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    DLA SMD-5962-88599-1988 MICROCIRCUITS DIGITAL CMOS TIMING CONTROL UNIT MONOLITHIC SILICON《硅单片时序控制组件互补型金属氧化物半导体数字微电路》.pdf

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    DLA SMD-5962-88599-1988 MICROCIRCUITS DIGITAL CMOS TIMING CONTROL UNIT MONOLITHIC SILICON《硅单片时序控制组件互补型金属氧化物半导体数字微电路》.pdf

    1、f LTR DESCRIPTION DATE (YR-W-M) APPROVED REV SHEET REV SHEFI REV STATUS OF SHEETS I I REV SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 PMIC NIA 16 17 18 STANDARDIZED MILITARY DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE PREPAREDBY DEFENSE ELECTR

    2、ONICS SUPPLY CENTER DAYTON, OHIO 45444 CHECKED BY 67268 15962-88599 REVISION LEVEL AMSC NIA I I SHEET 1 OF 18 DESC FORM 193 SEP 87 t U.S. GOYtWNl PRIHTING OfFlCE: I987 - 748.12916091 1 5962-E836 DISTRIBUTION STATEMENT A. Approved lor public release; distribution is unlimied. Provided by IHSNot for R

    3、esaleNo reproduction or networking permitted without license from IHS-,-,-_ I I_I_ DESC-DWG-88597 57 W 9979975 0033045 4 a - 1. SCOPE 1.1 SCO e. This drawing describes device requirements for class B microcircuits in accordance rith 1.I I I I I 1 I I I i i i I 4 4 i 1 I I 1 I I I I I I 1 I I Lim i M

    4、in 2.4 2.0 .8 4.275 -20 - i -I i i I -f -I i. 1 I I I I I I I I I I 7 I I I I I I ts I Unit Max I I I IV .8 I V I I 3.5 I v I 1.9 I v I I IV .525l V i I VA I I .5251 V I +20 I VA i .5251 V I I I I I I I I I I I I I I I I I I I 1,293 I 3.8 I IV IVOH II = Output high voltage All outputs except OUT STA

    5、NDARDIZED SIZE I MILITAM DRAWING A 5962-88599 1 I DEFENSE ELECTRONICS SUPPLY CENTER REVWON LEVEL SHEET MUON, OHIO 45444 4 * U S. GWERNMENT PRINTING OFFCE 1987-549496 DESC FORM 193A SEP 87 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DESC-DWG-88577

    6、 57 I 7777775 0013048 T CTANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON. OH0 45444 TABLE I. Electrical performance characteristics - Continued. I I I I I )subgroups- l I Vcc = 5.07 *5% I I Min I Max I I Il I I I unless otherwise specified I I I I I I Three-state leakage curren

    7、t IIZH IForce 5.25 V on outputs, I 1,2,3 I I +20 I UA high Il MHz I I I I I Three-state leakage current /IL IForce 0.4 V on outputs, I NA 1 ow ll MHz I I I I I I I IFin = 10 MHz I I I I I I I I I I Test ISymbol I Condi ti ons 21 I Group A I Limits I Unit -55C 5 TC +125C I 1,2,3 I -20 I Supply curren

    8、t IIcc IA11 outputs high I 1,2,3 I I 200 I mA 141 I 50 I PF 141 I 40 i PF I I I I I I i 40 i pF 141 I I I I C1 ock capacitance ICCLK I 21 I I Clock period ItCp PHI1 rising edge, to next I 9,10,11 I 100 I I ns I 7 IPHI1 rising edge I I I I I I 190 percent PHI1 rising edge, I 9,10,11 I 35 I 47 I ns o

    9、90 percent PHI1 rising I I I I I I edge I I l I C1 ock high time I I 9 Ito 10 percent PHI1 rising I I I I I I edge I I I I I 10 I I I I I l I I I I I I I I I I I I I I I I 11 I input) I 1 12.5 V XIN falling edge I I I I I I I I I I input) I 2 12.5 V XIN rising edge I I I del ay I 3 to FCLK rising ed

    10、ge I I I I I IC0 I Y I I I I Output capacitance Input capacitance ICI I Y ftCL$ It Clock low time ItcL1 Il0 percent PHI1 falling edge,( 9,10,11 I 43 I 60 I ns I Clock pulse width ItCLW1 (At 2.0 V on PHI1 (both edges11 9,10,11 I 40 I 52 I ns Clock pulse width Itc-wp IAt 2.0 V on PHI2 (both edges11 9,

    11、10,11 I 40 I 52 I ns XIN high time (external ItXh 12.5 V XIN rising edge to I 9,iO,ii I 16 I I ns XIN low time (external Itxi 12.5 V XIN falling edge to 1 9,10,11 I 16 I I I I I I I I 3 I 29 I ns I I I I f 9y10,11 XIN to FCLK rising edge ltXFr 12.5 V XIN rising edge See footnotes at end of table. SI

