1、Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S-311-M-70 Page 2 of 15 REV B 1 SCOPE 1.1 Scope. This specification establishes the general requirements to be used in the performance of Destructive Physical Analysis (DPA) for Electrical, Electronic,
2、and Electromechanical (EEE) parts. Performance of the testing required by this specification is intended to verify part lot conformance with applicable specifications and standards. 1.2 Application. This standard is intended to be referenced in part specifications or in other documents where DPA req
3、uirements are imposed, to assure that the practices, procedures, and criteria for DPA are uniformly applied. 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Government specifications and standards. The following Government specifications and standards form a part of this document to the exte
4、nt specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS), and supplement thereto, in effect on the date of the contract or purchase order. SPECIFICATIONS MILITARY STANDARDS
5、 MILITARY MIL-STD-202 Test Method Standard Electronic and Electrical Component Parts MIL-STD-750 Test Method Standard Test Methods for Semiconductor Devices MILSTD883 Test Method Standard Microcircuits MILSTD1580 Test Method Standard Destructive Physical Analysis for Electronic, Electromagnetic, and
6、 Electromechanical Parts Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S-311-M-70 Page 3 of 15 REV B 2.2 NonGovernment publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, th
7、e issues of the documents which are DOD adopted are those listed in the issue of the DODISS in effect on the date of the contract or purchase order. Unless otherwise specified, the issues of documents not listed in the DODISS are the issues of the documents in effect on the date of the contract or p
8、urchase order. ESD Association Standard ANSI/ESD S20.20 ESD Association Standard for the Development of an Electrostatic Discharge Control Program for Protection of Electrical and Electronic Parts, Assemblies, and Equipment (Excluding Electrically Initiated Explosive Devices). 2.3 Order of precedenc
9、e. In the event of a conflict between the text of this specification and the references cited herein, the text of this specification shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3 DEFINITIONS 3.1 F
10、inish. As used herein, the term “finish” is used to describe all of the following: surface finish; surface plating; solder coating; solder plating. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S-311-M-70 Page 4 of 15 REV B 4 REQUIREMENTS 4.1 Gener
11、al Requirements. General requirements for this specification shall be as specified in MIL-STD-1580, Section 4, except as modified herein. DPA shall be performed on each lot or date or batch code, as applicable, used in flight hardware. 4.1.1 Large Lot Sampling Plan. The sample size, for lots where t
12、he procurement quantity of a single lot/date/batch code is greater than two hundred (200) pieces, shall be as specified in MIL-STD-1580, paragraph 4.1.1. 4.1.2 Small Lot Sampling Plan. The sample size, for lots where the procurement quantity of a single lot/date/batch code is less than two hundred (
13、200) pieces, shall be as specified in Table I herein. Table I. Small Lot DPA Sampling Plan Quantity Procured DPA Sample Size 5 1 5 15 2 16 - 50 3 51 199 5 4.1.3 Elemental Materials Analysis. All parts subjected to DPA, in accordance with this specification, shall have all internal and external metal
14、lization inspected for prohibited materials, including solders, platings, and finishes, using Energy Dispersive X-ray Spectroscopy (EDS/EDX), X-ray Fluorescence (XRF), or another GSFC approved method. Visual inspection is not an approved method. Detailed results of all assays including, as a minimum
15、, layer thickness and element percent by weight, shall be included in the final DPA report. Inspection is not required for die metallization or wire bonds. 4.1.3.1 Prohibited Materials. The presence of Cadmium (Cd) or Selenium (Se) in any amount shall be cause for lot failure. The presence of pure Z
16、inc (Zn) or a pure Zinc finish shall be cause for lot failure. 4.1.3.1.1 Zinc is not a cause for rejection when it is in an alloy form (e.g. brass, Cu and Zn). 4.1.3.2 Prohibited Finishes and solders. The presence of pure Tin (Sn) finishes and solders are prohibited, and are cause for lot rejection.
