ISO IEC 17568-2013 Information technology - Telecommunications and information exchange between systems - Close proximity electric induction wireless communicat.pdf

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1、 Reference number ISO/IEC 17568:2013(E) ISO/IEC 2013INTERNATIONAL STANDARD ISO/IEC 17568 First edition 2013-03-01Information technology Telecommunications and information exchange between systems Close proximity electric induction wireless communications Technologies de linformation Tlinformatique C

2、ommunications sans fil induction lectrique de proximit rapproche ISO/IEC 17568:2013(E) COPYRIGHT PROTECTED DOCUMENT ISO/IEC 2013 All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized otherwise in any form or by any means, electronic or mechanical,

3、 including photocopying, or posting on the internet or an intranet, without prior written permission. Permission can be requested from either ISO at the address below or ISOs member body in the country of the requester. ISO copyright office Case postale 56 CH-1211 Geneva 20 Tel. + 41 22 749 01 11 Fa

4、x + 41 22 749 09 47 E-mail copyrightiso.org Web www.iso.org Published in Switzerland ii ISO/IEC 2013 All rights reservedISO/IEC 17568:2013(E) ISO/IEC 2013 All rights reserved iiiContents Page Foreword vi Introduction.vii 1 Scope1 2 Conformance .1 3 Normative references1 4 Terms and definitions .1 5

5、Abbreviations and acronyms .2 6 Overview.3 6.1 Introduction3 7 Transmit signal 4 7.1 Modulation scheme parameters 4 7.2 Transmitter functional block diagram .4 7.2.1 Supported Rate Settings and rate dependent parameters5 7.2.2 Reed-Solomon encoder 6 7.2.3 Convolutional encoder7 7.2.4 ECS .8 7.2.5 Sp

6、reader .9 7.2.6 Sync sequence 9 7.2.7 Scrambler .10 7.2.8 Scrambling sequence generator11 7.2.9 Pi/2 shift BPSK mapper.12 7.2.10 Mathematical framework of the Up Converter and the Baseband Waveform Generator.13 7.2.11 Baseband waveform13 7.3 Frame format14 7.3.1 PPDU format 14 7.3.2 PHY Header forma

7、t15 7.4 Transmitter.17 7.4.1 Measurement points17 7.4.2 Transmit frequency .17 7.4.3 Transmit clock rate requirement17 7.4.4 Transmit Constellation Error (EVM) 17 8 Receiver17 8.1 Measurement point17 8.2 Reference sensitivity.17 8.3 Blocking17 9 Electric Induction Field.18 10 CNL service definition.

8、19 10.1 Overview of CNL services 19 10.1.1 Connection control service 19 10.1.2 Data service .19 10.1.3 Security service .19 10.2 CNL service access point.19 10.2.1 Initialize.22 10.2.2 Close.22 10.2.3 Connect and accept 22 10.2.4 Connection release .24 10.2.5 Power save.25 ISO/IEC 17568:2013(E) iv

9、ISO/IEC 2013 All rights reserved10.2.6 Data transfer.26 10.3 CPDU formats.27 10.3.1 Conventions .27 10.3.2 Acknowledgement (ACK) CPDU.28 10.3.3 CNL data CPDUs32 10.3.4 Management CPDUs (Link control message) .34 10.4 CNL function description42 10.4.1 Segmenting/Reassembling.42 10.4.2 Medium state se

10、nsing .43 10.4.3 CNL-Level acknowledgements.43 10.4.4 Interframe space (IFS) .48 10.4.5 Access procedure49 10.4.6 Multirate support51 10.4.7 UID filter 51 10.5 CNL state 51 10.5.1 Close state52 10.5.2 Search state52 10.5.3 Connection request state53 10.5.4 Accept waiting state 53 10.5.5 Response wai

11、ting state.53 10.5.6 Responder response state54 10.5.7 Initiator connected state .54 10.5.8 Responder connected state54 10.5.9 Sub-states within the Initiator connected state or Responder connected state.55 10.6 Numerical parameters .57 Annex A (normative) UID Specification 59 A.1 UID Composition59

12、A.1.1 Specifier ID .59 A.1.2 Reserved.59 A.1.3 Extension Identifier59 Annex B (informative) Coupler.60 Annex C (informative) Coupler measurement 61 Annex D (informative) Reference Coupler 63 Annex E (informative) Sample Data Sequences.65 E.1 Reed-Solomon Encoder 65 E.2 Convolutional Encoder .65 E.3

13、PHY Header HCS67 E.4 Common CNL Header HCS.67 E.5 Sub CNL Header HCS67 E.6 Scrambling sequence generator67 Annex F (informative) CNL frame exchange sequences.70 F.1 CNL frame exchange sequences .70 F.1.1 Connection setup procedure70 F.1.2 CSDU exchange procedure 70 F.1.3 Connection sleep procedure 7

14、1 F.1.4 Connection wakeup procedure 72 F.1.5 Connection confirmation procedure73 F.1.6 Connection release procedure.73 Annex G (informative) CNL service operation74 G.1 Initialize operation .74 G.2 Close operation74 G.3 Connect request.75 G.3.1 Connect request operation .75 G.3.2 Accept receive oper

15、ation 75 G.3.3 Accept response operation 76 G.3.4 Connect release operation76 ISO/IEC 17568:2013(E) ISO/IEC 2013 All rights reserved vG.3.5 Accept release operation76 G.4 Connect accept77 G.4.1 Request receive operation77 G.4.2 Accept request operation .77 G.4.3 Accept acknowledge operation .78 G.4.

