1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED C Redrawn with changes. Add device types 04 and 05. Add case outline H. Editorial changes throughout. 94-03-04 M.A. Frye D Add device types 06 and 07. Table I changes. Editorial changes throughout. 95-01-18 M.A. Frye E Changes in accordance with NO
2、R 5962-R037-96. 96-01-11 M.A. FryeF Changes in accordance with NOR 5962-R072-96. 96-03-15 M.A. Frye G Update boiler plate and incorporate previous 2 NORs. Redrawn. Updated bulletin. -lgt 98-06-26 R. Monnin H Add figure 1 so that a change to symbol “A” dimension can be specified under case outline le
3、tter H. - ro 03-07-25 R. Monnin THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV H H SHET 15 16 REV STATUS REV H H H H H H H H H H H H H H OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT D
4、RAWING CHECKED BY CHARLES E. BESORE COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, SINGLE POWER MOSFET DRIVER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-08-
5、16 AMSC N/A REVISION LEVEL H SIZE A CAGE CODE 67268 5962-88770 SHEET 1 OF 16 DSCC FORM 2233 APR 97 5962-E452-03 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD
6、MICROCIRCUIT DRAWING SIZE A 5962-88770 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL H SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-3853
7、5, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88770 01 H X Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Dev
8、ice type Generic number Circuit function Output 01 TSC429 Inverting power MOSFET driver 4.5 A dc 02 TSC4429 Inverting power MOSFET driver 4.5 A dc 03 TSC4420 Noninverting power MOSFET driver 4.5 A dc 04 MIC4451 Inverting hi speed, hi current MOSFET driver 12 A dc 05 MIC4452 Noninverting hi speed, hi
9、 current MOSFET driver 12 A dc 06 MIC44R21 Inverting, rad hardened MOSFET driver 9 A dc 07 MIC44R22 Noninverting, rad hardened MOSFET driver 9 A dc 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package sty
10、le H See figure 1 10 Flat pack P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (VS). 20 V dc Input voltage range (VIN) : Device 01 VS+ 0.3 V
11、 dc to GND - 0.3 V dc Devices 02, 03, 04, 05 VS+ 0.3 V dc to GND - 5.0 V dc Output current (per pin, capacitance load) : Devices 01 03 6.0 A dc Devices 04 05 12.0 A dc Devices 06 07 9.0 A dc Peak supply current or GND current (per pin) : Devices 01 03 6.0 A dc Devices 04 05 12.0 A dc Devices 06 07 9
12、.0 A dc Storage temperature range -55C to +125C Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88770 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL H SHEET 3 DSCC FORM 2234 APR 97 1.
13、3 Absolute maximum ratings - continued. Power dissipation (PD) : Case outline H 650 mW 1/ Case outline P 800 mW 2/ Case outline 2 1.8 W 3/ Lead temperature (soldering, 10 seconds) +300C Junction temperature range (TJ) -55C to +150C 1.4 Recommended operating conditions. Supply voltage range . 4.5 V d
14、c VS 18 V dc Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issu
15、es of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDA
16、RDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise in
17、dicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited here
18、in, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Derate linearly at 6.5 mW/C above TA= +50C. 2/ Derate linearly at 8 mW/C above TA= +50C. 3/ Derate linearly at 18 mW/C abov
19、e TA= +50C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88770 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL H SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements.
