transition. Since the support of lead-based electronic equipment is expected to continue for the lifetime of existing equipment,

25、 this transition presents a number of challenges for the maintenance and repair of electronic equipment: Lead-free processes and technologies have not been shown to be compatible with traditional lead-based processes and technologies. The lead-free processes and technologies are being driven by the

26、consumer electronics industry and are still evolving. The majority of basic parts have already transitioned to lead-free terminations. This document provides guidance for the use of international standards for the maintenance of lead-free electronic equipment. The purpose is to assist manufacturers,

27、 maintenance facilities, and operators to define lead-free soldering requirements and to minimize the set of lead-free solders, processes, and practices to gain consistency across the industry. A list of definitions and terms used throughout this document are contained in Appendices A and B. 1.2 Ove

28、rview and Background Regulatory agencies require that all maintenance facilities perform soldering in accordance with methods, techniques, and practices prescribed in the current Manufacturers Service Documents (MSDs) or the service documents of the airline operator for which they are performing the

29、 maintenance. MSDs are generally in the form of ATA-compliant Component Maintenance Manuals (CMMs) or standard practice manuals. ATA requires that a CMM contain all necessary instructions to return a component to service. However, CMMs are not required to detail those practices that are considered t

30、o be industry standard. Where a specific practice is necessary, ATA requires that the CMM reference that particular procedure. ARINC REPORT 671 - Page 2 1.0 INTRODUCTION 1.3 Scope This report is focused on managing the maintenance and repair of soldered assemblies during the transition to lead-free

31、technology. The terms lead-based and lead-free refer to alloys used in soldered assemblies. This report provides guidance for: The transition to, and continued maintenance of, lead-free electronics including configuration control and identification of equipment, assemblies, and sub-assemblies. The r

32、oles and responsibilities of participants in the air transport industry. Using industry standards for developing a lead-free soldering program tailored to meet the specific requirements of the user. Developing programs, processes, and documentation for lead-free solder maintenance and repair. This r

33、eport is not a stand-alone documentit is intended to be used with the referenced industry standards and should be accepted throughout the air transport industry. The equipment design documentation defines the basic parts and solder alloys used and is considered to be beyond the scope of this documen

34、t. 1.4 Related Documents ARINC Report 668: Guidance for Tool and Test Equipment (TTE) Equivalency ARINC Report 670: Guidance for Materials, Processes, and Parts (MPP) Equivalencies IPC J-STD-001: Requirements for Soldered Electrical and Electronics Assemblies IPC/JEDEC J-STD-033: Standard for Handli

35、ng, Packing, Shipping and use of Moisture/Reflow Sensitive Surface Mount Devices IPC-T-50: Terms and Definitions for Interconnecting and Packaging Electronic Circuits IPC-1066: Marking, Symbols and Labels for Identification of Lead-free and Other Reportable Materials in Lead-free Assemblies, Compone

36、nts and Devices IPC-7711/7721: Rework, Repair and Modification of Electronic Assemblies IPC-A-610: Acceptability of Electronic Assemblies IPC/WHMA-A-620: Requirements and Acceptance for Cable and Wire Harness Assemblies ARINC REPORT 671 - Page 3 1.0 INTRODUCTION GEIA-STD-0005-1: Performance Standard

37、 for Aerospace and High Performance Electronic Systems Containing Lead-free Solder GEIA-HB-0005-2: Technical Guidelines for Using Lead-free Solder in Aerospace and High Performance Applications GEIA-STD-0005-2: Technical Guidelines for Mitigating the Deleterious Effects of Pure Tin in Aerospace and

38、High Performance Electronic Systems GEIA-HB-0005-1: Program Managers Handbook ARINC REPORT 671 - Page 4 2.0 ROLES AND RESPONSIBILITIES 2.1 Introduction Airframe manufacturers, engine manufacturers, equipment manufacturers, and maintenance and repair organizations have a vested interest in the standa

39、rdization of soldering, maintenance, and repair processes for electronic components. There are three core elements in an effective maintenance and repair program: Technical Requirements Training and Qualification Quality Management This section describes these requirements and the expected roles and

40、 responsibilities of each group. 2.2 Airframe/Engine Manufacturer Airframe and engine manufacturers are the prime contractors to the airline operator. As such, they control their sub-tier Supplier Furnished Equipment (SFE) supplier contracts. They should ensure that their SFE suppliers comply with S

41、ection 2.3. In those cases where they are also an equipment (e.g., LRU) manufacturer, they should also comply with Section 2.3. In addition, airframe and engine manufacturers have the overall responsibility to ensure that the airline operators are provided all necessary information to support the ai

42、rcraft or engine and those systems and equipment selected and procured by them for the airframe or engine. The airframe or engine manufacturers responsibility is to ensure that maintenance instructions provided by their SFE suppliers meet continued airworthiness requirements. In this regard, they sh

43、ould pay special attention to avoid unnecessary, unique, or specialized processes or procedures. In addition, airframe and engine manufacturers should ensure that such documentation is consistent with the requirements of this document, especially Section 2.3 and Section 5.0. 2.3 Equipment Manufactur

44、ers Each manufacturer has the responsibility to provide maintenance instructions adequate to ensure the continued airworthiness of their products. Manufacturers instructions should conform to the documents listed in Section 1.4. The equipment manufacturer should: Avoid over specifying soldering, mai

45、ntenance, and repair requirements in their documentation and invoking additional specific technical requirements unless absolutely necessary. Assure that all necessary data and information required to accomplish repairs of the soldered assemblies are available, especially with regard to the transiti

46、on to lead-free soldered assemblies. ARINC REPORT 671 - Page 5 2.0 ROLES AND RESPONSIBILITIES Assure that maintenance and repair processes are in accordance with IPC-7711/7721, including appropriate moisture sensitivity level (MSL) guidance in accordance with IPC/JEDEC J-STD-033. Assure that lead-ba

47、sed soldered assemblies are repairable with appropriate lead-free basic parts. For example, some tin-bismuth terminations are not compatible with lead-based solders. Assure that all lead-free soldered assemblies are repairable with tin-silver-copper (SAC) based solder alloys. COMMENTARY At the time

48、of publication of this document, the SAC system is the most likely lead-free solder alloy to replace tin-lead alloys for assembly of high-reliability electronic systems. The best current technical information indicates that the SAC system is the most likely alloy of choice for repair facilities. Use

49、rs of this document are advised to verify this observation, and to stay current with developments in this area. The composition ranges for the major constituent alloys of the SAC system are: Tin: 95.5 96.5% Silver: 3.0 4.0% Copper: 0.5 0.7% All others: 0.1% 2.4 Maintenance and Repair Organization (MRO) Each MRO is responsible for establishing effective soldering, maintenance, and repair processes for the transition to lead-free technology. These processes must be consistent with the solder technology of the equipment being maintained, t