TIA-607-C-2015 Generic Telecommunications Bonding and Grounding (Earthing) for Customer Premises.pdf

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1、 TIA-607-C (Revision of TIA-607-B) November 2015Generic Telecommunications Bonding and Grounding (Earthing) for Customer Premises ANSI/TIA-607-C-2015 APPROVED: NOVEMBER 9, 2015 NOTICE TIA Engineering Standards and Publications are designed to serve the public interest through eliminating misundersta

2、ndings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for their particular need. The existence of such Standards and Publications shall not in any respect

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6、rademarks in this document are for information purposes and do not constitute an endorsement by TIA or this committee of the products or services of the company. (From Standards Proposal No. ANSI/TIA-PN-607-C-D1, formulated under the cognizance of the TIA TR-42 Telecommunications Cabling Systems, TR

7、-42.16 Subcommittee on Premises Telecommunications Bonding (b) there is no assurance that the Document will be approved by any Committee of TIA or any other body in its present or any other form; (c) the Document may be amended, modified or changed in the standards development or any editing process

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20、nding and Grounding (Earthing) for Customer Premises Table of Contents FOREWORD . vii 1 SCOPE 1 2 NORMATIVE REFERENCES . 1 3 DEFINITIONS, ACRONYMS AND ABBREVIATIONS, UNITS OF MEASURE 2 3.1 General 2 3.2 Definitions 2 3.3 Acronyms and abbreviations 6 3.4 Units of measure 8 4 REGULATORY . 9 4.1 Nation

21、al requirements 9 4.2 Local code requirements 9 5 OVERVIEW OF TELECOMMUNICATIONS BONDING AND GROUNDING SYSTEMS 10 5.1 General .10 5.2 Overview of the telecommunications bonding infrastructure 10 5.2.1 General 10 5.2.2 Primary bonding busbar (PBB) 12 5.2.3 Telecommunications bonding conductor (TBC) 1

22、2 5.2.4 Telecommunications bonding backbone (TBB) 13 5.2.5 Secondary bonding busbar (SBB) 13 5.2.6 Backbone bonding conductor (BBC) 13 6 TELECOMMUNICATIONS BONDING COMPONENTS 14 6.1 General .14 6.2 Busbars 14 6.2.1 Primary bonding busbar (PBB) 14 6.2.2 Secondary bonding busbar (SBB) 14 6.2.3 Rack bo

23、nding busbar (RBB) 15 6.3 Conductors .15 6.3.1 General 15 6.3.2 Sizing the telecommunications bonding backbone (TBB) .15 6.3.3 Sizing the telecommunications bonding conductor (TBC) 16 6.3.4 Sizing the backbone bonding conductor (BBC) 16 ANSI/TIA-607-C ii 6.3.5 Use of structural metal .16 6.3.5.1 Gen

24、eral .16 6.3.5.2 Connections to the PBB/SBB 16 6.4 Connectors .17 6.5 Identification17 6.5.1 Conductors 17 6.5.2 Labels 17 7 DESIGN REQUIREMENTS 18 7.1 General .18 7.1.1 Telecommunications entrance room or space 18 7.1.2 Distributor rooms .18 7.1.3 Computer rooms 19 7.1.4 Cabinets and racks 19 7.1.5

25、 Metallic pathways 20 7.1.6 Structural metal 20 7.2 Primary bonding busbar (PBB)21 7.2.1 General 21 7.2.2 Bonds to the PBB 21 7.2.3 Connections to the PBB .22 7.3 Secondary bonding busbar (SBB) .22 7.3.1 General 22 7.3.2 Bonds to the SBB 22 7.3.3 Connections to the SBB .23 7.4 Rack bonding busbar (R

26、BB) .23 7.4.1 General 23 7.4.2 Bonds to the RBB 23 7.4.3 Connections to the RBB .23 7.5 Conductors .23 7.5.1 General 23 7.5.2 Bend radius and included angle .23 7.5.3 Telecommunications bonding conductor (TBC) 24 7.5.4 Telecommunications bonding backbone (TBB) 24 7.5.5 Backbone bonding conductor (BB

