SAE AS 6171 5-2016 Techniques for Suspect Counterfeit EEE Parts Detection by Radiological Test Methods.pdf

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4、0 (outside USA) Fax: 724-776-0790 Email: CustomerServicesae.org SAE WEB ADDRESS: http:/www.sae.org SAE values your input. To provide feedback on this Technical Report, please visit http:/standards.sae.org/AS6171/5 AEROSPACE STANDARD AS6171/5 Issued 2016-10 Techniques for Suspect/Counterfeit EEE Part

5、s Detection by Radiological Test Methods RATIONALE Radiological inspection is a means to inspect the internal attributes of an electronic device. The inspection process is non-destructive, however it can be destructive for certain device types. Radiological inspection allows for expeditious inspecti

6、on and detection of anomalies of numerous devices. INTRODUCTION Radiology is a tool that can be used for pinpointing defects or regions of interest in Electrical, Electronic, and Electro-mechanical before (EEE) Parts. Radiological inspection permits assessment of defects related to known counterfeit

7、ing techniques in EEE devices. The inspection involves illuminating the sample with penetrating radiation and provides images based on variations in material density, thicknesses and atomic numbers. The technique allows for characterization of internal damage, defects, and degradation attributes suc

8、h as wire bond damage, inconsistent lead frames, die characteristics, and internal damage. The test is typically nondestructive for most part types immune to low levels of radiation, but could be destructive for some device types that are sensitive to radiation. DISCLAIMER: The images contained here

9、in are provided to illustrate the application of detection methods identified in the document, and are by no means intended to imply that a manufacturer identified in an image and text is involved with the suspect product. TABLE OF CONTENTS 1. SCOPE 3 2. REFERENCES 3 2.1 Applicable Documents 3 2.2 T

10、erms, Acronyms, and Definitions (as applicable) . 4 3. DESCRIPTION OF METHODOLOGY/PROCEDURE 4 3.1 Material Control . 4 3.1.1 Handling EEE Components 4 3.1.2 Data Exchange Format . 4 3.2 Description of Process 4 4. TEST EQUIPMENT REQUIREMENTS 7 5. REQUIREMENTS . 7 5.1 Sampling . 7 5.2 Categories of T

11、esting/Best Practices 7 5.2.1 Test Tier Level and Risk Definitions . 7 5.2.2 Recommended Best Practices 8 5.3 Testing Requirements . 8 5.3.1 Information from the User/Requester 8 5.3.2 Test Laboratory Requirements . 9 SAE INTERNATIONAL AS6171/5 Page 2 of 30 5.4 Counterfeit Detection Test Sequence .

12、9 5.5 Test Plan . 9 5.6 Analysis and Interpretation of Results 10 5.7 Test Report . 13 5.8 Training and Certification 14 5.8.1 Personnel 14 5.8.2 Laboratory/Test Facility . 18 5.8.3 Proficiency Requirements . 19 5.9 Data Retention Requirements . 19 6. NOTES 20 6.1 Revision Indicator 20 APPENDIX A SA

13、MPLE REPORT 21 APPENDIX B IQI AND LP . 27 APPENDIX C RADIATION EXPOSURE MITIGATION STRATEGIES . 29 FIGURE 1 AN ILLUSTRATION OF THE USE OF LINE PAIR GAUGE FOR SYSTEM CALIBRATION (COURTESY: MATRIX-FOCALSPOT) . 5 FIGURE 2 GENERIC DIAGRAM SHOWING A CROSS-SECTION OF A WIRE BONDED, PLASTIC ENCAPSULATED MI

14、CROCIRCUIT (COURTESY - UNIVERSITY OF MARYLAND, CALCE CENTER) . 6 FIGURE 3 REPRESENTATION OF A TYPICAL REAL-TIME RADIOLOGICAL INSPECTION SYSTEM (COURTESY CREATIVE ELECTRON INC.) 6 FIGURE 4 RADIOLOGICAL IMAGES OF TWO QFP PARTS. THE PART ON THE LEFT HAS A SHORTER DAMBAR THAN THE QFP PART SHOWN ON THE R

15、IGHT. ALTHOUGH THIS IS AN EXAMPLE OF A FAILED RADIOLOGICAL TEST, AUTHENTICITY CANNOT BE DETERMINED BASED ON THESE IMAGES ALONE. ADDITIONAL TEST METHODS SHALL BE USED FOR COMPLETE ASSESSMENT OF PART AUTHENTICITY. (COURTESY - UNIVERSITY OF MARYLAND, CALCE CENTER) 10 FIGURE 5 RADIOGRAPH ON THE LEFT SHO

16、WING A POOR SNR AND LACK OF ADEQUATE CONTRAST. RADIOGRAPH ON THE RIGHT SHOWS A CORRECTED SNR AND IMPROVED CONTRAST. (COURTESY - CREATIVE ELECTRON INC.) 11 FIGURE 6 RADIOGRAPH ON LEFT SHOWING A POOR CNR. RADIOGRAPH ON THE RIGHT SHOWS AN IMPROVED CNR. (COURTESY - CREATIVE ELECTRON INC.) . 11 FIGURE 7

