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    IEC TS 61189-3-301-2016 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Part 3-301 Test methods for interconnection struc.pdf

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    IEC TS 61189-3-301-2016 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Part 3-301 Test methods for interconnection struc.pdf

    1、 IEC TS 61189-3-301 Edition 1.0 2016-07 TECHNICAL SPECIFICATION Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3-301: Test methods for interconnection structures (printed boards) Appearance inspection method for plated surfaces on PWB I

    2、EC TS 61189-3-301:2016-07(en) colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2016 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including phot

    3、ocopying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your lo

    4、cal IEC member National Committee for further information. IEC Central Office Tel.: +41 22 919 02 11 3, rue de Varemb Fax: +41 22 919 03 00 CH-1211 Geneva 20 infoiec.ch Switzerland www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that pr

    5、epares and publishes International Standards for all electrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have

    6、been published. IEC Catalogue - webstore.iec.ch/catalogue The stand-alone application for consulting the entire bibliographical information on IEC International Standards, Technical Specifications, Technical Reports and other documents. Available for PC, Mac OS, Android Tablets and iPad. IEC publica

    7、tions search - www.iec.ch/searchpub The advanced search enables to find IEC publications by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, replaced and withdrawn publications. IEC Just Published - webstore.iec.ch/justpublished Stay up to

    8、date on all new IEC publications. Just Published details all new publications released. Available online and also once a month by email. Electropedia - www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing 20 000 terms and definitions in English and

    9、French, with equivalent terms in 15 additional languages. Also known as the International Electrotechnical Vocabulary (IEV) online. IEC Glossary - std.iec.ch/glossary 65 000 electrotechnical terminology entries in English and French extracted from the Terms and Definitions clause of IEC publications

    10、 issued since 2002. Some entries have been collected from earlier publications of IEC TC 37, 77, 86 and CISPR. IEC Customer Service Centre - webstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Service Centre: csciec.ch.

    11、 IEC TS 61189-3-301 Edition 1.0 2016-07 TECHNICAL SPECIFICATION Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 3-301: Test methods for interconnection structures (printed boards) Appearance inspection method for plated surfaces on PWB I

    12、NTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 31.180 ISBN 978-2-8322-3550-8 Registered trademark of the International Electrotechnical Commission Warning! Make sure that you obtained this publication from an authorized distributor. colour inside 2 IEC TS 61189-3-301:2016 IEC 2016 CONTENTS FOREWORD .

    13、3 1 Scope 5 2 Normative references. 5 3 Terms and definitions 5 4 Test specimens . 5 5 Equipment / apparatus . 5 5.1 Evaluation of lustre non-uniformity . 5 5.2 Evaluation of colour non-uniformity 6 6 Procedure . 6 6.1 Outline of the method 6 6.2 Specimen preparation . 6 6.3 Imaging of surface rough

    14、ness/chromaticity distribution . 6 6.4 Binarization of images . 6 6.5 Extraction of feature quantities 7 6.6 Derivation of discriminant function . 7 6.7 System registration . 7 7 Report . 8 8 Additional information 8 Annex A (informative) Example of equipment and tested result for lustre non- unifor

    15、mity . 9 A.1 Equipment for lustre non-uniformity inspection . 9 A.2 Tested result . 9 A.2.1 Surface roughness image . 9 A.2.2 Binarized image and feature extraction . 11 A.2.3 Frequency analysis of feature quantities . 12 A.2.4 Final estimate 12 Annex B (informative) Example of tested result for col

    16、our non-uniformity inspection 13 B.1 Image analysis of colour non-uniformity . 13 B.2 Feature extraction and discriminant analysis 14 Bibliography . 16 Figure 1 Flow chart of the test procedure 6 Figure A.1 Equipment prototype . 9 Figure A.2 Images of gold-plating of non-defective and defective prod

    17、ucts 10 Figure A.3 Images of S- and P-polarized components, and for gold- plating with lustre non-uniformity . 11 Figure A.4 Image examples of gold-plating with lustre non-uniformity 11 Figure A.5 Example of frequency analysis of feature quantity 12 Figure A.6 Example of the final estimate of the qu

    18、ality of gold-plating . 12 Figure B.1 Images of gold-plating pads . 13 Figure B.2 Images of colour distribution 14 Figure B.3 Frequency analysis example of a feature quantity 14 Figure B.4 Example of the discriminant analysis result 15 IEC TS 61189-3-301:2016 IEC 2016 3 INTERNATIONAL ELECTROTECHNICA

    19、L COMMISSION _ TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 3-301: Test methods for interconnection structures (printed boards) Appearance inspection method for plated surfaces on PWB FOREWORD 1) The International Electrotechnical Com

