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    NAVY MIL-A-85672-1987 AMPLIFIER RADIO FREQUENCY AM-7177A ARC《AM-7177A ARC射频放大器》.pdf

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    NAVY MIL-A-85672-1987 AMPLIFIER RADIO FREQUENCY AM-7177A ARC《AM-7177A ARC射频放大器》.pdf

    1、T t hIL-A-85672(AS) 7 JULY 1987 MILITARY SPEC1 F I CATION APIPLIFIER, RADIO FREQUENCY AM- 71 7 7A./ARC ,s specification is approved for use within the Naval Air Cominand, Department of the Navy, and is available for use by al and Agencies of the Department of Defense. Systems Departments 1. SCOPE 1.

    2、1 Scope. This specification establishes the design, performance, arid acceptancmuirements for A!+7177A/AKC Radio Frequency Amplifier hereinafter referred to as the amplifier. The AM-7177A/AKC is a linear amplifier, operating in the 225.0 b1Hz through 400 Mtlz band. Nitti an input of nomitially 2 wat

    3、ts, the amplifier, with its self-contained automatic level coritrol, provides an output at 30 watt RF level. 2. APPLICABLE DOCUPIENTS 2.1 Government documents, 2.1.1 Specification and standards. The following specifications ana standards form a part of this specification to the exterit specified her

    4、ein. ilnless otherwise specified, the issues of these docunients shall be those listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the sol ici tatiori. Beneficial comments (recommendations, additions, deletions) and any pe

    5、rtinent data which may be of use in improving this document should be adaressed to: Commanding Officer, Naval Air Engineering Center, Systenis Engineering and Standadiza- tiori Department (SESD) Code 53, Lakehurst, NJ 8733-5100, by using the sel f-addressed Standardization Document Improvement Propo

    6、sal (DD Forni 1426) appearing at the end of this document or by letter. DISTKIBUTIUN STATEMENT A: Approved for public release; distribution is un7 i mi ted. APlSC N/A , THIS DOCUMENT CONTAINS Aerospace Vehicle Electronic Equipment, Airborne, General Specification for Testing, Environmental, Aircraft

    7、 Electronic Equipment Anodic Coatings for Aluminum and Aluminum Alloys Electronic and Electrical Equipment, Accessories, and Repair Parts, Packaging and Packing of Test Procedures; Preproduction, Acceptance and Life for Aircraft Electronic Equipment, Format for Nomencl ature and I dentif i cation fo

    8、r El ec trmf c, Aeronautical, and Aeronautical Support Equipment Including Ground Support Equipment Microcircuit$ Genera! Specification for Connector, Electrical, Circular, Mniature, High Density Quick Disconnect, (Bayonet, Threaded, and Breech Coup1 ing) Environmental Resi stant, Removable Crimp an

    9、d Hermetic Sol der Contacts, General Specification for Human Engineering Requirements for Mi 1 i tary Systems, Equipment and Facil i ties Printed Wiring Boards Federal Standard Colors Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-A-85672 58 W 9

    10、777706 03761144 T Mi 1 i tary MIL-STD-129 FI11 L-STD-2 75 MI L-STD-415 MI L-STD-454 MI L-STD-46 1 MIL-STD-462 and Notice 4 MI L-STD-4 71 MIL-STD-704 MIL-STD-781 MIL-STD-785 MIL-STD-883 MI L-STD -96 5 MI L-STD- 1472 MIL-STD-I562 MIL-STD-2074 MI L-STD-2076 MIL-STD-2084 2.1.2 documents The issue MIL-A-

    11、85672( AS) Marking for Shipmerit and Storage Printed Wiring for Electronic Equipment Test Provisions for Electronic Systems and Associated Equipment, Design Cri teria for Electronic Equipment, General Requirements for Electromagnetic Emission Susceptibiilty Measurements for the Control of Electromag

    12、netic Interference Electromagnetic Enterference Characteristics, Measurement of Mai n talnabi 1 i ty Qernonstra ti on - At rcra ft El ectric Power harac ter i sties ReTiabili ty Tests; Exponential ai seribution Reliabil fty Program for Systems and Equipment Development and Production Test Methods an

    13、d Procedures for Fii croel ectronics Parts Controi Program Human Engineering Design riteria for Military System Equipment and Facilities Lists of Standard MScrocircuis Failure Classification for Reliability Testing Unit Under Test Compatibility with Automatic Test Equipment, General Requirements for

    14、 Maintainability of Avionics and Electronic Systems and Equipment, General Requirements for Other Government documents. shall be those in effect on the date of the solicitation. The following other Government form a part of this specification to the extent specified herein. Provided by IHSNot for Re

