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    DLA DSCC-VID-V62 08614-2008 MICROCIRCUIT DIGITAL CMOS 9-CHANNEL DIFFERENTIAL TRANSCEIVER MONOLITHIC SILICON《单片硅9通道差动收发器CMOS数字微电路》.pdf

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    DLA DSCC-VID-V62 08614-2008 MICROCIRCUIT DIGITAL CMOS 9-CHANNEL DIFFERENTIAL TRANSCEIVER MONOLITHIC SILICON《单片硅9通道差动收发器CMOS数字微电路》.pdf

    1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE 18 19 REV REV STATUS OF PAGES PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 PMIC N/A PREPARED BY Charles F. Saffle DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Original

    2、 date of drawing CHECKED BY Charles F. Saffle APPROVED BY Thomas M. Hess TITLE MICROCIRCUIT, DIGITAL, CMOS, 9-CHANNEL DIFFERENTIAL TRANSCEIVER, MONOLITHIC SILICON SIZE A CODE IDENT. NO. 16236 DWG NO. V62/08614 YY MM DD 08-04-02 REV PAGE 1 OF 19 AMSC N/A 5962-V021-08 Provided by IHSNot for ResaleNo r

    3、eproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/08614 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance 9-Channel differential transceiver microc

    4、ircuit, with an operating temperature range of -55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentation: V6

    5、2/08614 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 SN75976A-EP 9-Channel differential transceiver 1.2.2 Case outline(s). The case outline(s) are as specified herein. Outline letter Num

    6、ber of pins JEDEC PUB 95 Package style X 56 MO-153 Plastic small-outline 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator Material A Hot solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash pal

    7、ladium Z Other Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/08614 REV PAGE 3 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) . -0.3 V dc to +6 V dc

    8、2/ Bus voltage range . -10 V dc to +15 V dc Data I/O and control (A side) voltage range -0.3 V dc to VCC+ 0.5 V dc Maximum receiver output current (IO) 40 mA Electrostatic discharge: B side and GND, Class 3, A 12 kV 3/ B side and GND, Class 3, B 400 V 3/ All terminals, Class 3, A. 4 kV All terminals

    9、, Class 3, B. 400 V Storage temperature range (TSTG). -65C to 150C Continuous total power dissipation (PD): 4/ Case outline X: TA 25C 2500 mW TA= 70C 1600 mW Operating factor above TA= 25C. 20 mw/C 5/ Package thermal characteristics: Case outline X: Junction-to-ambient thermal resistance (RqJA). 50C

    10、/W 6/ 7/ Junction-to-case thermal resistance (RJC). 27C/W 7/ Thermal-shutdown junction temperature (TJS) 165C 7/ 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.75 V dc to 5.25 V dc Minimum high level input voltage (VIH) (except nB+, nB-) . 2 V 8/ Maximum low level input voltage

    11、 (VIL) (except nB+, nB-) 0.8 V 8/ Voltage at any bus terminal (separately or common-mode), (VO, VI, or VIC) (nB+ or nB-) . -7 V dc min to 12 V dc max 8/ Maximum high-level output current (IOH): Driver. -60 mA Receiver -8 mA Maximum low-level output current (IOL): Driver. 60 mA Receiver 8 mA Operatin

    12、g free-air temperature range (TA). -55C to +125C 1/ Stresses beyond those listed under “absolute maximum rating” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended

    13、operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2/ All voltage values are with respect to the GND terminals. 3/ This absolute maximum rating is tested in accordance with MIL-STD-883, method 3015.7. 4/ The maximum

    14、 operating junction temperature is internally limited. 5/ This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no air flow. 6/ Board-mounted, no air flow. 7/ This value is not a maximum limit, but a typical value based upon specified conditions. 8/ n = 1 9. P

    15、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/08614 REV PAGE 4 2. APPLICABLE DOCUMENTS JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices (Ap

    16、plications for copies should be addressed to the Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834 or online at http:/www.jedec.org) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and

    17、as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommen

    18、ded operating conditions and electrical performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall

    19、be as shown in 1.2.2 and figure 1. 3.5.2 Logic diagram. The logic diagram shall be as shown in figure 2. 3.5.3 Terminal connections. The terminal connections shall be as shown in figure 3. 3.5.4 Function tables. The function tables shall be as shown in figure 4. 3.5.5 Timing waveforms and test circu

    20、its. The timing waveforms and test circuits shall be as shown in figures 5a 5h. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/08614 REV PAGE 5 TABLE I. Electrica