27、C) 25 7.5.6 Coupled bonding conductor (CBC) 25 ANSI/TIA-607-C iii 7.5.7 Bonding conductors for connections to the mesh-BN or RBB 25 7.5.8 Telecommunications equipment bonding conductor (TEBC) 26 7.5.8.1 General .26 7.5.8.2 Separation 27 7.6 Bonding equipment cabinets/equipment racks to the TEBC 27 7

28、.7 Structural bonding of equipment cabinets/equipment racks 28 7.8 Supplementary bonding networks .29 7.8.1 Mesh-BN 30 7.8.2 Mesh-IBN .31 7.8.3 Bonding conductor for connections to the supplementary bonding network .32 7.9 Administration .32 8 EXTERNAL GROUNDING . 33 8.1 Grounding resistance 33 8.1.

29、1 Minimum requirements 33 8.1.2 Enhanced requirements .33 8.2 Grounding electrode system design 33 8.2.1 General 33 8.2.2 Soil resistivity testing 33 8.2.3 Low resistance .33 8.2.4 Potential equalization .34 8.2.5 Design configuration 34 9 PERFORMANCE AND TEST REQUIREMENTS . 35 9.1 Two-point ground/

30、continuity testing .35 9.2 Grounding electrode system testing 35 9.2.1 Three-pole fall-of-potential method 35 9.2.2 Clamp-on test meter 37 9.3 Soil resistivity testing .38 9.3.1 General 38 9.3.2 Four-point method .38 9.3.2.1 General .38 9.3.2.2 Test procedure39 Annex A (informative) BONDING METHODS

31、42 Annex B (informative) GROUNDING ELECTRODES . 43 B.1 General .43 ANSI/TIA-607-C iv B.2 Ground rods 43 B.3 Electrolytic ground rods 44 B.4 Ground plate electrodes 44 B.5 Wire mesh 44 B.6 Concrete encased electrode .45 B.7 Ground ring electrodes .45 B.8 Ground radial electrodes .45 B.9 Enhanced grou

32、nding materials .46 B.10 Grounding conductors .47 Annex C (informative) TOWERS AND ANTENNAS 48 C.1 General .48 C.2 Grounding electrode system .48 C.2.1 External grounding .48 C.2.2 Bonding busbars 48 C.2.3 Grounding systems 49 C.2.3.1 Type 1 sites 49 C.2.3.2 Type 2 sites 50 C.2.4 Tower grounding 50

33、C.2.4.1 Guyed metallic towers .51 C.2.4.2 Self-supporting metallic towers .53 C.2.4.3 Wooden structures (poles) 54 C.2.5 Building/shelter and outdoor cabinet grounding .56 C.2.6 Rooftop sites grounding system .57 C.2.6.1 Down conductors 60 C.2.6.2 Roof conductors 60 C.2.7 Transmission line grounding

34、 at antenna locations 60 C.2.8 Ancillary objects requiring bonding and grounding .61 C.2.8.1 Fence grounding .61 C.2.8.2 Generators 63 C.2.8.3 Satellite dishes64 C.2.9 Internal bonding and grounding .64 C.2.9.1 Components .64 C.2.9.2 Installation 64 C.2.9.3 Bonding to the external ground electrode s

35、ystem .64 ANSI/TIA-607-C v Annex D (informative) TELECOMMUNICATIONS ELECTRICAL PROTECTION 65 Annex E (informative) ELECTRICAL PROTECTION FOR OPERATOR-TYPE EQUIPMENT POSITIONS . 67 Annex F (informative) CROSS REFERENCE OF TERMS 69 Annex G (informative) BIBLIOGRAPHY 70 List of Figures Figure 1 Relatio

36、nship between relevant TIA standards . ix Figure 2 Elements of generic cabling topology 3 Figure 3 Illustrative example of a multi-story large building 11 Figure 4 Illustrative example of a single story large building .12 Figure 5 Illustrative example of a smaller building 12 Figure 6 Example PBB .1