    15、saleNo reproduction or networking permitted without license from IHS-,-,-MTL-A-85b72 CB W 7979406 0176445 L MIL-A-85,672 (AS) O U CU ME NT S Naval Air Systems Command. AD- 11 15 ws-6536 El ectroniagnetic Compatibi 1 i ty Design Guide for Avionics and Related Ground Support Equipment Process Specific

    16、ation Procedures and Requirements for Preparations and Soldering of Electrical Con nec ti on s Department of the Navy NAVMAT P-4855.1 Navy Power Supply Re1 iabi 1 i cy N AV HAT P -94 9 2 Navy Manufacturing Screening Program (Copies of specifications, standards, and other Government documents require

    17、d by contractors in connection with specific acquis1 tion functions shoud be obtained froni the contracting activity or as directed by the contracting activity. 1 2.2 Order of precedence. In the event of a conflict between the text of this spec7fication arid the references cited herein (except for a

    18、ssociated detail specifications, specification sheets or blS stdndards), the text of this specification chal 1 take precaence. Nothing in this specification, however, chal 1 supersede applicable laws and regulations iitiless a specific exemption has been obtained, 3 REUU I REMENTS 3.1 Item descripti

    19、on. The radio freuency amplifier covered in this specification shall provide amplification of any frequency in the 225.0 NHz to 4D MHz band from a 2 watt input level to a 30 watt output level, anipl i fier shall accommodate either ampl i tude or frequency modulated input signals arid provide compara

    20、ble output signal modulation. The ampl ifier shall be broadband, requiring no tuning tirne for change from one nput frequency to any other frequency, The amplifier along with a receiver-transrnitter (RT) arid fil ter niake up a system IEMC Fil ter/HPA System). The 3.1.1 Module complement, The anipli

    21、fier shall consist of the fol Jowirig major shop replaceable subassemblies (SRAS): a, Al RF Amplifier b. AL Power Suppl yIALC Each of these major modules may include subassemblies for providing manufacturing and maintenance benefits; however they are not required to be directly plug-in or replaceabl

    22、e without final adjustment after instal lation. Final adjustment of the automatic level control is also permissible after installation of the Al and A2 modules into the amplifier. 4 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MI L-A-856 72 (AS )

    23、3.2 First article. When specified in the contract or purchase order (see 6.2.1), a sample shall be subjected to first article inspection (see 4.4 and 6.3). 3.3 Parts and materials, In the selection of parts and materials, the prime considerations are fulfil lnient of performance requirements, lociis

    24、tics supportability and reliability assurance- in a cost effective design.- The following shall govern in parts and material selection. a. Subassemblies shall be designed and fabricated to be repairable. Maximum economic standardization of parts and materials shall be exercised. Parts sel.ection sha

    25、ll be made in the following order of precedence: (1 ) Mi 1 i tary Standard parts s ha1 1 be sel ec ted in accordance wi th (2) Nonstandard parts previously qualified for other programs. (3 Nons tandard parts. MIL-STD-454, Requirement 22. b. Nonstandard parts and nonestablished re1 iabili ty military

    26、 standard parts shall be screened to the requirements of the most similiar military standard or standard nonestablishea reliability part. and hybrids shall use NIL-STO-883, Method 5004, Class 6, as a basis for tailored screens. Integrated circuits 3.3.1 Component rescreening. The contractor shall co

    27、nduct 100 percent incoming inspection of a11 active components used in production equipment and spares. Functional and parametric checks of active components will be performed at the components rated temperature extremes and at ambient. Components which are not compliant with their specification sha

    28、ll not be used in the ARC-182. 3.3.2 .Parts derating and application, All parts used shall be applied well within their ratings. ,The derating shall encompass the appropriate and meaningful application conditions such as vol tage, current, power, tempera- ture, mechanical, and duty cycle. Electronic

    29、 and electromechanical parts shall conform to Table I electronic parts derating for worst case electrical .and environmental stress unless formal written approval is received from the procuring activity prior to incorporation into the design. analysis shall be used to verify that all parameter stres

    30、ses are within the derated values at worst case circuit and environmental conditions. The following limitations on parts usage shall apply: Part level stress a. Prohibited application (1 Non-hermetical ly sealed semiconductors except power transistors (2) Photo couplers (photo transistors) (3) Hot c

    31、arrier (Schottky) power rectifiers (4) Microcircuit sockets (5) Non-hermetical ly sealed wet tantalum capacitors 5 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-flIL-A-B5b72 58 7777706 0376447 5 MIL-A-85672(AS) Resistors Diodes TABLE I, Electronic

    32、parts derating. Power Vol tage Power Current Vol tage Junction Tempera ture Part Type I P a rame ter Li near Capacitor Power Junction Tempera ture Appl ied Vol tage (Ripple Vol tage for Tantal uml Transistors Power Vol tage Junction Tempera ture I Integrated Circuits igi tal Fan-Out, Fan-In Junction