17、RADIOGRAPH ON THE LEFT SHOWING AN UNCORRECTED GAIN AND OFFSET. RADIOGRAPH ON THE RIGHT SHOWING A CORRECTED GAIN AND OFFSET. (COURTESY - CREATIVE ELECTRON INC.) 12 FIGURE 8 RADIOGRAPH ON THE LEFT SHOWING AN INADEQUATE BRIGHTNESS RESOLUTION. RADIOGRAPH ON THE RIGHT SHOWING A CORRECTED BRIGHTNESS RESOL

18、UTION. (COURTESY - CREATIVE ELECTRON INC.) 12 FIGURE 9 RADIOGRAPH ON THE LEFT SHOWING A PART WITH BLURRED OUTLINE. RADIOGRAPH ON THE RIGHT SHOWING A PART WITH OPTIMIZED CONTRACT SETTINGS RESULTING IN A CLEARER OUTLINE. (COURTESY - CREATIVE ELECTRON INC.) 12 FIGURE 10 RADIOGRAPH SHOWING A ROW OF BAD

19、PIXELS (COURTESY - CREATIVE ELECTRON INC.) 13 SAE INTERNATIONAL AS6171/5 Page 3 of 30 1. SCOPE The intent of this document is to define the methodology for suspect parts inspection using radiological inspection. The purpose of radiology for suspect counterfeit part inspection is to detect deliberate

20、 misrepresentation of a part, either at the part distributor or original equipment manufacturer (OEM) level. Radiological inspection can also potentially detect unintentional damage to the part resulting from improper removal of part from assemblies, which may include, but not limited to, prolonged

21、elevated temperature exposure during desoldering operations or mechanical stresses during removal. Radiological inspection of electronics includes film radiography and filmless radiography such as digital radiography (DR), real time radiography (RTR), and computed tomography (CT). Radiology is an im

22、portant tool used in part verification of microelectronic devices. Radiographic analysis is performed on parts to verify that the internal package or die construction is consistent with an exemplar. In case an exemplar is not available, comparisons should be made within a homogenous sample populatio

23、n using the technical data available for that item. If AS6171/5 is invoked in the contract, the base document, AS6171 General Requirements shall also apply. 2. REFERENCES 2.1 Applicable Documents The following publications form a part of this document to the extent specified herein. The latest issue

24、 of SAE publications shall apply. The applicable issue of other publications shall be the issue in effect on the date of the purchase order. In the event of conflict between the text of this document and references cited herein, the text of this document takes precedence. Nothing in this document, h

25、owever, supersedes applicable laws and regulations unless a specific exemption has been obtained. a. NAS-410: National Aerospace Standard, “NAS CERTIFICATION QUALIFICATION OF NONDESTRUCTIVE TEST PERSONNEL”. b. ASNT SNT-TC-1A: American Society for Nondestructive Testing, “Recommended Practice for Per

26、sonnel Qualification and Certification of Nondestructive Testing”. c. EN 473: European Standard, “Qualification and Certification of NDT Personnel - General Principles”. d. ASD-STAN PREN 4179: AeroSpace and Defence Industries Association of Europe, “Qualification and approval of personnel for non-de

27、structive testing”. e. ISO 9712 “Non-destructive testing - Qualification and certification of personnel”. f. ASNT CP-189: American Society for Nondestructive Testing Standard for Qualification and Certification of Nondestructive Testing Personnel (2006) g. ASTM E1161: Standard Practice for Radiologi

28、c Examination of Semiconductors and Electronic Components h. ASTM E2339: Standard Practice for Digital Imaging and Communication in Nondestructive Evaluation (DICONDE) i. ASTM E1254: Standard Guide for Storage of Radiographs and Unexposed Industrial Radiographic Films j. ASTM E1453: Standard Guide f

29、or Storage of Magnetic Tape Media that Contains Analog or Digital Radioscopic Data k. MIL-STD-883: Method 2012 Radiography (Test Method for Microcircuits) l. MIL-STD-750: Method 2076 Radiography (Test Methods for Semiconductor Devices) m. MIL-STD-202: Test Method Standard, Electronic and Electrical

30、Component Parts SAE INTERNATIONAL AS6171/5 Page 4 of 30 2.2 Terms, Acronyms, and Definitions (as applicable) See 2.2 and 2.3 of AS6171 General Requirements. 3. DESCRIPTION OF METHODOLOGY/PROCEDURE 3.1 Material Control 3.1.1 Handling EEE Components Inspection of EEE components must be conducted follo

31、wing electrostatic discharge mitigation procedures as described in ANSI/ESD S20.20 (Protection of Electrical and Electronic Parts, Assemblies and Equipment), ANSI/ESD S6.1 (Grounding), and ANSI/ESD S4.1 (Work Surface-Resistance Measurements). Paragraph 3.9.5 (Device Handling Requirements) of AS6171