37、4 Figure 7 Example SBB .15 Figure 8 Label for bonding and grounding conductors 17 Figure 9 Example of three methods to bond equipment and racks .20 Figure 10 Illustration of bend radius and included angle .24 Figure 11 Bonding to the service equipment (power) ground .24 Figure 12 Example TEBC to rac

38、k bonding conductor connection .26 Figure 13 Example of a TEBC routed on cable tray27 Figure 14 Illustration of connection point to a rack from a TEBC 28 Figure 15 Illustration of a bond connection from a cabinet to the cabinet door .29 Figure 16 A mesh-BN with equipment cabinets, frames, racks and

39、CBN bonded together 30 Figure 17 A mesh-IBN having a single point of connection.32 Figure 18 Illustration of test instrument connections .37 Figure 19 Four-point method 39 Figure 20 Example of multiple test locations 40 Figure 21 Recommended resistivity table layout 41 Figure 22 Illustrative views o

40、f typical ground rods 43 Figure 23 Illustrations of a vertical and horizontal electrolytic ground rod .44 Figure 24 Illustrative view of a concrete-encased electrode .45 Figure 25 Illustrative view of a ground radial electrode .46 Figure 26 Illustrative example of ground enhancement materials surrou

41、nding a grounding conductor and a ground rods 47 Figure 27 Illustrative example view of a site grounding electrode system .48 Figure 28 Illustration of a parallel ground rod installation 50 ANSI/TIA-607-C vi Figure 29 Illustration of a guyed tower grounding example.52 Figure 30 Illustration of guy w

42、ire grounding 53 Figure 31 Illustration of a monopole tower grounding example .54 Figure 32 Illustrative view of a wooden pole grounding example 55 Figure 33 Illustrative view of a cabinet grounding system .56 Figure 34 Illustrative rooftop tower example .58 Figure 35 Illustrative view of roof-mount

43、ed antenna mast grounding with a supplemental grounding electrode system 59 Figure 36 Illustrative view of side-mounted antenna grounding using copper strap down conductor 60 Figure 37 Illustration of a fence bonding example 62 Figure 38 Illustrative view of a fence fabric and deterrent wiring bondi

44、ng example .63 Figure 39 Illustrative view of a generator grounding example .64 Figure 40 Electrical protection for operator-type equipment positions 68 List of Tables Table 1 TBB/BCC conductor size vs length 16 Table 2 Stake distance .36 Table 3 Cross reference of terms .69 ANSI/TIA-607-C vii FOREW

45、ORD (This foreword is not considered part of this Standard) This Standard was developed by TIA Subcommittee TR-42.16. Approval of this Standard This Standard was approved by TIA Subcommittee TR-42.16, TIA Engineering Committee TR-42, and the American National Standards Institute (ANSI). ANSI/TIA rev

46、iews standards every 5 years. At that time, standards are reaffirmed, withdrawn, or revised according to the submitted updates. Updates to be included in the next revision should be sent to the committee chair or to ANSI/TIA. Contributing organizations More than 60 organizations within the telecommu

47、nications industry (including manufacturers, consultants, end users, and other organizations) contributed their expertise to the development of this Standard. Documents superseded This Standard supersedes ANSI/TIA-607-B dated September, 2011, and its addenda. Significant technical changes from the p

48、revious edition Significant changes from the previous edition include: The contents of Addendum 1 (external grounding) and Addendum 2 (structural metal) were incorporated. References were updated. Terms were changed to harmonize with ISO/IEC 30129 (see annex E). Illustrative example added for single

49、 story large building. Recommendations for bonding connections for separately derived systems added. Added component and design requirements for rack bonding busbars. Added minimum bend radius and included angle requirements for bonding conductors. Clarified that a backbone bonding conductors needs to be, at a minimum, the same size as the largest telecommunications bonding backbone to which it is connected. Expanded the list of conductors that are required to green and clarified that th