    20、mission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and

    21、 in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee

    22、 interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accord

    23、ance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all inte

    24、rested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held respons

    25、ible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence

    26、between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks o

    27、f conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts an

    28、d members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publica

    29、tion or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publica

    30、tion may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. The main task of IEC technical committees is to prepare International Standards. In exceptional circumstances, a technical committee may propose the publication of a technical s

    31、pecification when the required support cannot be obtained for the publication of an International Standard, despite repeated efforts, or the subject is still under technical development or where, for any other reason, there is the future but no immediate possibility of an agreement on an Internation

    32、al Standard. Technical specifications are subject to review within three years of publication to decide whether they can be transformed into International Standards. IEC TS 61189-3-301, which is a technical specification, has been prepared by IEC technical committee 91: Electronics assembly technolo

    33、gy. 4 IEC TS 61189-3-301:2016 IEC 2016 The text of this technical specification is based on the following documents: Enquiry draft Report on voting 91/1348/DTS 91/1376/RVC Full information on the voting for the approval of this technical specification can be found in the report on voting indicated i

    34、n the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 61189 series, published under the general title Test methods for electrical materials, printed boards and other interconnection structures and assemblies, can be fou

    35、nd on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC website under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be transformed into an

    36、International standard, reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be usefu

    37、l for the correct understanding of its contents. Users should therefore print this document using a colour printer. IEC TS 61189-3-301:2016 IEC 2016 5 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 3-301: Test methods for interconnectio

    38、n structures (printed boards) Appearance inspection method for plated surfaces on PWB 1 Scope This part of IEC 61189 outlines a way to determine the appearance non-uniformity of both the lustre and colour on plated metal surfaces in printed wiring boards (PWBs). The method is applicable to gold, nic

    39、kel and copper plating in PWBs. 2 Normative references There are no normative references in this document. 3 Terms and definitions For the purposes of this document, the following terms and definitions apply. ISO and IEC maintain terminological databases for use in standardization at the following a

    40、ddresses: IEC Electropedia: available at http:/www.electropedia.org/ ISO Online browsing platform: available at http:/www.iso.org/obp 3.1 lustre non-uniformity abnormal roughness distribution in plated surfaces leading to irregular brightness of reflected light 3.2 colour non-uniformity irregular re

    41、flection spectrum Note 1 to entry: Colour non-uniformity is caused by other influences than roughness change, such as abnormal components, adhesion of foreign matter and oxidation in plated surfaces. 4 Test specimens 4.1 Specimen dimensions and forms should be in accordance with the test system. 4.2

    42、 Specimens of non-defective and of defective products, of several tens to one hundred, at least of ten, are required as teacher data for each series of evaluation. 5 Equipment / apparatus 5.1 Evaluation of lustre non-uniformity For the evaluation of the lustre non-uniformity, a test system capable o

    43、f measuring the surface roughness distribution should be used. As for an optical method, CCD (charge- 6 IEC TS 61189-3-301:2016 IEC 2016 coupled device), or CMOS (complementary metal oxide semiconductor) camera systems, or as for a mechanical method, stylus type tester shall be used, respectively. 5

    44、.2 Evaluation of colour non-uniformity For the evaluation of the colour non-uniformity, an optical system capable of measuring the chromaticity distribution shall be used. 6 Procedure 6.1 Outline of the method The method is outlined by the flow chart in Figure 1. The numbers indicate the subclause r

    45、eferences. Figure 1 Flow chart of the test procedure In this method, the procedures of the evaluation of lustre non-uniformity and colour non- uniformity are basically the same. 6.2 Specimen preparation Requirements for specimens are specified in Clause 4. 6.3 Imaging of surface roughness/chromatici

    46、ty distribution Acquire the images of surface roughness for the lustre non-uniformity, and/or of chromaticity distribution for the colour non-uniformity, by the apparatus / equipment mentioned in Clause 5. 6.4 Binarization of images Obtain the binary images by the threshold processing. The region gi

    47、ving values significantly deviating from the average value of the whole image concerned is counted to be 1 (white pixels) as abnormal, and the others to be 0 (black pixels) as normal. IEC 6.2 Specimen preparation 6.3 Imaging of surface roughness/ chromaticity distribution 6.4 Binarizing of images 6.

    48、5 Extraction of feature quantities 6.6 Derivation of discriminant function 6.7 System registration IEC TS 61189-3-301:2016 IEC 2016 7 The threshold setting should be agreed upon between the parties. 6.5 Extraction of feature quantities Extract the feature quantities of abnormal regions from the bina

    49、rized images by image analysis of the size, area, shape, and distribution, etc. of the irregularities. For example, the diagonal length of the minimum rectangles bounding the clusters of abnormal regions, and change in the number of pixels by the binary image contraction of repetition can be used as feature quantities. The type and number of feature quantities to be used should be agreed upon between the parties. 6.6 Derivation of discriminant function Discriminant a


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