    21、l performance characteristics. 1/ Limits Test Symbol Conditions VCCTemperature, TA Device type Min Max Unit S1 to A, VT= 5 V See figure 5a. 0.7 Driver differential high-level output voltage VODHS1 to B, VT= 5 V See figure 5a. -55C to +125C 0.7 V S1 to A, VT= 5 V See figure 5a. +25C 0.7 S1 to B, VT=

    22、5 V See figure 5a. 0.7 Driver differential low-level output voltage VODLS1 to A, VT= 5 V See figure 5a. -55C to +125C -0.8 V A side, VID= 200 mV, IOH= -8 mA See figure 5c. 4.75 V to 5.25 V -55C to +125C 4 High-level output voltage VOHB side, VT= 5 V See figure 5a. 5 V +25C 3 Typical V A side, VID= -

    23、200 mV, IOL= 8 mA See figure 5c. 4.75 V to 5.25 V -55C to +125C 0.8 Low-level output voltage VOL B side, VT= 5 V See figure 5a. 5 V +25C 1 Typical V Receiver positive-going differential input threshold voltage VIT+IOH= -8 mA See figure 5c. -55C to +125C 0.2 V Receiver negative-going differential inp

    24、ut threshold voltage VIT-IOL= 8 mA See figure 5c. 4.75 V to 5.25 V -55C to +125C -0.2 V Receiver input hysteresis (VIT+- VIT-) Vhys5 V +25C 24 mV VIH= 12 V, other input at 0 V 5 V 1 VIH= 12 V, other input at 0 V 0 V 1 VIH= -7 V, other input at 0 V 5 V -0.8 Bus input current IIVIH= -7 V, other input

    25、at 0 V 0 V -55C to +125C All -0.8 mA See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/08614 REV PAGE 6 TABLE I. Electrical performanc

    26、e characteristics - Continued. 1/ Limits Test Symbol Conditions VCCTemperature, TA Device type Min Max Unit A, BSR, DE/RE, and CRE VIH= 2 V -100 High-level input current IIHCDE0, CDE1, and CDE2 VIH= 2 V -55C to +125C 100 A A, BSR, DE/RE, and CRE VIL= 0.8 V -100 Low-level input current IILCDE0, CDE1,

    27、 and CDE2 VIL= 0.8 V -55C to +125C 100 A Short circuit output current IOSnB+ or nB- -55C to +125C 260 mA A VIH= 2 V -100 A VIL= 0.8 V 4.75 V to 5.25 V -100 A nB+ or nB- VIH= 12 V, other input at 0 V 5 V 1 nB+ or nB- VIH= 12 V, other input at 0 V 0 V 1 nB+ or nB- VIH= -7 V, other input at 0 V 5 V -0.

    28、8 High-impedance-state output current IOZnB+ or nB- VIH= -7 V, other input at 0 V 0 V -55C to +125C -0.8 mA Disabled 10 All drivers enabled, no-load 60 Supply current ICCAll receivers enabled, no-load 4.75 V to 5.25 V -55C to +125C 45 mA Output capacitance COnB+ or nB- to GND 18 Typical pF Receiver

    29、40 Typical Power dissipation capacitance Cpd2/ Driver 5 V +25C All 100 Typical pF See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/08

    30、614 REV PAGE 7 TABLE I. Electrical performance characteristics - Continued. 1/ Limits Test Symbol Conditions VCCTemperature, TA Device type Min Max Unit Driver Switching Characteristics Propagation delay time, tPHLor tPLHtpdSee figures 5a and 5b. 5 V +25C 15 ns Skew limit, maximum tpd minimum tpdtsk

    31、(lim)3/ -55C to +125C 8 ns Pulse skew, | tPHL tPLH| tsk(p)4.75 V to 5.25 V -55C to +125C 4 ns Fall time tfS1 to B See figure 5b. 5 V +25C 4 Typical ns Rise time trS1 to B See figure 5b. 5 V +25C 8 Typical ns Enable time, control inputs to active output ten-55C to +125C 60 ns Disable time, control in

    32、puts to high- impedance output tdis-55C to +125C 140 ns Propagation delay time, high-level to high- impedance output tPHZSee figures 5e and 5f. -55C to +125C 120 ns Propagation delay time, low-level to high- impedance output tPLZSee figures 5e and 5f. -55C to +125C 120 ns Propagation delay time, hig

    33、h-impedance to high-level output tPZHSee figures 5e and 5f. -55C to +125C 60 ns Propagation delay time, high-impedance to low-level output tPZLSee figures 5e and 5f. 4.75 V to 5.25 V -55C to +125C All 60 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking per

