TIA-455-229-2002 FOTP-229 Optical Power Handling and Damage Threshold Characterization《FOTP-229 光功率处理和损坏阈描述》.pdf

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1、 TIA-455-229 August 2002 (r 01/2012) FOTP-229 Optical Power Handling and Damage Threshold Characterization NOTICE TIA Engineering Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangea

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22、 BY TIA WITHOUT SUCH LIMITATIONS. TIA-455-229 1 FOTP-229 OPTICAL POWER HANDLING AND DAMAGE THRESHOLD CHARACTERIZATION CONTENTS FOREWORD .3 1 Introduction5 1.1 Intent5 1.2 Scope.5 1.3 General description 6 1.4 Precautions 6 2 Normative references .7 3 Apparatus 7 4 Procedure 9 4.1 Preparation of spec

23、imens .9 4.2 Preconditioning.9 4.3 Initial measurements 9 4.4 Method 1 9 4.5 Method 2 13 4.6 Method 3 13 4.7 Recovery14 4.8 Final measurements .14 4 Severity .14 5 Details to be specified 14 Annex A Background to the test method 17 A.1 Introduction 17 A.2 Derivation of the test plan.17 A.3 Populatio

24、n size and test duration 18 A.4 Power step levels .18 A.5 Failure criteria 18 A.6 Wavelength 19 Annex B Derating criteria.20 TIA-455-229 2 This page left blank. TIA-455-229 3 FOTP- 229 OPTICAL POWER CHARACTERIZATION Foreword (This Foreword is informative only and is not part of this Standard.) From

25、TIA Project No.xxxx, formulated under the cognizance of TIA FO-6.3, Subcommittee on Passive Fiber Optic Devices. This FOTP is part of the series of test procedures included within Recommended Standard EIA/TIA-455. There are two annexes, both Informative. Key words: Power level, Optical, Passive Comp

26、onents, Interconnecting devices, Degradation, Step stress, Exposure, Damage, Characterization TIA-455-229) 4 This page left blank. TIA-455-229 5 FOTP- 229 OPTICAL POWER CHARACTERIZATION 1 Introduction 1.1 Intent The purpose of this standard is to characterize the robustness of a fiber optic passive

27、component or interconnecting device against damage from exposure to optical power. 1.2 Scope Specifically, the objectives are to: characterize both the short term and the long term robustness of components from damage due to optical power induced degradation or failure mechanisms provide data necess

28、ary to ensure that components are exposed to appropriate optical power levels that will not degrade their performance identify components prone to irreversible degradation The test procedure described in this document is structured such that, if the full characterization option is performed, the com

29、ponent will be characterized without the need for re-testing should future applications change. For example, one way to approach the issue of high power characterization is to test a component at a specific power level and wavelength to which the component will be exposed in a specific application.

30、While testing of the component at that power/wavelength may indicate the robustness of the component in that specific application, if the component is considered for another application, the tests will need to be performed again at other powers/wavelengths. However, if the component is fully charact

31、erized at all relevant wavelengths, and the maximum power handling level at those wavelengths is identified, then all the information required to assess the suitability of the component in any application is available. The results of the full characterization test method in this document will be a r

32、ating of the component under test. This rating forms the basis of determining the power levels to which the component can be exposed in a reliable manner. It essentially defines the “operating region envelope” for the component. TIA-455-229 6 Since there will often be constraints (that is, time, cos

33、t, equipment availability) that limit the ability to perform the full characterization, alternative test methods are outlined in this document that perform only a subset of the full test. The test methods contained in this document are intended to assess the robustness of components in their normal

34、use conditions for which they were designed. 1.3 General Description Testing of the component is designed to yield the following values: 1.3.1 Pdriftthe power at which the device experiences a change in insertion loss (IL) of 0.5dB while under power. This drift may be recoverable after power is remo

