REG NASA-LLIS-1315-2002 Lessons Learned Increasing ESD Susceptibility of Integrated Circuits (2002).pdf
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1、Lessons Learned Entry: 1315Lesson Info:a71 Lesson Number: 1315a71 Lesson Date: 2002-11-01a71 Submitting Organization: JPLa71 Submitted by: R. Kemski/ D. OberhettingerSubject: Increasing ESD Susceptibility of Integrated Circuits (2002) Abstract: ESD susceptibility remains a pressing reliability issue
2、 in IC design due to the continually decreasing feature size and the increasing vulnerability to voltages that are much lower than human sensory perception thresholds.Characterize the expected ESD levels and the susceptibility of ICs in the specific circuit prior to use (e.g., Human Body Model, Mach
3、ine Model, and/or Charged Device Model). Base facility ESD control measures on the most ESD sensitive device to be protected. Description of Driving Event: Electrostatic discharge (ESD) susceptibility remains a pressing reliability issue in integrated circuit (IC) design. The continually decreasing
4、feature size associated with modern electronic devices now makes them increasingly prone to ESD induced damage during handling and use. To obtain greater processing speed and to pack more circuitry into small packages, average feature sizes for IC packages today are about half the size of those in 1
5、995, and they are expected to decrease by 50% again by 2007. As the size of features and the width of conductors shrink, the decreased spacing in the circuitry reduces electrical isolation. A discharge of only a few volts can produce enough heat to burn through microelectronic features on the order
6、of 0.1 micron.In addition to microcircuits, many discrete semiconductor devices (e.g., transistors, diodes) are vulnerable to voltages that are much lower than human sensory perception thresholds (3,000 volt static charge). The ESD control measures that are in general use by industry involve (1) pre
7、venting ESD from occurring by employing proper grounding and handling procedures during manufacturing and use, and (2) installing on-chip ESD protection circuitry. However, the effectiveness of ESD protection circuits also tends to decrease with decreasing device dimensions. Industry is employing Pr
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