1、MIL-P-5484 58 = 7779706 0375070 3 - MIL-P-85484 (AS) 19 February 1982 MILITARY SPECIFICATION POD-TRAY SUBASSEMBLY, SIMULATING SET This specification is approved for use by Naval Air Systems Command, Department of the Navy, and is available for use by all Departments and Agencies of the Department of
2、 Defense. 1. SCOPE 1.1 Scope. This specification establishes the requirements for the manu- facture and acceptance of the Pod-Tray Subassembly, Simulating Set, hereafter referred to as the pod. 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. Unless o
3、therwise speci- fied, the following specifications, standards, and handbooks of the issue listed in that issue of the Department of Defense Index of Specifications and Standards (DoDISS) specified in the solicitation form a part of this specification to the extent specified herein. - - Beneficial co
4、mments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Commanding Officer, Naval Air Engineering Center, Engineering Specifications and Standards Department (ESSD) Code 93, Lakehurst, New Jersey 08733, by using the
5、 self-addressed Standard- ization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. FSC 5841 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-NIL-P-85g84 58 m 9797906 0375073 3 W SPECIFICATIONS MILITARY M
6、IL-W-5088 MIL-E-5400 STANDARDS MILITARY MIL-STD-129 MIL-STD-454 DOD-STD-480 MIL-STD-794 MIL-STD-810 MIL-STD-45662 Wiring, Aerospace Vehicle. Electronic Equipment, Airborne, General Specification for. Marking for Shipment and Storage. Standard General Requirements for Electronic Equip- Engineering Ch
7、ange Proposals (ECPs) and Request for Parts and Equipment, Procedures for Packaging and Environmental Test Methods. Calibration System Requirements. ment. Deviation and Waivers (Long Form). Packing of. DRAWINGS MILITARY NAVAL AIR SYSTEMS COMMAND (Code Ident. 30003) DL 1236AS240 Data List, Pod-Tray S
8、ubassembly, Simulating Set. 1236AS258 Well, Umbilical. 1236AS270 Circuit Card Assy RF Detector and Fault Indicator. (Copies of specifications, standards, handbooks, drawings, and publications required by manufacturers in connection with specific acquisition functions should be obtained from the cont
9、racting activity or as directed by the con- tracting officer.) 2.1.2 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein, the text of this specifi- cation shall take precedence. 2 Provided by IHSNot for ResaleNo reproduction or netwo
10、rking permitted without license from IHS-,-,-MIL-P-85LI84 58 = 7777706 0375072 5 W 3. REQUIREMENTS 3.1 Item description. The pod shall be used to house and carry the AN/ The DFT-l(V) modulator with attached magnetron, wave guides, and antenna. pod consists of the following components: a. Tray assemb
11、ly, electrical. b. Radome. c. Pod body assembly. 3.1.1 Associated equipment. The pod shall function with the following associated equipment: a. b. d. e. f. 8. h. i. C. DOD-031 Magnetron, in accordance with MIL-E-1/1753. DOD-032 Magnetron, in accordance with MIL-E-1/1754. DOD-033 Magnetron, in accord
12、ance with MIL-E-1/1755. 940990 Modulator, AN/DPT-l(V), FSCM 49956. 1236AS247-1 and 1236AS247-3 Waveguide Monitoring Assemblies 1236AS248-1 and 1236AS248-3 Flexible Waveguides. 1236AS249-1 and 1236AS249-3 Antenna Assemblies. SG-1189/AST-4(V) Generator-Control-Indicator, 1337AS109 Power Cable, W5. 3.2
13、 First article. When specified (see 6.2.1), a sample shall be sub- jected to first article inspection and approval (see 4.6 and 6.3). 3.3 Materials, parts and processes. Unless otherwise specified herein, the selection of materials, parts and processes shall be in accordance with MIL-E-5400 and the
14、drawings listed on DL 1236AS240. 3.3.1 Approval for nonstandard parts and materials. Approval for the use of nonstandard parts and materials shall be obtained from the procuring activity in accordance with MIL-E-5400. , 3.3.2 Materials. All materials used in the construction of the pod shall be in a
15、ccordance with MIL-STD-454 Requirement 4, for fungus-inert materials, Requirement 15 for ferrous alloys corrosion resistance, and Requirement 16 for dissimilar metals. Minimum use shall be made of strategic or critical materials. 3.4 Characteristics. 3.4.1 Electrical performance characteristics. The
16、 pod shall provide the components and logic circuitry necessary to interface and operate with the associated equipment (see 3.1.1). MIL-W-5088 and the applicable drawings listed on DL 1236AS240. The pod shall be wired in accordance with 3 Provided by IHSNot for ResaleNo reproduction or networking pe
17、rmitted without license from IHS-,-,-MIL-P-85484 58 7999706 0175073 7 W MIL-P-85484 (AS) 3.4.1.1 Input voltage. The input voltage shall be 115 Volts alternating current (Vac), three phase 400 Hertz (Hz) at 10 amperes per phase in accord- ance with MIL-STD-454, Requirement 25. 3.4.1.2 Power distribut