20、 The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has b
21、een granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications
22、 to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 D
23、esign, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein and figure 1. 3.2.2 Terminal connections. The terminal connec
24、tions shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The elec
25、trical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacture
26、rs PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicato
27、r “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certifi
28、cate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the r
29、equirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change t
30、o DSCC-VA shall be required in accordance with MIL-PRF-38535, appendix A. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at
31、 the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88770 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL H SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical p
32、erformance characteristics. Test Symbol Conditions -55C TA+125C 4.5 VS 18 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max Logic “1” input voltage VIH1, 2, 3 01-05 2.4 V 06, 07 3.5 Logic “0” input voltage VIL1, 2, 3 01-05 0.8 V 06, 07 2.0 Input voltage range VIN(max) 1,
33、 2, 3 01 0 VSV 1, 2, 3 02, 03 04, 05 -5 VS+0.3 Input current IIN0 V VIN VS1 ALL 1 A 2, 3 10 -5 V VIN 0 V 1, 2, 3 02, 03, 07 10 mA High output voltage VOHRL= 1/ 1, 2, 3 ALL VS- 25 mV V Low output voltage VOLRL= 1/ 1, 2, 3 ALL 25 mV Output resistance RO1VS= 18 V, VIN= 0.8 V, 1 01, 03 2.5 IOUT= 10 mA 2
34、, 3 5.0 1 02 2.8 2, 3 5.0 1 04, 05 1.5 2, 3 2.2 1 06, 07 2.5 2, 3 3.6 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88770 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5
35、000 REVISION LEVEL H SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TA+125C 4.5 VS 18 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max Output resistance RO2VS= 18 V, VIN= 2.4 V, 1 01, 02 2.5 IOUT= 1
36、0 mA 2, 3 5.0 1 03 2.8 2, 3 5.0 1 04, 05 1.5 2, 3 2.2 VS= 18 V, VIN= 3.5 V, 1 06, 07 1.7 IOUT= 10 mA 2, 3 2.7 Quiescent supply current IS1VIN= 3.0 V 1 01 5.0 mA 2, 3 12 1 02, 03 04, 05, 1.5 2, 3 06, 07 3.0 IS2VIN= 0.0 V 1 01 0.5 2, 3 1.3 1 02, 03 0.15 2, 3 0.40 1 04, 05, 0.15 2, 3 06, 07 0.4 See foo
37、tnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88770 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL H SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical perfor
38、mance characteristics - Continued. Test Symbol Conditions -55C TA+125C 4.5 VS 18 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max Rise time tRVS= 18 V, CL= 2500 pF 2/ 9 01 35 ns see figures 3 and 4 10, 11 70 9 02, 03 35 10, 11 60 VS= 18 V, CL= 15,000 pF, 2/ 9 04, 05 75
39、see figures 3 and 4 10, 11 100 VS= 18 V, CL = 10,000 pF, 2/ 9 06, 07 75 see figures 3 and 4 10, 11 120 Fall time tFVS= 18 V, CL= 2500 pF 2/ 9 01 35 ns see figures 3 and 4 10, 11 70 9 02, 03 35 10, 11 60 VS= 18 V, CL= 15,000 pF, 2/ 9 04, 05 75 see figures 3 and 4 10, 11 100 VS= 18 V, CL = 10,000 pF,
40、2/ 9 06, 07 75 see figures 3 and 4 10, 11 120 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88770 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL H SHEET 8 DSCC FORM 2234 APR 97 TABL
41、E I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TA+125C 4.5 VS 18 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max Delay time tD1VS= 18 V, 2/ 9 01, 02 03 75 ns see figures 3 and 4 10, 11 100 9 04, 05, 60 10, 11 06, 07 80 tD29 01 75 1
42、0, 11 120 9 02, 03 75 10, 11 100 9 04, 05, 60 10, 11 06, 07 80 1/ Guaranteed by design. 2/ Subgroups 10 and 11 are guaranteed if not tested to the limits as specified in table I herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCI
43、RCUIT DRAWING SIZE A 5962-88770 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL H SHEET 9 DSCC FORM 2234 APR 97 Case outline H Configuration A - metal-sealed, bottom brazed leads FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted with
44、out license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88770 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL H SHEET 10 DSCC FORM 2234 APR 97 Case outline H Configuration B - Ceramic, glass sealed FIGURE 1. Case outline Continued. Provided by IHSNot for ResaleNo r
45、eproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88770 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL H SHEET 11 DSCC FORM 2234 APR 97 Case outline H FIGURE 1. Case outline Continued. Provided by IHSNot for ResaleNo r
46、eproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88770 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL H SHEET 12 DSCC FORM 2234 APR 97 1/ Configuration A and B Symbol Min Max Note A .045 .105 b .010 .022 b1 .010 .019
47、2 c .004 .009 c1 .004 .006 2 D - .280 3 E .240 .260 E1 - .300 3 E2 .125 - E3 .030 - 7 e .050 BSC k .008 .015 2 L .250 .370 Q .026 .045 9 S1 .005 - 6 M - .0015 2 N 10 NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the sh
48、aded area shown. The manufacturers identification shall not be used as a pin one identification mark. Alternatively, a tab (dimension k) may be used to identify pin one. This tab may be located on either side of terminal one as shown in detail A, or it may be located on terminal one as shown in detail B. 2. If a pin one identif
