IEC 60539-1-2016 Directly heated negative temperature coefficient thermistors - Part 1 Generic specification《直热式负温度系数热敏电阻器.第1部分 总规范》.pdf

《IEC 60539-1-2016 Directly heated negative temperature coefficient thermistors - Part 1 Generic specification《直热式负温度系数热敏电阻器.第1部分 总规范》.pdf》由会员分享，可在线阅读，更多相关《IEC 60539-1-2016 Directly heated negative temperature coefficient thermistors - Part 1 Generic specification《直热式负温度系数热敏电阻器.第1部分 总规范》.pdf（120页珍藏版）》请在麦多课文档分享上搜索。

1、 IEC 60539-1 Edition 3.0 2016-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Directly heated negative temperature coefficient thermistors Part 1: Generic specification Thermistances coefficient de temprature ngatif chauffage direct Partie 1: Spcification gnrique IEC 60539-1:2016-04(en-fr) THIS PUBLI

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19、 cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 60539-1 Edition 3.0 2016-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Directly heated negative temperature coefficient thermistors Part 1: Generic specification Thermistances coefficient de temprature ngatif chauffage

20、direct Partie 1: Spcification gnrique INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE ICS 31.040.30 ISBN 978-2-8322-3307-8 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning!

21、 Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. 2 IEC 60539-1:2016 IEC 2016 CONTENTS FOREWORD . 7 1 Scope 9 2 Normative references. 9 3 Terms and definitions 10 4 General it

22、ems 20 4.1 Units and symbols . 20 4.2 Preferred values and appropriate category . 20 4.2.1 General . 20 4.2.2 Appropriate category 20 4.3 Marking . 20 4.3.1 General . 20 4.3.2 Marking for small size types such as surface mount thermistors 21 4.3.3 Coding . 21 4.4 Quality assessment procedures . 21 5

23、 Test and measurement procedures 21 5.1 General . 21 5.2 Standard atmospheric conditions for testing . 21 5.3 Drying and recovery 22 5.3.1 Drying 22 5.3.2 Recovery . 22 5.4 Mounting (for surface mount thermistors only) 22 5.4.1 General . 22 5.4.2 Substrate and pad 22 5.4.3 Mounting on board . 22 5.5

24、 Visual examination and check of dimensions . 23 5.5.1 Visual examination . 23 5.5.2 Dimensions 24 5.6 Zero-power resistance . 24 5.6.1 General . 24 5.6.2 Measurement procedures . 24 5.6.3 Requirements 24 5.7 B-value or resistance ratio . 25 5.7.1 General . 25 5.7.2 Requirements 25 5.8 Insulation re

25、sistance (for insulated types only) . 25 5.8.1 General . 25 5.8.2 Test methods . 25 5.8.3 Applied voltage 27 5.8.4 Requirements 28 5.9 Voltage proof (for insulated types only) 28 5.9.1 General . 28 5.9.2 Test voltage . 28 5.9.3 Requirements 28 5.10 Resistance/temperature characteristic . 28 5.10.1 G

26、eneral . 28 5.10.2 Test methods . 28 5.10.3 Requirements 28 IEC 60539-1:2016 IEC 2016 3 5.11 Dissipation factor () . 28 5.11.1 General . 28 5.11.2 Initial measurements 29 5.11.3 Test methods . 29 5.11.4 Requirements 30 5.12 Thermal time constant by ambient temperature change ( a ) . 30 5.12.1 Genera

27、l . 30 5.12.2 Initial measurements 30 5.12.3 Preconditioning 31 5.12.4 Test methods . 31 5.12.5 Final measurements and requirements . 31 5.12.6 Requirements 31 5.13 Thermal time constant by cooling after self-heating ( c ) . 31 5.13.1 General . 31 5.13.2 Initial measurements 31 5.13.3 Preconditionin

28、g 31 5.13.4 Test method . 32 5.13.5 Final measurements and requirements . 32 5.14 Robustness of terminations (not applicable to surface mount thermistors) 32 5.14.1 General . 32 5.14.2 Initial measurements 32 5.14.3 Test methods . 33 5.14.4 Test Ua 1 Tensile . 33 5.14.5 Test Ub Bending (half the num

29、ber of terminations) . 33 5.14.6 Test Uc Torsion (remaining terminations) . 33 5.14.7 Final measurements and requirements . 33 5.15 Resistance to soldering heat . 33 5.15.1 General . 33 5.15.2 Preconditioning 34 5.15.3 Test procedure . 34 5.15.4 Recovery . 34 5.15.5 Final inspection, measurement and

30、 requirements 34 5.16 Solderability 34 5.16.1 General . 34 5.16.2 Test procedure . 34 5.16.3 Final inspection, measurements and requirements 35 5.17 Rapid change of temperature 35 5.17.1 General . 35 5.17.2 Initial measurements 35 5.17.3 Test procedures . 35 5.17.4 Final inspection, measurements and

31、 requirements 35 5.18 Vibration . 36 5.18.1 General . 36 5.18.2 Initial measurements 36 5.18.3 Test procedures . 36 5.18.4 Final inspection, measurements and requirements 36 5.19 Shock . 36 5.19.1 General . 36 4 IEC 60539-1:2016 IEC 2016 5.19.2 Initial measurements 36 5.19.3 Mounting 36 5.19.4 Test