17、 Finishes and solders containing tin with materials other than lead are prohibited and are cause for lot rejection. 4.1.3.2.1 Tin (Sn) finishes or solders shall contain a minimum of 3% Lead (Pb) by weight, to be considered acceptable. Tin (Sn) finishes or solders with 3% Lead (Pb) by weight are caus
18、e for lot rejection. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S-311-M-70 Page 5 of 15 REV B 4.1.3.2.2 Gold Tin eutectic (80Au/20Sn) solder, when used for die and lid attach, is acceptable, and shall not be cause for lot rejection. 4.1.3 ESD Ha
19、ndling Precautions. Many of the devices submitted for DPA are sensitive to ESD classifications of 1C or lower. Because of this wide ranging sensitivity, an ESD handling process, in accordance with ANSI ESD S20.20 shall be in place, and ESD handling precautions shall be observed such that damage is n
20、ot introduced into the specimens during the initial processing. 4.2 Detailed Requirements. Detailed requirements shall be as specified by the appropriate test requirement of MIL-STD-1580, and as modified herein. 4.2.1 Capacitors. DPA for capacitors shall be performed in accordance with MIL-STD-1580,
21、 Requirement 10. 4.2.1.1 Electrical Verification. Any capacitor submitted for DPA in accordance with this specification that has not yet completed 100% screening shall be tested electrically at +25C (Capacitance and Dissipation Factor), prior to the performance of the required detail procedures spec
22、ified in MIL-STD-1580, Requirement 10. 4.2.2 Connectors. DPA for connectors shall be performed in accordance with MIL-STD-1580, Requirement 11. 4.2.3 Quartz Crystals. DPA for quartz crystals shall be performed in accordance with MIL-STD-1580, Requirement 12. 4.2.4 Diodes. DPA for diodes shall be per
23、formed in accordance with MIL-STD-1580, Requirement 13, and as specified herein. 4.2.4.1 Hermetic Seal. In lieu of dye penetrant leak testing (MIL-STD-750, Method 1071, Condition E), MIL-STD-750, Test Method 1071, Condition CH1 or CH2 may be used. 4.2.4.2 Thermal Impedance testing. In lieu of scribe
24、 and break and cross sectioning of DPA samples, all samples may be submitted to thermal impedance testing in accordance with MIL-STD-750, Method 3101. 4.2.5 Feed Through Filters. DPA for feed through filters shall be performed in accordance with MIL-STD-1580, Requirement 14. 4.2.6 Magnetic Devices.
25、DPA for magnetic devices shall be performed in accordance with MIL-STD-1580, Requirement 15. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S-311-M-70 Page 6 of 15 REV B 4.2.7 Microcircuits. DPA for microcircuits, including monolithic microcircuits,
26、 hybrid microcircuits, plastic encapsulated microcircuits (PEMs), hybrid optocouplers, hybrid oscillators, and multi-chip modules shall be performed in accordance with MIL-STD-1580, Requirement 16. 4.2.7.1 Electrical Verification. Any microcircuits submitted for DPA in accordance with this specifica
27、tion that have not yet completed 100% screening shall be tested electrically at +25C (Group A, subgroup 1, DC parameters only), prior to the performance of the required detail procedures specified in MIL-STD-1580, Requirement 16. 4.2.7.2 Internal Gas Analysis (IGA). While it is preferred that all de
28、vices are subjected to IGA inspection, IGA shall be required for all hybrids, hybrid oscillators, multi-chip modules, programmable devices (FPGA, EEPROM, PROM), and ASIC devices, as a minimum. IGA shall be performed on three (3) samples, or 100% of the parts submitted for DPA, whichever is less. Dur
29、ing DPA, no device with an internal cavity volume that is 0.01cc or smaller shall be subjected to IGA testing, due to the non-repeatability of the results (reference DSCC letter “Problems in the Standardization on RGA For Small Volume Packages”, dated 30 July 2001). 4.2.7.3 Bond Pull. Bond pull test
30、ing shall be performed in accordance with MIL-STD-883, Method 2011, Condition D, except all wire bonds shall be pulled to destruction, and recorded. 4.2.8 Relays. DPA for relays shall be performed in accordance with MIL-STD-1580, Requirement 17. 4.2.8.1 Electrical Verification. Any relays submitted
31、for DPA in accordance with this specification that have not yet completed 100% screening shall be tested electrically at +25C, prior to the performance of the required detail procedures specified in MIL-STD-1580, Requirement 17. 4.2.8.1 Particle Impact Noise Detection (PIND). Perform PIND on all sam