    12、ZE A 5962-88599 REVISION LEVEL SHEET 5 I I I - U.S.GOVERNMENTPRINTINGOFFffiE 1987-549098 DESC FORM 193A SEP a7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DESC-DWG-8577 57 - 7777775 0013047 1 TABLE 1. Electrical performance characteristics - Cont

    13、inued. I Test I I Symbol I . Conditions 2/ I Group A I unless otherwise specified I I I I to FCLK fa1 1 i ng edge I I -55C 5 TC tl75“C VCC = 5-03 *5% i/ I -1 tXF to 30 percent or 70 percent of Vcc on all the CMOS input signals, and to 0.8 V or 2.0 V on all the TTL input signals, unless specifically

    14、stated otherwise. g/ The capacitance measurements shall be made between the indicated termlnal and ground at a frequency of 1 MHz at TC of +25C. t0.1 V. The ac signal amplitude shall be less than 50 mV rms. I 35 I (slave) I I I I The dc bias of the measuring instrument shall be less than DUC FORM 19

    15、3A SEP 87 f7 U.S.GOMRNMENT PRINTING OFFffiE 1987-549098 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DESC-DWG-4577 57 7997795 0013051 T Device type O1 Case J 6 7 RSTO 8 PHIl II FIGURE 1. Terminal connections. SIZE A 5962-88599 STAN DARDI ZED MILIT

    16、ARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OH10 45444 *us f;oviRhHIYTrRlflh(; nibirF: t987.7uI-ln-fmu DESC FORM 193A SEP 87 _-I- -CS= - -. _- _- Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DESC-DWG-8577 57 W 777777

    17、5 0023052 2 W SIZE A STANDARDIZED 71-i I 1 5962-88599 ADS ODIN PER - DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL WAIT 4 WAIT2 WAIT I SHEET 9 FIGURE 2. Functional block diagram. f CLK PHI2 PHI1 CTTL . RSTO RD WE WO ROY . Provided by IHSNot for ResaleNo reproduction or networki

    18、ng permitted without license from IHS-,-,-a DUTOUTPUTO W v R1 = 1.90 kn R2 = 4.5 ka CL = 50 pF on RDY, W, Ts6, CTTL CL 75 pF on FR, RD CL = 100 pF on FCLK CL = 170 pF on PHIl, PH12 CL = includes all stray capacitance. - cLT - I - - OUTPUT LOAD CIRCUIT FOR AC, FUNCTIONAL, AND THREE- STATE TESTS HIGI

    19、2w* VIL PROGRAMMABLE LOAD CIRCUIT FOR AC, FUNCTIONAL, AND T H RE E - STAT E TESTS FIGURE 3. Switching test circuits and wavefoms. SIZE A. 5962-88599 STANDARDIZED MILiTARY DRAWING DEFENSE ELECTROC.IICC SUPPLY CENTER REVISION LEVEL SHEET DAYTON, OHIO 45444 10 IESC FORM 193A SEP 87 Provided by IHSNot f

    20、or ResaleNo reproduction or networking permitted without license from IHS-,-,-XIN FCL K CTTL PHI I PHI2 STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OH0 45444 DESC FORM 193A SEP 87 CLOCK SIGNALS i FIGURE 3. Switching test circuits and waveforms - Continued. Provided by IHS

    21、Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-I_-._- _I_- - I_-. - DESC-DWG-8577 57 m 7777775 0013055 7 M PHIl PH12 TC0 - WR - RD DeE -+Il- CONTROL OUTPUTS (PERIPHERAL CYCLE FIGURE 3. Switching test circuits and waveforms - Continued. SIZE A 5962-88599 STANDARD1

    22、ZED MILITARY DRAWING MFENSE ELECTRONES SUPPLY CENTER REVISION LEVEL SHEET 12 DAYTON, OHIO 45444 )% FORM 193A SEP 87 . Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-F DESC-DWG-8579 57 7777775 0033056 7 W - 7-7 /7 /“7 7- PH1 I PHI2 TSO - RD WR _I - D

    23、BE r PHIl - e- - _- c - F - 4- - RST I - RST O ADC - DDI N /-/ +t - J- - o 7) 7 _- - r - c! I l SIZE A STANDARDIZU) CONTROL INPUTS 5962-88599 / “ -. .- Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-PHI I PH12 CWAIT RDY PHI I PH12 CWAIT WAIT n R DY

    24、TI Th I(flrst) TH,(last) T2 SUBSEQUENT WAIT STATE _-_- I :, * j-4 -_- RDY REMAINS LOW FOR SUBSEQUENT WAIT CYCLE HWD TCS OR TW“ T3 *y&- WAIT STATE (FAST CYCLE) TI T2 TDO TOI TD2 TCWRTWmTD3TW 13 T4 PHI I PH12 OR WAIT n PER R DY CWAIi WAIT STATE (PERIPHERAL CYCLE 1 FIGURE 3. Switching test circuits and

    25、 waveforms - Continued. STPrNDARDtZED MILITARY DRAWING I MFWSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 A I 5962-88599 I SHEET 14 I REVISION LEVEL DESC FORM 193A SEP 87 .- f- Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-. . . - - - . t- SYNCHR

