REG NASA-HDBK-8739 23 W CHG 1-2011 NASA COMPLEX ELECTRONICS HANDBOOK FOR ASSURANCE PROFESSIONALS.pdf
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1、NASA HANDBOOK NASA-HDBK 8739.23 Baseline with Change 1 National Aeronautics and Space Administration Washington, DC 20546 Baseline approved: 2011-02-16 Change 1 approved: 2011-03-29 NASA COMPLEX ELECTRONICS HANDBOOK FOR ASSURANCE PROFESSIONALS Measurement System Identification: Metric APPROVED FOR P
2、UBLIC RELEASE DISTRIBUTION IS UNLIMITED Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-NASA-HDBK 8739.23 with change 1 2 of 143 Mars Exploration Rover (2003) Provided by IHSNot for ResaleNo reproduction or networking permitted without license from I
3、HS-,-,-NASA-HDBK 8739.23 with change 1 3 of 143 DOCUMENT HISTORY LOG Status Document Revision Approval Date Description Baseline 2011-02-16 Initial Release (JWL4)Change 1 2011-03-29 Editorial correction to page 2 figure caption (JWL4)This document is subject to reviews per Office of Management and B
4、udget Circular A-119, Federal Participation in the Development and Use of Voluntary Standards (02/10/1998) and NPR 7120.4, NASA Engineering and Program/Project Management Policy. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-NASA-HDBK 8739.23 with
5、change 1 4 of 143 This page intentionally left blank. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-NASA-HDBK 8739.23 with change 1 5 of 143 FOREWORD This NASA Handbook (NASA-HDBK) is approved for use by NASA Headquarters and NASA Centers, includin
6、g Component Facilities. This NASA-HDBK may be applied on contracts per contractual documentation as a reference or training publication. Comments and questions concerning the contents of this publication should be referred to the National Aeronautics and Space Administration, Director, Safety and As
7、surance Requirements Division, Office of Safety and Mission Assurance, Washington, DC 20546. Requests for information, corrections, or additions to this NASA-HDBK shall be submitted via “Feedback” in the NASA Technical Standards System at http:/standards.nasa.gov or to National Aeronautics and Space
8、 Administration, Director, Safety and Assurance Requirements Division, Office of Safety and Mission Assurance, Washington, DC 20546. s/ Bryan OConnor February 16, 2011 Bryan OConnor Approval Date Chief, Safety and Mission Assurance The Office of Safety and Mission Assurance would like to recognize K
9、alynnda Berens and Richard Plastow for their work in authoring this publication. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-NASA-HDBK 8739.23 with change 1 6 of 143 This page intentionally left blank. Provided by IHSNot for ResaleNo reproduction
10、 or networking permitted without license from IHS-,-,-NASA-HDBK 8739.23 with change 1 7 of 143 TABLE OF CONTENTS CHAPTER 1. Overview . 11 1.1 Purpose 11 1.2 Scope . 11 1.3 Anticipated Audience 12 1.4 Handbook Layout 12 CHAPTER 2. Reference Documents and Links 13 2.1 Reference Documents 13 2.2 Links
11、14 CHAPTER 3. Definitions and Acronyms . 15 3.1 Definitions . 15 3.2 Acronyms 20 CHAPTER 4. Complex Electronics Overview 23 4.1 Blurring the Hardware/Software Line . 23 4.2 Programmable versus Designable Devices . 25 4.3 Simple Programmable Logic Devices . 27 4.4 Complex Programmable Logic Devices (
12、CPLD) 28 4.5 Field Programmable Gate Array (FPGA) 30 4.6 Application Specific Integrated Circuit (ASIC) 30 4.7 System-on-Chip (SoC) 30 4.8 Concerns and Issues 31 4.9 Summary . 32 CHAPTER 5. Design Process 33 5.1 Overview of the Complex Electronics Design Process . 33 5.2 Requirements and Specificati
