AECMA PREN 2334-1995 Aerospace Series Chromic-Sulphuric Acid Pickle of Aluminium and Aluminium Alloys Edition 1《航空航天系列.铬酸铝和铝合金.第1版》.pdf
《AECMA PREN 2334-1995 Aerospace Series Chromic-Sulphuric Acid Pickle of Aluminium and Aluminium Alloys Edition 1《航空航天系列.铬酸铝和铝合金.第1版》.pdf》由会员分享,可在线阅读,更多相关《AECMA PREN 2334-1995 Aerospace Series Chromic-Sulphuric Acid Pickle of Aluminium and Aluminium Alloys Edition 1《航空航天系列.铬酸铝和铝合金.第1版》.pdf(6页珍藏版)》请在麦多课文档分享上搜索。
1、AECMA PRENa2334 95 U LOL23Ll 08LOO 562 for publication 1995-1 2-29 AECMA STANDARD NORME AECMA AECMA NORM I - can be supplied by B.N.A.E. - Technopolis 54 - 199, rue Jean-Jacques Rousseau 92138 ISSY - LES - MOULINEAUX CEDEX - FRANCE prEN 2334 Edition 1 December 1995 PUBLISHED BY THE EUROPEAN ASSOCIAT
2、ION OF AEROSPACE INDUSTRIES (AECMA) Gulledelle 94 - B-1200 BRUXELLES - Tel. (32) 2 775 81 10 - Fax. (32) 2 775 81 11 ICs : 49.040.40 Descriptors : Aircraft industry, aluminium, aluminium alloys, cleaning ENGLISH VERSION Aerospace series Chromic-sulphuric acid pickle of aluminium and aluminium alloys
3、 Srie arospatiale Luft- und Raumfahrt Dcapage sulfochromique de laluminium et des alliages daluminium Beizen von Aluminium und Aluminiumlegierungen in Chromschwefelsure This “Aerospace series“ Standard has been drawn up under the responsibility of AECMA (The European Association of Aerospace Industr
4、ies). It is published on yellow paper in three equivalent versions (English, French, German). It will be submitted as a draft European Standard to CEN (European Committee for Standardization) for formal vote. I Edition aDDrOVed I The eauivalent versions in French and German languages 1 I I aecma 199
5、5 Copyright Association Europeene des Constructeurs de Materiel Aerospatial Provided by IHS under license with AECMANot for ResaleNo reproduction or networking permitted without license from IHS-,-,-Page 3 prEN 2334 : 1995 1 Scope This standard specifies the acid chromate pickling of aluminium and a
6、luminium alloys except those with a silicon content in excess of 2 % or a copper content in excess of 5 %. It is applicable whenever referenced. 2 Purpose of process 2.1 specimens used for qualification and acceptance tests on adhesives, paints, sealants (treatment A). Reference surface treatment, e
7、.g. prior to adhesive bonding or primer application to test 2.2 Final treatment for parts prior to adhesive bonding or primer application (treatment BI. 2.3 Pre-treatment before anodizing for adhesive bonding (treatment Cl. 2.4 - anodizing for other applications than adhesive bonding ; - other chemi
8、cal treatments. Pre-treatment (treatment D) for : 3 Normative references This European Standard incorporates by dated or undated reference provisions from other publications. These normative references are cited at the appropriate places in the text and the publications are listed hereafter. For dat
9、ed references, subsequent amendments to or revisions of any of these publications apply to this European Standard only when incorporated in it by amendment or revision. For undated references the latest edition of the publication referred to applies. EN 2000 Aerospace series - Quality assurance EN a
10、erospace products - Approval of the quality system of manufacturers 4 Information for the processor - Designation, see 13 ; - Number of the material standard and metallurgical condition of the latter ; - Sequence of operations ; - Areas to be processed ; - Treatment. 5 Condition of parts prior to pr
11、ocessing Fabrication of the parts shall have been completed before pickling. Copyright Association Europeene des Constructeurs de Materiel Aerospatial Provided by IHS under license with AECMANot for ResaleNo reproduction or networking permitted without license from IHS-,-,- AECIA PRENs2334 95 101231
12、1 0010102 987 = Process schedule Pre-treatments Pickling Post-treatments Page 4 EN 2334 : 1995 Application, see treatment A B C D 7.1 7.2 7.2 7.2 8 8 8 8 9.1 9.1 9.1 9.1 9.2 9.2 9.3 9.3 6 Process schedule 7 Pre-treatments 7.1 7.1.1 hot alkaline solution. Cleaning for treatment A (see 2.1) Vapour deg
13、reasing, solvent cleaning or alkaline cleaning with a non-etching, non-silicated 7.1.2 Water rinsing and check for water break, repeat cleaning if break occurs. 7.2 7.2.1 Cleaning for treatments B, C, D (see 2.2, 2.3 and 2.4) Heavily soiled parts shall be emulsion cleaned, vapour degreased or solven
14、t cleaned. 7.2.2 If there is a natural oxide film, carry out abrasive blasting or chemical deoxidizing. When pickling does not follow immediately after these operations, the parts shall be vapour degreased or cleaned with a hot alkaline solution. 7.2.3 solution. The alkaline solution shall be corros
15、ion inhibited and preferably of a non-silicated type. For the parts to be bonded a non-silicated alkaline solution is mandatory. After alkaline cleaning, the parts shall be thoroughly water rinsed and inspected for water break. Cleaning shall be repeated if break occurs. If there is no significant n
16、atural oxide film, parts shall be cleaned with a hot alkaline 8 Treatment Immediately after final cleaning, the parts shall be pickled in one of the solutions specified in annex A. To ensure a well pickled surface, the following shall be observed : - excessive bath loading and shielding of parts by
17、each other shall be avoided ; - to ensure satisfactory adhesion and durability properties for treatments A and B or to obtain a satisfactory metal removal rate, pure aluminium and certain aluminium alloys with a very low Copyright Association Europeene des Constructeurs de Materiel Aerospatial Provi
18、ded by IHS under license with AECMANot for ResaleNo reproduction or networking permitted without license from IHS-,-,- - AECIA PRENm2334 75 LOL23LL OOLOL03 813 Page 5 prEN 2334 : 1995 copper content at the surface (clad aluminium alloys, AI-Mg alloys) require additional provisions. The parts in thes
19、e materials shall be either suspended on supporting jigs which shall be more noble (cathodic) relative to the materials to be treated, e.g. unclad AI-Cu alloy, or coupled to auxiliary cathodes. The position of the parts (anodes) relative to the cathodic areas and the cathodic to anodic area ratio sh
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