32、General Requirements provides additional guidelines on device handling. 3.1.2 Data Exchange Format 3.1.2.1 Data from User/Requester The User/Requester should supply the test lab with data as described in 5.3.1. 3.1.2.2 Data to User/Requester A report on radiological inspection of part verification s

33、hall include all the details as described in 5.7. 3.2 Description of Process 3.2.1 The radiological system should be prepared to expose the part to be examined. The system shall be operated per approved documented procedures, including the operators manual provided by the manufacturer. 3.2.2 Filters

34、 should be used to harden the X-ray beam to reduce total radiation dose to the device(s). 3.2.3 When inspecting a large assembly with many installed devices, such as a printed circuit board, areas that are not under examination should be masked with appropriate shielding. Prop appropriate shielding

35、up on blocks or other means so the weight of the shielding does not damage the assembly. 3.2.4 Prior to examination, a line pair (lp) gauge or other image quality indicator (IQI), representative quality indicator (RQI) shall be used to ensure that the system is operating at the proper resolution for

36、 the product being inspected. An IQI shall be imaged at the beginning of the examination of a lot of devices, and then re-image the same IQI at the end of the examination. IQIs or RQIs shall be imaged and verified with the full range of exposure settings (for example, when accelerating voltage is ch

37、anged during an examination to view multiple features, IQIs and RQIs shall be subject to those same settings). 3.2.5 Prepare the Component for Exposure a. To prepare a single component or a group of components for horizontally oriented exposure, ensure the table or fixture is level with respect to t

38、he X-ray head. This may be accomplished by using a multi-directional leveling device. b. When inspecting multiple trays or reels, the operator should ensure that every tray or reel is properly aligned and oriented. The orientation can be horizontal or vertical. c. To prepare a component for a vertic

39、ally oriented exposure, care needs to be taken to ensure the part is correctly oriented with respect to the X-ray aperture. Failure to do so could cause a distorted image. d. Setup the IQI per ASTM E1161. If the system in use has a calibrating function and the image to be taken will be used to verif

40、y a specific measurement, the system should be recalibrated prior to exposing the device for the radiograph. A line pair gauge may be used for calibration. An example of how a line pair gauge is used for calibration is shown in the Figure 1 (note that the 20 line pair per millimeter (lp/mm) shown in

41、 the example is for illustration purposes only). Multiple geometric magnifications may be required to inspect for the attributes described in 5.5, (a) - (n). SAE INTERNATIONAL AS6171/5 Page 5 of 30 Figure 1 - An illustration of the use of line pair gauge for system calibration (Courtesy: Matrix-Foca

42、lspot) e. To minimize effects of stray radiation on the image quality, it is good practice to use radiographically transmissive materials to construct any support or fixtures. 3.2.6 Select Appropriate X-ray Tube Parameters for Component Inspection a. Document the accelerating voltage and current set

43、tings to be used to accomplish the correct exposure rate for the size of component to be examined. Note: A low accelerating voltage will underexpose the radiograph while a much higher accelerating voltage will overexpose the radiograph. The operator should select the minimum value possible to obtain

44、 the required amount of radiographic detail. b. The use of an “Isowatt” or constant power type setting is recommended in systems that support such a feature. The use of this mode varies the current (in amperes) when the accelerating voltage is adjusted. This allows a setting which minimizes radiatio

45、n exposure to the device. 3.2.7 Manipulation of the Part under the Beam a. Inspection of attributes such as leadframe layout, die position, size and other items a-l identified in 5.5 require a “top-down” orientation. b. Appropriate magnification should be used. This magnification should allow acquis

46、ition of images that include outer extremities of device under test (DUT) and allow for determining lot homogeneity. c. High magnification inspection and minimum number of views will be determined by the geometry, complexity and radiation sensitivity of the DUTs. SAE INTERNATIONAL AS6171/5 Page 6 of

47、 30 d. For a side-view inspection on systems with either X-ray head or table mounting rotation in all three axes; the part may be manipulated to show the best angle and ensure consistent thickness of the die component and package thicknesses are consistent within the lot. Figure 2 shows a diagram of

48、 a typical plastic encapsulated microcircuit. e. Parts should be inspected for homogeneity, consistency, and uniformity. It is normal for there to be some variation across different date and lot codes but not normally in parts with the same date and lot code. It is recommended that additional inspec

49、tion be performed on parts that exhibit anomalies that are observed in radiological inspection. Some follow-up techniques could include additional visual inspection and acoustic microscopy. Silicon ChipDie Attach PaddleBond WireLeadframeEncapsulantDie AttachFigure 2 - Generic diagram showing a cross-section of a wire bonded, plastic encapsulated microcircuit (Courtesy - University of Maryland, CALCE Center) Figure 3 - Representation of