    33、 Temperature I Maximum Al lowable Application Stress 50% of rating - i/ 50% of rating 70% of ratinfi 50% of rating 75% of rating 60% of rating 55% of rating 60% of rating - 2/ 80% of rating - 2/ 75% of rating 2/ I nduc ti ve Devices at least 30 degrees below rated-temperature. In addition, the maxim

    34、um voltage between windings or between a winding and a shield shall be not greater than 60% of rated vol tage for the steady state conditions and 90% of rated voltage with transients. General purpose inductors, audio and power transformers shall be ap.plied at no more than 70% of rated current. i/ F

    35、or solid tantalum and all electrolytic capacitors, the maximum applied - voltage shall be not greater than 70 percent of the vendor rated value. “Applied voltage“ is the sum of the applied peak ripple voltage and the applied DC voltage. High Q ceramic capacitors, the applied voltage shall be not gre

    36、ater than 80 percent of the vendor rated value. 2/ Semiconductor devices shall be mounted and operated in such manner to insure worst-case junction temperature d all packages within the amplifier, including chassis and wiring, shall be considered SRAS. Provided by IHSNot for ResaleNo reproduction or

    37、 networking permitted without license from IHS-,-,-MIL-A-55672 55 7777706 0176450 5 MIL-A-85672 (AS) a a 8 3.4.2.1 Compatibility with ATE. The amplifier shall be compatible with Automatic Test Equipment (ATE) for fault verification. 3.4.2.2 Maintainability design. All electrical or electronic circui

    38、ts and parts shall be packaged on replaceable and repairable, plug-in modules. Circuit breakers, indicators, and other items which may logically be bolted and soldered, or otherwise more rigidly electrically and mechanically fastened to the amplifier housing shall not be considered modules. SRAs (Sh

    39、op Replacement Assembl tes) shall be QRAs (Quick Replaceable Assemblies) as specified in MIL-STD-2076. SRA arrangementshall be such that access to any SRA does not require the removal of adjacent SRAs or parts other than access panels, The use of a special tool or tools shall not be required for SRA

    40、 removal. Fuses may be used in lieu of circuit breakers. 3.4.2.2.1 Keying. Connectors shall be keyed to prevent the insertion of a connector or subassembly into an improper location within or on the amp1 i fi er. 3.4.2.2.2 Access panel s. Access panels shall be retained by fasteners - suitable to th

    41、e procuring agency. 3.4.2.2.3 Service access. Fasteners required for removal of the WRA shall be held by retaining devices suitable to the procuring agency. 3.4.2.2.4 Adjustments. No adjustment or alignment shall be required at the organizational level. maintenance level (intermediate or depot), sha

    42、ll not require the removal of the part to be adjusted or aligned, or of the hardware element to which it is attached. Adjustment or alignment if required at a higher 3.4.2.2.5 Test oints. All test points shall be as specified herein to MIL-ST-415 requirements. requirements of MIL-STD-2084 are waived

    43、 where prohibited by space or circuit performance considerations. The sub-SRA test points and related connector requirements philosophy shall be reflected in appropriate maintenance data. MIL-STD-2084 and MIL-STD-415 shail be used as a guide. accommodate approve + test equipment. MIL-STD-2084 takes

    44、precedence over The sub-SRA test points and related connector 3.4.2.2.5.1 Module test points. Test points shall become accessible with minimum removal of protective covers or enclosures. 3.4.2.2.5.2 Test points utilized at intermediate or depot level. Test points shall be provided for+verification o

    45、f faulty equipments at the intermediate level and repair of equipments and modules at the depot level. 3.4.2.2.5.2.1 Power supply test points. Accessible, individual test points shall be provided on the amplifier to measure the power supply voltages. philosophy shall be reflected in appropriate main

    46、tenance data. The power supply test points and related connector requirements 3.4.2.2.6 Organizational level maintainability. The amplifier shall provide the operator or organizational maintenance technician, while airborne or on the ground with performance/readiness test and fault (GO/NO-GO) indica

    47、tion. 9 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-A-85b72 58 797770b 017b1151 7 I- MI L-A-856 72 (AS ) 3.4.2.2.6.1 Performance/readiness test requirements. BIT provisions shall be incorDorated in the amD1ifier to provide a GO/“ 0-GO indicat

    48、ion of amplifier readiness when used in conjunction with operational tests. provisions may be in conjunction with, but not necessarily as part of, the fault isolation features, The operation of the performance/readiness test provisiori shall be both a manually energized or continuous test mode of op

    49、eration. manually initiated BIT sequence and, if necessary, switches may be used in series paths for purposes of introducing BIT stimuli or nieasuring equipment performance. part of, the pcrformance/readiness test features, there shall be features incorporated which provide fault isolation to the WRA. 3.4.2.2.6.3 MTTR (mean time to repair), For organizational maintenance, the MTTR shall be not greater than 15 minutes to remove and replace and


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