32、procedures . 36 5.19.5 Final inspection, measurements and requirements 37 5.20 Free fall 37 5.20.1 General . 37 5.20.2 Initial measurements 37 5.20.3 Test procedures . 37 5.20.4 Final inspection, measurements and requirements 37 5.21 Thermal shock 37 5.21.1 General . 37 5.21.2 Initial measurements 3

33、7 5.21.3 Test procedures . 37 5.21.4 Final inspection, measurements and requirements 37 5.22 Cold 38 5.22.1 General . 38 5.22.2 Initial measurements 38 5.22.3 Test procedures . 38 5.22.4 Final inspection, measurements and requirements 38 5.23 Dry heat 38 5.23.1 General . 38 5.23.2 Initial measuremen

34、ts 38 5.23.3 Test procedures . 39 5.23.4 Final inspection, measurements and requirements 39 5.24 Damp heat, steady state 39 5.24.1 General . 39 5.24.2 Initial measurements 39 5.24.3 Test procedures . 39 5.24.4 Recovery . 40 5.24.5 Final inspection, measurements and requirements 40 5.25 Endurance 40

35、5.25.1 General . 40 5.25.2 Endurance at room temperature with applied continuous maximum current (I max25 ) (for inrush current-limiting thermistors only) 40 5.25.3 Endurance at room temperature with applied cyclic maximum current (I max25 ) (for inrush current-limiting thermistors only) . 41 5.25.4

36、 Endurance at T 3and P max. 42 5.25.5 Endurance at upper category temperature 43 5.25.6 Maximum permissible capacitance (for inrush current-limiting thermistors only) 43 5.26 Shear (adhesion) test (for surface mount thermistors only) . 45 5.26.1 General . 45 5.26.2 Test conditions 45 5.26.3 Requirem

37、ents 45 5.27 Substrate bending test (for surface mount thermistors only) . 46 5.27.1 General . 46 5.27.2 Initial measurements 46 5.27.3 Test procedures . 46 5.27.4 Final inspection and requirements 46 5.28 Component solvent resistance . 46 IEC 60539-1:2016 IEC 2016 5 5.28.1 General . 46 5.28.2 Initi

38、al measurements 46 5.28.3 Test conditions 46 5.28.4 Requirements 47 5.29 Solvent resistance of marking 47 5.29.1 General . 47 5.29.2 Test conditions 47 5.29.3 Requirements 47 5.30 Salt mist . 47 5.30.1 General . 47 5.30.2 Test conditions 47 5.31 Sealing . 47 5.32 Composite temperature/humidity cycle

39、 . 47 5.32.1 General . 47 5.32.2 Initial measurements 47 5.32.3 Test conditions 48 5.32.4 Final inspection, measurements and requirements 48 Annex A (normative) Interpretation of sampling plans and procedures as described in IEC 60410:1973 for use within quality assessment systems . 49 A.1 Clause an

40、d subclause numbers of IEC 60410:1973 49 Annex B (normative) Rules for the preparation of detail specifications for directly heated thermistors for electronic equipment for use within quality assessment systems . 50 B.1 Drafting . 50 B.2 Reference standard . 50 B.3 Circulation 50 Annex C (informativ

41、e) Typical examples of mountings for measurements of directly heated thermistors 51 C.1 Mounting for surface mount thermistors . 51 Annex D (informative) Reference to IEC 60539-1:2008 . 53 Annex Q (normative) Quality assessment procedures . 54 Q.1 General . 54 Q.2 Primary stage of manufacture 54 Q.3

42、 Structurally similar components . 54 Q.4 Qualification approval procedures 55 Q.4.1 General . 55 Q.4.2 Test procedure for qualification approval 55 Q.4.3 Maintenance of qualification approval . 55 Q.5 Quality conformance inspection . 56 Q.6 Certified test records of released lots 56 Q.7 Delayed del

43、ivery . 56 Q.8 Release for delivery under qualification approval before the completion of group B tests 56 Q.9 Alternative test methods 56 Q.10 Unchecked parameters 56 Bibliography . 57 Figure 1 Typical resistance-temperature characteristic for NTC thermistors . 13 Figure 2 Decreased power dissipati

44、on curve . 15 Figure 3 Maximum current derating 17 6 IEC 60539-1:2016 IEC 2016 Figure 4 Basic circuit for zero-power resistance measurement 24 Figure 5 Example of Method 1 for testing the insulation resistance 25 Figure 6 Example of Method 2 for testing the insulation resistance (1) 26 Figure 7 Exam

45、ple of Method 2 for testing the insulation resistance (2) 26 Figure 8 Example of Method 3 for testing the insulation resistance 27 Figure 9 Example of Method 4 for testing the insulation resistance 27 Figure 10 Example of test chamber 29 Figure 11 Dissipation factor measuring circuit . 30 Figure 12

46、Thermal time constant measuring circuit . 32 Figure 13 Endurance at room temperature with I max25evaluating circuit 41 Figure 14 Maximum permissible capacitance test circuit (Method 1) 44 Figure 15 Maximum permissible capacitance test circuit (Method 2) 45 Figure C.1 Mounting for measurements of sur

47、face mount thermistors 52 Table 1 Lower and upper category temperatures and duration of the damp heat, steady state test . 20 Table 2 Tensile force . 33 IEC 60539-1:2016 IEC 2016 7 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS Part 1: Generi

48、c specification FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standa

49、rdization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subjec