16、4 Accept release operation78 G.4.5 Connect release operation .79 G.4.6 Request crossover operation.79 G.4.7 Accept request operation .80 G.4.8 Accept release operation80 G.5 Release .81 G.5.1 Release request receive operation 81 G.5.2 Release receive operation 81 G.6 Transfer data82 G.6.1 Data send

17、operation 82 G.6.2 Data receive operation83 G.6.3 Resend timeout operation 84 G.6.4 Target wake operation 85 G.7 Power save.86 G.7.1 Power save request operation .86 G.7.2 Sleep receive operation 87 G.8 Wakeup.88 G.8.1 Wakeup request operation .88 G.8.2 Wakeup acknowledge operation88 G.8.3 Wakeup re

18、ceive operation89 G.8.4 Data send request operation89 G.8.5 Wakeup data send operation .89 G.8.6 Wakeup timeout operation .90 G.9 Probe.90 G.9.1 Probe send operation91 G.10 Probe ACK receive operation.91 G.10.1 Probe receive operation91 G.10.2 Probe timeout operation.92 ISO/IEC 17568:2013(E) vi ISO/

19、IEC 2013 All rights reservedForeword ISO (the International Organization for Standardization) and IEC (the International Electrotechnical Commission) form the specialized system for worldwide standardization. National bodies that are members of ISO or IEC participate in the development of Internatio

20、nal Standards through technical committees established by the respective organization to deal with particular fields of technical activity. ISO and IEC technical committees collaborate in fields of mutual interest. Other international organizations, governmental and non-governmental, in liaison with

21、 ISO and IEC, also take part in the work. In the field of information technology, ISO and IEC have established a joint technical committee, ISO/IEC JTC 1. International Standards are drafted in accordance with the rules given in the ISO/IEC Directives, Part 2. The main task of the joint technical co

22、mmittee is to prepare International Standards. Draft International Standards adopted by the joint technical committee are circulated to national bodies for voting. Publication as an International Standard requires approval by at least 75 % of the national bodies casting a vote. Attention is drawn to

23、 the possibility that some of the elements of this document may be the subject of patent rights. ISO and IEC shall not be held responsible for identifying any or all such patent rights. ISO/IEC 17568 was prepared by Ecma International (as ECMA-398) and was adopted, under a special “fast- track proce

24、dure”, by Joint Technical Committee ISO/IEC JTC 1, Information technology, in parallel with its approval by national bodies of ISO and IEC. ISO/IEC 17568:2013(E) ISO/IEC 2013 All rights reserved viiIntroduction Todays typical consumer uses digital files to store multimedia content such as music, pho

25、tos, and videos. But these files are quickly becoming larger in number and size. A continual demand for higher quality results in larger file sizes. And proliferation of smaller, portable devices makes it easier to generate more content in less time. But the desire to store, share, and enjoy that co

26、ntent remains strong. And this usually requires transferring the content from one device to another. For example, storing might involve transferring the content from a video camera to an external disk drive. Sharing photos might involve transferring the contents from one mobile phone to another mobi

27、le phone. And enjoying content might involve streaming content from a video camera to a TV using a special video cable. But with todays available technology, these activities present difficulties to the average consumer. The transfer process may take a long time due to the large file sizes. Or it ma

28、y involve special cables or complex setup. Therefore, a need exists to make it faster and simpler to transfer large multimedia files. This International Standard specifies a technology that addresses this need by using close proximity electric induction to transfer large files quickly and easily. IN

29、TERNATIONAL STANDARD ISO/IEC 17568:2013(E) ISO/IEC 2013 All rights reserved 1Information technology Telecommunications and information exchange between systems Close proximity electric induction wireless communications 1 Scope This International Standard specifies a connection layer (CNL) and a phys

30、ical layer (PHY) for transferring data between two close proximity entities using electric induction coupling. 2 Conformance Implementations conforming to this International Standard implement both the CNL and the PHY. All Conforming implementations support a centre frequency of 4,48 GHz and all rat

31、e settings specified in Table 2. 3 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) ap

32、plies. ISO/IEC 7498-1:1994, Information technology Open System Interconnection Basic Reference Model: The Basic Model ITU-T Z.120, Series Z: Languages and General Software Aspects for Telecommunication Systems, Formal description techniques (FDT) Message Sequence Chart (MSC) 4 Terms and definitions