    26、ONIZATION TIMING SIZE A 5962-88599 STANDARDIZED MILITARY DRAWING REVISION LEVU SHEET ,5 DEFENSE ELECTRONICS SUPPLY CENTER DAYION, OHIO 45444 c DESC FORM 193A SEP 87 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-I_ I_ - -I- DESC-DWG-8577 57 W 777777

    27、5 0013057 4 M 3.7 Notification of change. Notification of change to DESC-ECS shall be required in accordance ith MIL-STO-883 ( see 3.1 herein) . 3.8 Verification and review. DESC, DESCs agent, and the acquiring activity retain the option to eview theity and applicable required documentation. Offshor

    28、e documentation hall be made available onshore at the option of the reviewer. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with 4.2 Screening. ection 4 of MIL-M-38510 to the extent specified in MIL-STD-883 (see 3.1 herein). on

    29、ducted on all devices prior to quality conformance inspection. The following additional criteria hall apply: Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition D using the circuit submitted with the certifica

    30、te of compliance (see 3.5 herein). (2) TA = +125OC, minimum. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer, b. 4.3 Quality conformance inspection. Qu

    31、ality conformance inspection shall be in accordance with iethod 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional :riteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5 and 6 in table I, method 5005 of

    32、 MIL-STD-883 shall be omitted. c. Subgroup 4 (CI, C , CCLK measurements) shall be measured only for the initial test and after process or iesign changes which may affect input capacitance. d. Subgroups 7 and 8 shall consist of verifying the functionality of the device. part of the vendors test tape

    33、and shall be maintained and available from the approved It forms a sources of supply. 4.3.2 Groups C and D inspections. a. b. End-point electrical parameters shall be as specified in table II herein. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) (2) TA = +125“C, minimum. (3) Tes

    34、t duration: Test condition D using the circuit submitted with the certificate of compliance 3.5 herein). 1,000 hours, except as permitted by method 1005 of MIL-STD-883. see SIZE A 5962-88599 STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER REM LEVEL CHEET DAYTON, WK) 45444 16 ESC FORM

    35、 193A I!? U S. GOVERNMENT PRNTUIG OFFNE 1887-549088 SEP 87 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DESC-DWG-579 57 m 7777775 ililL306il il m . TABLE II. Electrical test requirements. a. Microcircuits covered by this drawing will replace the s

    36、ame generic device covered by a contractor-prepared specification or drawing. b. When a QPL source is established, the part numbered device specified in this drawing will be replaced by the microcircuit identified as part number M38510/55201. 6.3 Conents. Comments on this drawing should be directed

    37、to DESC-ECS, Dayton, Ohio 45444, or telephone 513-296-5375. 1 I I i MIL-STD-883 test requirements i Subgroups i I (per method I I 5005. table Il I I I I I I (method 5004) I I I IFinal electrical test parameters I 1*, 2, 3, 7, I I (method 5004) I 8, 9, 10, 11 I I interim electrical parameters I 1 I I

    38、 I I I Group A test requi remen ts I 1, 2, 3, 4, 7, I I (method 5005) I 8, 9, 10, 11 I 1 Groups C and D end-point i 2, 8A, 10 i I electrical parameters I I I (method 5005) I I * PDA applies to subgroup 1. 5. PACKAGING I 5.1 Packaging requirements. The requirements for packaging shall be in accordanc

    39、e with MIL-M-38510. I I 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for OEM application. by this drawing has been qualified

    40、for listing on QPL-38510, the device specified herein will be inactivated and will not be used for new design. The QPL-38510 product shall be the preferred item for all applications. When a military specification exists and the product covered I 6.2 Replaceability. Replaceability is determined as fo

    41、llows: J . - Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-6.4 Approved source of supply. An approved source of supply is listed herein. Additional iourtes will be added as they become available. The vendor listed herein has agreed to this drawing

    42、ind a certificate of compliance (see 3.5 herein) has been submitted to DESC-ECS. 1 I I I l I Military drawing I Vendor I Vendor I Rep1 acement I I part number I CAGE I similar part Imilitary specification1 I number I number L/ I part number I I I I I I I I I I I I I 5962-8859901JX I 27014 I NS32C201

    43、D10/883 I MIL-M-38510/55201BJX I I I I I I 1/ Caution. Do not use this number for item acquisition. Items acquired - TTETE number may not satisfy the performance requirements of this drawing, Vendor CAGE number 27014 Vendor name and address National Semiconductor Corporati on 2900 Semiconductor Driv

    44、e Santa Clara, CA 95051 SIZE A 5962-88599 STANDARDIZED MILmARY DRAWING DEFENCE UECTRONICC SUPPLY CENTER lEwstoN LEYEL SHEET I DAYTON, QHH) 45444 18 T!7 US. GOMRNYENTPRHTINGOFFICE l-7-%WH DESC FORM 193A SEP 87 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-


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