18、ion. The pod shall distribute both 115 Vac three phase 400 Hz and 28 Vdc. noise is introduced into associated circuits. The distribution shall be such that a minimum of 3.4.1.3 Logic circuitry. The logic circuit shall consist of only one printed circuit card, which shall include the following: a. Re
19、verse voltage protection. b. Logic power supply. c. Fault processor logic circuit. d. Detector logic circuit. e. Isolation of display power. f. Interlock relay. 3.4.1.3.1 Form factor. ance with Drawing 1236AS270. The logic printed circuit card shall be in accord- 3.4.1.3.2 Cooling. Natural cooling o
20、f the logic circuitry shall be in ac- cordance with the thermal design requirements of MIL-STD-454, Requirement 52. 3.4.1.3.3 Input power. An input of 28 Vdc shall be applied to Pin 19 of connector P11. 3.4.1.3.4 Warm up. Warm up time shall be not greater than five seconds. 3.4.1.3.5 Polarity protec
21、tion. The logic card shall provide reverse polarity protection to Pin 19 of connector P11. 3.4.1.3.6 Logic power. The logic shall operate on 12 Vdc. The 12 Vdc shall be provided by the card with all necessary filtration. 3.4.1.3.7 Fault processor logic. The logic circuit shall receive the fol- lowin
22、g fault processor output signals from the modulator on Pin 13 of connec- tor P11: a. Warm up cycle: A steady 10 Vdc to 12 Vdc level for a two to four minute period. b. Time out: processor signal shall drop to a 2.00 Vdc to 2.25 Vdc level. After a two to four minute warm up the fault 4 i . . Provided
23、 by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-_ MIL-P-85484 58 W 9999906 0175074 9 m c. Fault signatures: (1) Latch up (see 6.4). (2) Load fault (see 6.4). 3.4.1.3.8 Logic circuit characteristics, The logic circuit shall provide the following: a. Input loa
24、d impedance: Impedance to the modulator shall be not less than 1 megohm. b. Noise rejection: The fault processor shall reject all sig- nals of any amplitude and any polarity with a width less than 2 milliseconds (ms). 3.4.1.3.9 Fault detector circuit output. The output from the fault detec- tor circ
25、uit output shall provide a ground to two parallel 327 incandescent lamps (labeled RDY) whenever the time out occurs. If a latch up or load fault occurs, the fault detector circuit shall cause the two 327 incandescent lamps to flash at a one-half second on, one-half second off rate. put shall be appl
26、ied to Pins 14 and 20 of connector P11. This out- 3.4.1.3.10 RF detector. from the waveguide assembly detector on Pin 6 of connector P11. output shall be as follows: The RF detector circuit shall receive the output The detector a. Negative pulse. b. 0.4 to 0.8 microseconds in width at the 90 percent
27、 points. c. Not less than -2.00 Volts and not greater than -0.25 Volts amplitude when terminated, reference ground into a 1000 ohm load, as shown in Figure 1. d. The detector logic circuit shall provide the 1000 ohm load in (c) above. e. Input pulse rates shall be not less than 200 pulses per second
28、, and shall be not greater than 4,000 pulses per second. f. The output from the detector logic circuit shall provide a ground to two parallel 327 incandescent lamps (labeled RAD) through Pins 10 and 11 of connector P11. 5 Provided by IHSNot for ResaleNo reproduction or networking permitted without l
29、icense from IHS-,-,-4 Microseconds Min -2.0 Vdc min. 8 Microseconds Max -0.25 Vdc max. FIGURE 1. RF detector output. 3.4.1.3.11 Isolation of display power. Isolation of the cockpit master dimmer power supply, which supplies power to the SG-1189 Generator-Control- Indicator display lights and the 28
30、Vdc display power to the pod, shall be provided on the logic circuit card. incandescent lamps of both assemblies during the display mode, yet shall provide isolation of the two supplies whenever the ground is removed. isolation shall be required on both the fault detector circuit and the RE detector
31、 circuit. This card shall provide a ground to the This 3.4.1.3.12 Interlock relay, A 28 Vdc relay shall be included which shall be configured ground seeking through an external switch on Pin 15 of connec- tor P11. 3.4.2 Environmental conditions. The pod shall operate during the envi- ronmental condi
32、tions specified herein with a magnetron, modulator, waveguide monitor assembly, flexible waveguide, and an antenna properly installed (see 3.1.1). 3.4.2.1 Random vibration. Except as otherwise specified herein, the pod The pod shall be suspended from an shall operate after exposure to the vibration
33、test in accordance with MIL- STD-810, Method 514.2, Figure 514.2-48. AERO-7A Bomb Ejector Rack (see 3.5 and 6.5). 3.4.2.2 Shock (non-operating). The pod shall operate after exposure to the shock test in accordance with MIL-STD-810, Method 516.2, Procedure I, Figure 516.2-2, except the pod, with asso