32、ples, in accordance with Appendix A, herein. Appendix A herein is reproduced here for convenience, and has been taken from MIL-PRF-39016, Revision E, Amendment 2, Appendix B. 4.2.9 Resistors. DPA for resistors shall be performed in accordance with MIL-STD-1580, Requirement 18, and as specified herei
33、n. 4.2.9.1 Electrical Verification. Any resistors submitted for DPA in accordance with this specification that have not yet completed 100% screening shall be tested electrically at +25C, prior to the performance of the required detail procedures specified in MIL-STD-1580, Requirement 18. Provided by
34、 IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S-311-M-70 Page 7 of 15 REV B 4.2.10 Switches. DPA for switches shall be performed in accordance with MIL-STD-1580, Requirement 19. 4.2.11 Thermistors. DPA for thermistors shall be performed in accordance with MIL
35、-STD-1580, Requirement 20. 4.2.12 Transistors. DPA for transistors shall be performed in accordance with MIL-STD-1580, Requirement 21. 4.2.12.1 Electrical Verification. Any transistor submitted for DPA in accordance with this specification that has not yet completed 100% screening shall be tested el
36、ectrically at +25C (Group A, subgroup 2, DC parameters only), prior to the performance of the required detail procedures specified in MIL-STD-1580, Requirement 21. 4.2.12.2 Internal Gas Analysis (IGA). IGA shall be performed on three (3) samples, or 100% of the parts submitted for DPA, whichever is
37、less. During DPA, no device with an internal cavity volume that is 0.01cc or smaller shall be subjected to IGA testing, due to the non-repeatability of the results (reference DSCC letter “Problems in the Standardization on RGA For Small Volume Packages”, dated 30 July 2001). 4.2.13 RF Devices. DPA f
38、or selected RF devices shall be performed in accordance with MIL-STD-1580, Requirement 22. 4.2.13.1 Electrical Verification. Any RF device submitted for DPA in accordance with this specification that has not yet completed 100% screening shall be tested electrically at +25C (RF functional performance
39、), prior to the performance of the required detail procedures specified in MIL-STD-1580, Requirement 22. 4.2.14 Fuses. DPA for fuses shall be performed in accordance with MIL-STD-1580, Requirement 23. 4.2.15 Heaters. DPA for heaters shall be performed in accordance with MIL-STD-1580, Requirement 24.
40、 4.2.16 Parts Not Previously Identified. Parts not included in the specific categories defined by MIL-STD-1580, and within this specification, shall be subject to lot conformance evaluation through the use of a DPA. When a specific DPA requirement/procedure is not present, the Project Parts Engineer
41、 shall define a procedure for the evaluation of the devices, and submit it to the Parts Control Board for documentation and approval. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S-311-M-70 Page 8 of 15 REV B 5 Packaging and Shipping 5.1 Packaging
42、. DPA sample remains shall be packaged in such a manner as to prevent uncontrolled degradation or additional damage to the samples, from electrical, mechanical, environmental, and physical damage, during common carrier transportation to the procuring activity. 6 Notes 6.1 ESD Handling Precautions. E
43、SD handling precautions in accordance with ESD S20.20, shall be followed to the greatest extent practical, such that damage to the supplied samples is not induced during the DPA processing. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S-311-M-70 P
44、age 9 of 15 REV B Appendix A PIND Procedure for Relays Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S-311-M-70 Page 10 of 15 REV B Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S-311-M-70 Page 11
45、 of 15 REV B Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S-311-M-70 Page 12 of 15 REV B Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S-311-M-70 Page 13 of 15 REV B Provided by IHSNot for Resale
46、No reproduction or networking permitted without license from IHS-,-,-S-311-M-70 Page 14 of 15 REV B Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S-311-M-70 Page 15 of 15 REV B Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-