13、ons 36 5.3 Design Entry 37 5.4 Abstraction 40 5.5 Hardware Description Languages . 42 5.6 Programming Example 48 5.7 Synthesis 48 5.8 Implementation 53 5.9 Verification 58 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-NASA-HDBK 8739.23 with change
14、1 8 of 143 CHAPTER 6. Process Assurance 64 6.1 Process Assurance Overview 64 6.2 Identifying Complex Electronics . 67 6.3 Process Assurance Activities . 69 CHAPTER 7. Future Trends 79 7.1 Changes in Complex Electronics Design and Verification . 79 7.2 Into the Not so Distant Future . 81 7.3 NASA Ass
15、urance Changes 83 APPENDIX A Examples . 85 A.1 CPLD . 85 A.2 FPGA . 89 A.3 ASIC 95 A.4 SoC 101 A.5 Reconfigurable Computing . 107 APPENDIX B Coding Style Guidelines 112 B.1 Introduction . 112 B.2 Top-Down Design . 112 B.3 Signals and Variables 119 B.4 Packages 122 B.5 Technology-Specific Code (Xilin
16、x) 126 B.6 Coding for Synthesis . 135 LIST OF TABLES Table 1: Complex Electronics Examples . 26 Table 2: Simple PLD Comparisons . 28 Table 3: CE vs. SW Development Phases . 35 Table 4: VHDL vs. Verilog 46 Table 5: FPGA vs. ASIC Comparison . 57 Table 6: Requirement Verification Activities 59 Table 7:
17、 Design Entry Verification Activities . 60 Table 8: Design Synthesis Verification Activities . 60 Table 9: Implementation Verification Activities . 61 Table 10: Testing Verification Activities . 62 Table 11: Simple Complexity Guidelines 68 Provided by IHSNot for ResaleNo reproduction or networking p
18、ermitted without license from IHS-,-,-NASA-HDBK 8739.23 with change 1 9 of 143 LIST OF FIGURES Figure 1: How Complex Electronics Compares 23 Figure 2: Example of PAL Structure . 27 Figure 3: CPLD vs. FPGA Layout 29 Figure 4: SoC Example Configuration 31 Figure 5: CE vs. SW Life Cycles 33 Figure 6: E
19、xample CE Waterfall Development 34 Figure 7: Complex Electronics Design Views 39 Figure 8: Complex Electronics Domains 41 Figure 9: Warning Buzzer Example 41 Figure 10: General HDL Development . 45 Figure 11: AOI VHDL to Verilog Comparison 51 Figure 12: External Programmer . 56 Figure A-1 CPLD . 85
20、Figure A-2 FGPA . 89 Figure A-3 ASIC 95 Figure A-4 ASIC Die 96 Figure A-6 Reconfigurable SoC . 103 Figure A-7 ChipSat OBC . 106 Figure B-1 Behavioral Code 112 Figure B-2 Structural Code 113 Figure B-3 One Line Per Signal/Named Association 114 Figure B-4 Header Template 115 Figure B-5 Process, Functi
21、on, and Procedure Header . 115 Figure B-6 Inline Comments 115 Figure B-7 Proper Indentation 116 Figure B-8 Confusing _in and _out suffixes 118 Figure B-9 Internal Signals Representing Output Ports . 118 Figure B-10 Correct Use of Variables. 121 Figure B-11 Incorrect Use of Variables 122 Figure B-12
22、A Constant Guiding the Generation of Logic . 123 Figure B-13 Address Width Defined by a Constant 124 Figure B-14 Modular Function Use 125 Figure B-15 Use of Types and Aliases . 126 Figure B-16 Three-state Implementation of 4:1 Multiplexer . 129 Figure B-17 Xilinx LUT-RAM Inference 130 Figure B-18 LU
23、T-ROM Inference . 130 Figure B-19 Virtex Block RAM inference . 131 Figure B-20 Clock Enable Inference 133 Figure B-21 Inference of Xilinx Shift Register LUT (SRL) 134 Figure B-22 Local Asynchronous Reset and TC to process sound, video, and images in various ways; and to understand data from sonar, r
24、adar, and seismological readings. Electrically-Erasable Programmable Read-Only Memory (EEPROM): A memory device whose contents can be electrically programmed by the designer. Additionally, the contents can be electrically erased allowing the device to be reprogrammed. Electro-Static Discharge (ESD):
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