34、ciated equipment installed, shall be 6 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-P-85984 58 m 777770b 017507b 2 m HIL-P-85484 (AS) suspended from the AERO-7A rack and subjected to the shock levels listed below. 50 shocks. Ten half sine wave
35、 shocks per axis shall be applied for a total of a. Vertical, up direction only, 25g peak for 20 ms (tensile stress imparted to the lugs). b. Transverse, both directions, 25g peak for 20 ms. c. Longitudinal, both directions, 6g peak for 20 ms. 3.4.2.3 Temperature-altitude. The pod shall operate as s
36、pecified herein during exposure to the temperature-altitude tests in accordance with MIL-STD- 810, Method 504.1, procedure 1, except the temperature shall be -25OC to +85OC and the altitude shall be 60,000 feet mean sea level. 3.4.3 Physical characteristics, 3.4.3.1 Form factor. Dimensions and mount
37、ing configuration of the pod shall be in accordance with the applicable drawings listed on DL 1236AS240. 3.4.3.2 Weight. The weight of the pod shall be not greater than 158 pounds. 3.4.3.3 Panel markings. Panel markings shall be in accordance with MIL- E-5400 and the applicable drawings listed on DL
38、 1236AS240. 3.4.3.4 Design and construction. The pod shall be designed and con- structed in accordance with MIL-E-5400 for Class 1, Category III equipment, the drawings listed on DL 1236AS240, and as specified herein. shall notify the procuring activity, in accordance with DOD-STD-480, of any recomm
39、ended changes in design and construction. The contractor 3.4.3.5 Cabling and connectors. The pod shall be designed for the use with RF components. Cables and connectors shall be in accordance with MIL-E-5400. The umbilical well shall conform to Drawing 1236AS258. 3.4.3.6 Input/output connector. The
40、logic card shall use the input/ output connector in accordance with Drawing 1236AS270. 3.5 Government-loaned property. Unless otherwise specified in the con- tract (see 6.2,1), the contractor shall be loaned the following equipment in operating condition (see 3.1.1 and 6.5): a. DOD-031 Magnetron: 1
41、each b. DOD-032 Magnetron: 1 each c. DOD-033 Magnetron: 1 each d. 940990 Modulator, A?/DPT-1(V): 1 each 7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-e. f. g. h. i. j. k. 1. m. NIL-P-85Y84 58 7779706 0175077 4 W 1236AS247-1 Waveguide Monitoring A
42、ssembly: 1 each 1236AS247-3 Waveguide Monitoring Assembly: Leach 1236AS248-1 Flexible Waveguide: 1 each 1236AS248-3 Flexible Waveguide: 1 each 1236AS249-1 Antenna: 1 each 1236AS249-3 Antenna: 1 each SG-l189/AST.-4(V) Generator-Control-Indicator: 1 each 1337AS109 Power Cable, W5: 1 each AERO-7A Eject
43、or Bomb Rack: 1 each 3.6 Workmanship. The pod, including all parts and accessories, shall be constructed and finished in accordance with MIL-STD-454, Requirement 9 and the drawings listed on DL 1236AS240. Prior to and after final assembly, the pod shall be thoroughly cleaned of metal chips and other
44、 foreign matter; also, all sharp edges and burrs shall be removed. 4. QUALITY ASSURANCE PROVISIONS 4.1 Responsibility for inspections. Unless otherwise specified in the contract or purchase order (see 6.2.1), the contractor is responsible for the performance of all inspection requirements as specifi
45、ed herein. Except as otherwise specified in the contract, the contractor may use his own or any other facilities suitable for the performance of the inspection requirements specified herein, unless disapproved by the Government. serves the right to perform any of the inspections set forth in the spe
46、cifi- cation where such inspections are deemed necessary to assure supplies and services conform to prescribed requirements. The Government re- 4.2 Classification of inspections. The inspection requirements specified herein are classified as follows: a. b. First article inspection (see 4.8). Quality
47、 conformance inspection (see 4.9). 4.3 Inspection conditions. Unless otherwise specified herein, all in- spection conditions shall be as specified in MIL-STD-810. 4.3.1 Tolerance on specific test Conditions. The allowable tolerance on specific test conditions shall be as follows: a. Vibration amplit
48、ude: +lo percent of peak. b. Vibration frequency: f2 percent. c. Shock loads: +O, -10 percent. d. Shock duration: +20 percent. 8 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-4.3.2 Environmental testing conditions. Unless otherwise specified here-
49、in, the tests shall be performed under the following conditions of environ- ment : a. Room temperature: +18OC to +35OC. b. Altitude: Normal elevation of test facility. c. Room humidity: Not greater than 95 percent. d. Vibration: Normal conditions of test facility. 4.4 Test equipment. All test equipment shall be maintained and calibrated in accordance with MIL-STD-45662. data for review by the procuring activity. The contra