33、For the purposes of this document, the following terms and definitions apply. 4.1 chip shortest duration digital unit that is transmitted and used to spread the spectrum 4.2 chip rate rate at which chips are transmitted 4.3 coupler antenna used to transmit and receive an electric induction field 4.4

34、 electric induction field electric field with strength inversely proportional to the distance squared ISO/IEC 17568:2013(E) 2 ISO/IEC 2013 All rights reserved4.5 initiator sender of a connection request 4.6 PHY rate chip rate / spreading factor 4.7 responder receiver of a connection request 4.8 spre

35、ading factor number of duplications 4.9 symbol modulation pulse in a single I or Q channel as expressed as a baseband waveform 4.10 symbol rate rate at which symbols are transmitted in each I or Q channel 4.11 target peer entity 4.12 unique ID code uniquely identifying each implemented unit 5 Abbrev

36、iations and acronyms ACK Acknowledgement BPSK Binary Phase Shift Keying CCF Convolutional Coding Factor CNL CoNnection Layer CPCI CNL Protocol Control Information CPDU Connection layer Protocol Data Unit CSDU Connection layer Service Data Unit C-Acc “Connection Accept” message management frame C-Pro

37、be “Connection Probe” message management frame C-Req “Connection Request” message management frame C-Rls “Connection Release” message management frame C-Sleep “Connection Sleep” message management frame C-Wake “Connection Wakeup” message management frame ECS Error Check Sequence EVM Error Vector Mag

38、nitude FCS Frame Check Sequence FEC Forward Error Collection HCS Header Check Sequence ImACK Immediate Acknowledgement required LFSR Linear Feed-back Shift Register LiCC Link Control Command MSC Message Sequence Chart MUX Multiplexer NoACK No Acknowledgement required ISO/IEC 17568:2013(E) ISO/IEC 20

39、13 All rights reserved 3PDU Protocol Data Unit PHY Physical Layer PPCI PHY Protocol Control Information PPDU Phy layer Protocol Data Unit PSD Power Spectral Density PSDU PHY SDU SAP Service Access Point SDU Service Data Unit UID Unique ID 6 Overview 6.1 Introduction This International Standard speci

40、fies the bottom 2 layers of a close proximity wireless transfer technology. By touching (or bringing very close together) two electronic entities, this technology allows high speed exchange of data. The basic concept consists of a touch-activated multi-purpose interface designed for applications req

41、uiring high-speed data transfer between two entities in a point-to-point (1:1) mode, without the need for external physical connectors. The physical layer has a maximum transmission rate of 560 Mbps, adjusting the data rate downward according to the wireless environment to maintain a robust link eve

42、n when the surrounding wireless condition fluctuates. The RF transmit power is kept at a very low level to cause negligible interference with other nearby wireless systems, including other close proximity electric induction systems. Implementations transmit and receive by means of an electric induct

43、ion field suitable for near field data exchange. This approach is fundamentally different from traditional wireless systems using microwave radiation. Entities establish a link to enable data transfer and serve as initiator and responder respectively. These two roles have no relation to the actual d

44、irection of data transfer as illustrated in Figure 1. Figure 1 Connection between Initiator and Responder The initiator sends a “connection request”, and the responder is its peer that receives a “connection request”. Entities can assume either of these roles. As specified in Figure 2, this Internat

45、ional Standard uses the OSI Basic Reference Model specified in ISO/IEC 7498-1. Initiator Responder Data Data Initiator Responder Initiator Responder Initiator Responder Close Proximity Electric Induction Wireless Communication ISO/IEC 17568:2013(E) 4 ISO/IEC 2013 All rights reservedFigure 2 OSI Basi

46、c Reference Model used in this International Standard 7 Transmit signal 7.1 Modulation scheme parameters The modulation scheme uses Pi/2 shift BPSK and a chip rate (R c ) of 560 Mcps, as illustrated in Table 1. Here, the chip rate refers to the shortest duration digital units that are transferred ov

47、er the air as well as the digital bits that are used to spread the transmitted bandwidth. Since the modulation scheme uses Pi/2 shift BPSK, the reciprocal number of the chip rate (1/R c ) represents the interval between samples of an envelope concatenated along the time axis and the symbol rate (R s

48、 ) on one channel (Ich or Qch) is half the occupied bandwidth (R c ) of the envelope. Hence, the relationship of R s= R c /2 is established. Table 1 Tx signal parameters Chip Rate: R c560 Mcps Chip duration: Tc = 1/R c1,786 nsec Symbol Rate: R s280 Msps Carrier Center Frequency: F c4,48 GHz Modulati

49、on Pi/2 shift BPSK + DSSS FEC 1/2 Convolutional code + Reed Solomon code7.2 Transmitter functional block diagram The transmitter functional block diagram is illustrated in Figure 3. Data from the CNL is first encoded by the Reed-Solomon encoder and the Convolutional encoder. Whether the Convolutional encoder is on or off is determined by the Rate Setting in use, as defined in Table 2. ISO/IEC 17568:2013(E) ISO/IEC 2013 All rights reserved 5The spreader spreads the encoded data by duplicating symbols by the spr