    34、mitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/08614 REV PAGE 8 TABLE I. Electrical performance characteristics - Continued. 1/ Limits Test Symbol Conditions VCCTemperature, TA Device type Min Max Unit Receiver Switching Cha

    35、racteristics Propagation delay time, tPHLor tPLHtpdSee figures 5a and 5b. 5 V +25C 19 ns Skew limit, maximum tpd minimum tpdtsk(lim)3/ -55C to +125C 9 ns Pulse skew, | tPHL tPLH| tsk(p)4.75 V to 5.25 V -55C to +125C 4 ns Transition time, (tror tf) ttSee figure 5d. 5 V +25C 2 Typical ns Enable time,

    36、control inputs to active output ten-55C to +125C 70 ns Disable time, control inputs to high- impedance output tdis-55C to +125C 80 ns Propagation delay time, high-level to high- impedance output tPHZSee figures 5g and 5h. -55C to +125C 80 ns Propagation delay time, low-level to high- impedance outpu

    37、t tPLZSee figures 5g and 5h. -55C to +125C 70 ns Propagation delay time, high-impedance to high-level output tPZHSee figures 5g and 5h. -55C to +125C 70 ns Propagation delay time, high-impedance to low-level output tPZLSee figures 5g and 5h. 4.75 V to 5.25 V -55C to +125C All 70 ns 1/ Testing and ot

    38、her quality control techniques are used to the extent deemed necessary to assure product performance over the specified temperature range. Product may not necessarily be tested across the full temperature range and all parameters may not necessarily be tested. In the absence of specific parametric t

    39、esting, product performance is assured by characterization and/or design. 2/ Cpddetermines the no-load dynamic supply current consumption, IS= Cpdx VCCx f + ICC. 3/ This parameter is applicable at one VCC and operating temperature within the recommended operating conditions and to any two devices. P

    40、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/08614 REV PAGE 9 Case X NOTES: 1. This drawing is subject to change without notice. 2. Body dimensions do not includ

    41、e mold protrusion not to exceed 0.15 millimeters. 3. Falls within JEDEC MO-153. 4. All linear dimensions are shown in millimeters (inches). Inches equivalents are given for general information only. FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without

    42、license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/08614 REV PAGE 10 Case X Dimensions Millimeters Inches Symbol Min Max Min Max A - 1.20 - 0.047 A1 0.25 NOM 0.010 NOM b 0.17 0.27 0.007 0.011 c 0.15 NOM 0.006 NOM D 13.90 14.10 0.547 0.555 E 6.

    43、00 6.20 0.236 0.244 E1 7.90 8.30 0.311 0.327 e 0.50 NOM 0.020 NOM L 0.50 0.75 0.020 0.030 Q 0.05 0.15 0.002 0.006 FIGURE 1. Case outline - Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE

    44、A CODE IDENT NO. 16236 DWG NO. V62/08614 REV PAGE 11 FIGURE 2. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/08614 REV PAGE 12 Device type 01 Case

    45、 outline X Terminal number Terminal symbol Terminal number Terminal symbol 1 GND 29 1B- 2 BSR 30 1B+ 3 CRE 31 2B- 4 1A 32 2B+ 5 1DE/RE 33 3B- 6 2A 34 3B+ 7 2DE/RE 35 4B- 8 3A 36 4B+ 9 3DE/RE 37 5B- 10 4A 38 5B+ 11 4DE/RE 39 VCC12 VCC40 GND 13 GND 41 GND 14 GND 42 GND 15 GND 43 GND 16 GND 44 GND 17 G

    46、ND 45 VCC18 VCC46 6B- 19 5A 47 6B+ 20 5DE/RE 48 7B- 21 6A 49 7B+ 22 6DE/RE 50 8B- 23 7A 51 8B+ 24 7DE/RE 52 9B- 25 8A 53 9B+ 26 8DE/RE 54 CDE0 27 9A 55 CDE1 28 9DE/RE 56 CDE2 FIGURE 3. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS

    47、-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/08614 REV PAGE 13 Inputs Outputs B+ 1/ B- 1/ Output A Input A B+ B- L H H L L H L H L H H L Inputs Outputs Inputs Outputs DE/RE A B+ 1/ B- 1/ A B+ B- DE/RE A B+ B- L L H H - - L H L H - - H L - - L H - - - - L H - - H L L L H H L H L H Z Z L H Z Z H L NOTES: H = high level, L = low level, X = irrelevant, Z = high impedance (off) 1/ An H in this column represents a voltage of 200 mV or higher than the other bus input. An L repre


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