AECMA PREN 9132-2005 Aerospace Series Quality Management Systems Data Matrix Quality Requirements for Parts Marking Edition P 2《航空航天系列.质量管理系统矩阵质量要求部分 标记.P2版》.pdf
《AECMA PREN 9132-2005 Aerospace Series Quality Management Systems Data Matrix Quality Requirements for Parts Marking Edition P 2《航空航天系列.质量管理系统矩阵质量要求部分 标记.P2版》.pdf》由会员分享,可在线阅读,更多相关《AECMA PREN 9132-2005 Aerospace Series Quality Management Systems Data Matrix Quality Requirements for Parts Marking Edition P 2《航空航天系列.质量管理系统矩阵质量要求部分 标记.P2版》.pdf(28页珍藏版)》请在麦多课文档分享上搜索。
1、AECMA STANDARD NORME AECMA AECMA NORM Edition approved for publication 31 January 2005 prEN 9132 Edition P 2 January 2005 Comments should be sent within six months after the date of publication to AECMA-STAN PUBLISHED BY THE EUROPEAN ASSOCIATION OF AEROSPACE INDUSTRIES - STANDARDIZATION d%k? the wax
2、 degrades easily under marking processes using a high current and tends to produce a mark of poor quality in these conditions. - Die-impression Die-impression stencil paper is widely used for producing electro-chemical etch marks in many applications. The stencil is made from a colored permeable fab
3、ric with a thin non-permeable laminate surface on one side of the stencil. A Dot Matrix printer is used to punch holes through the laminate coating in the shape of the Data Matrix image. Die-impression stencils are durable and can produce marks of a good quality. The most significant quality concern
4、s derive from the way the stencil is produced. A 24-pin Dot Matrix printer is normally used to produce the images onto the stencil. Problems can occur with inaccuracies in the printing process, such as misalignment of the holes in the stencil paper with the pins in the printer. - Thermal transfer pr
5、inted stencil - disposable This type of stencil material is similar to the Die-impression paper, with a permeable fabric and a non- permeable laminate. The main difference being that the laminate is only microns thick. The laminate is thermally removed from the stencil using a thermal printer leavin
6、g the image on the permeable fabric. The process is generally reliable and produces a good quality mark. The stencils are normally used once and then disposed of. Slight variations in print quality are mainly due to the weave of the permeable fabric structure. 3.4.8 Electrolyte solutions A large num
7、ber of electrolyte solutions exist, the compositions of which may vary according to component material type. However as they are all designed to produce some form of chemical attack of the material, it is vitally important that all traces of electrolyte are washed/removed/neutralized from the entire
8、 component immediately after the marking process is complete. It is also vitally important to note that when applying or removing the electrolyte, that the electrolyte and washing solution shall not be allowed to flow into any openings or cracks between parts. The type/composition and use of the ele
9、ctrolyte fluid shall be the responsibility of the Engineering Design authority. 3.4.9 Marking requirements Inspection of surface color - contrast Surface colors and mark contrast will affect the quality of component identification. In general, dark colors are applied to light surfaces and light mark
10、ings applied to dark surfaces. The minimum contrast level between the marking and its substrate as a gray density difference should be no less than 20 %. Copyright Association Europeene des Constructeurs de Materiel Aerospatial Provided by IHS under license with AECMANot for ResaleNo reproduction or
11、 networking permitted without license from IHS-,-,-Page 17 prEN 9132:2005 1 CIC go 80 70 69 5C 4Li 30 LO TO n Density scale % Figure 12 - A Scale of Gray Density In order to maximize quality, original surface discoloration should be minimized. Module fill The module size fill shall be 60 - 105 % of
12、the nominal module size. In other words, overlapping of 5 % is permitted. Visual appearance To maximize quality, the process output must be controlled within acceptable visual limits (see Annex E for process guidelines). Module depth Module depth is subject to Engineering Design requirements. The mo
13、dule depth is based upon the requirements for process, environment survivability and other material considerations. Module size Nominal module size is typically in the range of 0,20 mm to 0,60 mm (0.008 to 0.024). Changes to this range should be approved by the Engineering Design authority. Recommen
14、ded nominal module size can be obtained using Table 1 Subclause 3.2: Minimum Readable Module Size by Surface Texture in the dot peen section of this document. 3.4.10 Testing To determine marking parameters, which meet the requirements of Clause 4, process trials shall be performed. Process trials sh
15、all be performed for all material types. If different components from the same material are electro-chemically etched, process trials are required only on one of these components or on a representative sample. In the course of the process trials the following parameters shall be specified: - Type of
16、 equipment - Power Setting - AC and / or DC - Time required for process steps - Electrolyte - Stencil material Other parameters may be required and instructed by Engineering Design Authority. The results of the process trials shall be documented in a test report. If one of the above parameters is ch
17、anged, the process trials must be repeated. Copyright Association Europeene des Constructeurs de Materiel Aerospatial Provided by IHS under license with AECMANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-Page 18 prEN 9132:2005 3.4.1 1 Corrosion protection All met
18、al parts are susceptible to corrosion. It is therefore the responsibility of the Engineering Design authority to specify adequate corrosion protection for metallic parts at all stages of manufacturing. 3.4.12 Quality assurance Maintenance of the Electro-chemical etch marking facilities shall be in a
19、ccordance with instructions from the group responsible for maintenance schedules. Marking verification All characteristics shall be verified during the First Article Inspection (FAI) per EN 91 02 requirements. Annex D “Example Methodology for Checking Dot Peen Characteristics“ may be used as a verif
20、ication guideline for Dot peen marking. FA1 may also apply whenever the marking machine set up is disturbed, or after preventive maintenance or machine Any non-conforming marking shall be submitted to the appropriate non-conformance authority for part disposition. Marking validation and monitoring A
21、 Quality Assurance Plan shall be developed and instituted which ensures the quality of the Data Matrix marking process and which monitors/samples the marking process for declining quality of application, which in turn affects matrix quality requirements. For example, Dot Peen monitoring may be as si
22、mple as detecting approaching dot overlap with a 1OX magnifying glass. Marking equipment should be monitored/serviced through a Preventive Maintenance Plan recommended/developed in conjunction with the equipment supplier to ensure sufficient preventive/scheduled maintenance and to avoid marking outs
23、ide of allowable limits. Any non-conforming marking shall be submitted to the appropriate non-conformance authority for part disposition. Copyright Association Europeene des Constructeurs de Materiel Aerospatial Provided by IHS under license with AECMANot for ResaleNo reproduction or networking perm
24、itted without license from IHS-,-,-Page 19 prEN 91 32:2005 Symbol layout Row Column Annex A (informative) Data Data capacity Nominal module size Range Num. Alphanum. 0,22 mm 0.0087 inch Cap. Cap. Symbol size mm inch Dot peening data capacity guidelines for selected surface textures 14 16 14 12x12 16
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