35、ved from the component. 1.3.2 Pfailthe power at which the device experiences a permanent specified change in IL after power is removed. Failure for a component type and wavelength shall be defined as: For a component with an initial IL, 10 dB: 5, 10, 15, 20, (continuing in increments of 5mW) Samples

36、 shall be maintained continuously at each power level for three hours. NOTE 1 For any device that, by definition, has varying loss in the use wavelength band (for example, a GFF), the component should be tested at a wavelength as close to the maximum loss in the band as possible. When deciding a tes

37、t wavelength, consideration shall be given to the absorption characteristics of the component material and/or the temperature rise of the material as a function of wavelength. NOTE 2 If there is sufficient confidence that the component will pass the step stress test at higher powers, the testing can

38、 be initiated at a higher step in order to save time. (The power level at which the test is started shall be one of the values as defined above.) Equally, if the proposed initial power level is considered to be too high, the test starting point may be reduced. d) Place the sample in the environmenta

39、l chamber, connect to the test apparatus and increase the temperature in the chamber to 70 C. TIA-455-229 12 NOTE Wherever possible the tests shall be performed with the sample in an operating configuration (that is, one that is within specified operating limits, that yields the most internal power

40、dissipation). e) Subject the sample to the initial level in the step stress for 3 hours at one of the specified wavelengths. Continuously monitor insertion loss. f) If failure does not occur, the power level is increased to the next step and the process repeated. g) The testing shall continue, using

41、 the specified power increments, until Pdriftoccurs, or the maximum test apparatus power capability is attained. Determine whether the sample recovers when power is removed. If its not Pdriftis also Pfail. h) If the sample recovers continue the test until Pfailor the maximum power output on the lase

42、r source is reached (Pfail Pdrift). i) Repeat the steps e) to h) for the remaining samples. j) Repeat steps e) to i) for the remaining wavelengths, each with a new sample set of three components. NOTE It is acceptable to conduct the test at one or two wavelengths (typically, the wavelength at which

43、the component was designed to perform). However, any deviation from this test procedure must be recorded in the relevant test report. A flow chart of the short term test is given in figure 2. Has max. testpower beenattainedIncrement powerand subject to 3hoursGo to long term testHave all sbeen tested

44、 ?Select next Select 3new partsShort term testcomplete,Record dataNYYNNYIL power increment10dB 5mWSelect first Determine IL at Subject 3 parts to X mW(see table) for 3 hrs. at 70oCMeasure ILRecord dataHas 1 or more partsfailed? (i.e.0,5dBchange)NOTE The lowest power at which the device shows a 0.5 d

45、B change in IL while under power, but recovers after power is removed, is known as Pdrift. Figure 2 Flowchart of short-term test k) The long-term test will begin after the completion of the short-term test. The test set up and the component configuration used shall be the same TIA-455-229 13 as that

46、 used in the short-term test. Again all testing shall be carried out at 70 C. l) l) The long term test shall be carried out at a power level at least one step below Pdrift observed in short term testing. The power setting used for long term testing must be one of the specified power levels given in

47、this document. For example, if Pdrift in the short term test occurred at 1200 mW, the recommended power level for the long term test is 1000 mW, but 800 mW, 600 mW, etc. are also acceptable. However, care should be taken not to test the component at too low a level. NOTE If the component is tested a

48、t too low a level, it is likely to be underrated, i.e. the true power handling capability of the component will be higher than the rated value. As a result, there is a risk that the component may be capable of long term operation in a specific application but not rated to meet it. m) If no failure o

49、ccurred in the short term testing, the long term testing shall begin at the highest power achieved in the short term testing. n) Eight samples shall be tested at the determined power level for 500 hours. Of these, seven samples shall be tested at wavelengths representative of each operating wavelength or band for which the component was designed to operate. o) One sample shall be tested at the wavelength where the samples showed the worst performance in the step stress test (that is, whichever wavelength gave the lowest Pdrift). If the lowest power fai