IEC TR 62433-2-1-2010 EMC IC modelling - Part 2-1 Theory of black box modelling for conducted emission《电磁兼容性(EMC)集成电路(IC)的模块化.第2-1部分 传导发射用黑盒子模型理论》.pdf

《IEC TR 62433-2-1-2010 EMC IC modelling - Part 2-1 Theory of black box modelling for conducted emission《电磁兼容性(EMC)集成电路(IC)的模块化.第2-1部分 传导发射用黑盒子模型理论》.pdf》由会员分享，可在线阅读，更多相关《IEC TR 62433-2-1-2010 EMC IC modelling - Part 2-1 Theory of black box modelling for conducted emission《电磁兼容性(EMC)集成电路(IC)的模块化.第2-1部分 传导发射用黑盒子模型理论》.pdf（64页珍藏版）》请在麦多课文档分享上搜索。

1、 IEC/TR 62433-2-1 Edition 1.0 2010-10 TECHNICAL REPORT RAPPORT TECHNIQUE EMC IC modelling Part 2-1: Theory of black box modelling for conducted emission Modles de circuits intgrs CEM Partie 2-1: Thorie du modle de la bote noire pour les missions conduites IEC/TR 62433-2-1:2010 colour inside THIS PUB

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16、ontactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC/TR 62433-2-1 Edition 1.0 2010-10 TECHNICAL REPORT RAPPORT TECHNIQUE EMC IC modelling Part 2-1: Theory of black box modelling for conducted emission Modles de circuits intgrs CEM Partie 2-1: Thorie du modle de la bote noi

17、re pour les missions conduites INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE U ICS 31.200 PRICE CODE CODE PRIX ISBN 978-2-88912-208-0 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internatio

18、nale colour inside 2 TR 62433-2-1 IEC:2010 CONTENTS FOREWORD.3 1 Scope.5 2 Integrated circuit and modelling board5 3 Assumptions.7 3.1 ICEM-CE.7 3.2 Black box model9 4 Modelling9 4.1 Terminals and objectives.9 4.2 Admittance matrix .10 4.3 Matrix compaction .11 4.4 Black box model structure .12 5 Pa

19、rameter extractions 13 5.1 General .13 5.2 Equivalent internal activities13 5.3 Equivalent passive distribution network .15 5.4 Parameter extraction method using finite impedance termination.16 5.5 Black box model including the reference terminal 17 6 Implementation.17 6.1 General .17 6.2 Configurat

20、ion of the application board .17 6.3 Implementation of black box models20 6.4 Solutions to noise voltages and noise currents 20 Annex A (informative) Nodal equation22 Annex B (informative) Example of black box modelling 24 Bibliography28 Figure 1 Integrated circuit and its modelling board.6 Figure 2

21、 Basic ICEM-CE model structure for an IC.7 Figure 3 Representation of the integrated circuit and its modelling board by ICEM-CE.8 Figure 4 Structure of the ICEM-CE for IC black box modelling .10 Figure 5 IC Black box model structure12 Figure 6 IC black box model description with circuit elements 13

22、Figure 7 Setup for extraction of equivalent IAs.14 Figure 8 Definition of phase .15 Figure 9 Setup for extraction of equivalent PDN.16 Figure 10 Setup for extraction of equivalent IAs and PDN 16 Figure 11 Configuration of the application board 18 Figure 12 Setup for simulation of the application boa

23、rd19 Figure B.1 The ICEM-CE model .25 Figure B.2 Spectrum of equivalent IA.26 Figure B.3 Calculated admittances.26 Figure B.4 Noise voltage and noise current27 TR 62433-2-1 IEC:2010 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ EMC IC MODELLING Part 2-1: Theory of black box modelling for conducted e

24、mission FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardizatio

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33、he publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the

34、 possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. The main task of IEC technical committees is to prepare International Standards. However, a technical committee may pro

35、pose the publication of a technical report when it has collected data of a different kind from that which is normally published as an International Standard, for example “state of the art“. IEC 62433-2-1, which is a technical report, has been prepared by subcommittee 47A: Integrated circuits, of IEC

36、 technical committee 47: Semiconductor devices. The text of this technical report is based on the following documents: Enquiry draft Report on voting 47A/826A/DTR 47A/834/RVC Full information on the voting for the approval of this technical report can be found in the report on voting indicated in th

37、e above table. 4 TR 62433-2-1 IEC:2010 This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of IEC 62433 series, under the general title EMC IC modelling, can be found on the IEC website. The committee has decided that the contents of this publicat

38、ion will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on

39、 the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. TR 62433-2-1 IEC:2010 5 EMC IC MODELLING Part 2-1: Theory of black box modelling

40、for conducted emission 1 Scope This part of IEC 62433-2-1 covers black box modelling which has the potential to make the modelling of conducted emission very simple, very fast, and can provide complete protection of proprietary information of IC vendors. This technical report is intended to provide

41、the theoretical background on black box modelling for IC conducted emission. 2 Integrated circuit and modelling board Figure 1 shows an integrated circuit (IC) and a modelling board. The IC is equipped with power/ ground pins, output pins and input pins. Usually an IC requires different power supply

42、 connections, namely, to supply digital cores, I/Os, and analogue circuits. Each one of these power supplies may have plural pins. An IC cannot be activated by itself. To activate the IC properly, the IC has to be provided with power supplies, a set of input signals or an input signal vector, and ap

43、propriate loads for output pins. To achieve these requirements, the modelling board is used. The modelling board provides minimum requirements for the activation. It supplies power, and input signals to the IC, and it gives typical loads for the output pins. In addition, power/ ground pins of the sa

44、me category are connected to each other in the modelling board resulting in one terminal for each category of the power/ ground supply at the interface of the modelling board. The board is also used for parameter extractions for modelling the IC. The IC modelling includes the board. The relationship

45、 between the IC modelling and the modelling board is just like the relationship between measured data and measurement board that affects measurement data. Therefore the modelling board should be as simple and general as possible. 6 TR 62433-2-1 IEC:2010 Figure 1a) Entire structure Figure 1b) Structu

46、re of the IC part Figure 1 Integrated circuit and its modelling board Power/ground terminals Input circuits Input pins Power/ground terminals Internal circuits Power/ground terminals Output circuits Power/ground pins Output pins Power/ground network IEC 2273/10 Power/ground pins Integratedcircuit Z

47、load Z load Z load Z load Output pins Input pins Modelling board Input signal vector Z PG Z PG Z PG Z PG IEC 2272/10 TR 62433-2-1 IEC:2010 7 3 Assumptions 3.1 ICEM-CE ICEM-CE is a macro model that approximates conducted emission behaviour of an IC using two types of components, internal activity (IA

48、) and passive distribution network (PDN) as shown in Figure 2. These two types of components are connected through internal terminals (ITs). The IAs represent noise sources that originate in switching of active devices within the IC. The PDN represents noise propagation characteristics from the inte

49、rnal terminals to the external terminals (ETs). The black box modelling is based on this ICEM-CE model structure. Figure 2 Basic ICEM-CE model structure for an IC Figure 3 shows how to make an ICEM-CE model for the example of an IC and its modelling board shown in Figure 1. Figure 3a) shows the assignment of IA and PDN. The IA part includes input vector