1、 ENGINEERING MATERIAL SPECIFICATION Date Action Revisions Rev 03 2012 02 15 N Status No Replacement Named N. Benipal, NA 2005 09 13 Revised Inserted 3.0; deleted 3.4 and 4 1963 11 04 Released AS1#1140 Controlled document at www.MATS Copyright 2012, Ford Global Technologies, LLC Page 1 of 2 GLAZING P
2、ASTE, FILLER, SOLDER PITS ESB-M99J26-A NOT TO BE USED FOR NEW DESIGN 1. SCOPE The material defined by this specification is a zinc paste-type filler material for solder pits. 2. APPLICATION This material is generally used for filling pits in solder-filled areas on automobiles. 3. REQUIREMENTS 3.0 ST
3、ANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.1 PHYSICAL PROPERTIES 3.1.1 Color Green to grey 3.1.2 Consistency Heavy stiff paste 3.1.3 Non-Volatile, min 80.0% (FLTM B
4、I 102-01) 3.1.4 Weight per Volume, min 28.0 lb/gal (3.4 kg/l) 3.1.5 Reduction The material shall be capable of being reduced to working consistency with M-8B7-B,(Isopropyl Alcohol). 3.2 DRYING The material shall air dry satisfactorily for sanding in 5 min. 3.3 SOLDER MAPPING The material shall pass
5、the following test: Test Method: Prepare three LCOH steel panels, 3 x 9 x 0.035 in (75 x 225 x 0.91 mm). These are prepared by joining two 3 x 5 x 0.035 in (75 x 125 x 0.91 mm) LCOH steel panels together, as shown, and spot welding across the width, four welds are necessary. ENGINEERING MATERIAL SPE
6、CIFICATION ESB-M99J26-A Copyright 2012, Ford Global Technologies, LLC Page 2 of 2 Apply ESB-M11A15 Solder to cover the welds within an area of 9 sq in (58 cm) as described in Process Specification MS 2-5. Apply a thin layer of the filler material over the soldered area, filling all pits. Metal finis
7、h and phosphate coat to ESB-M3P1. Apply a production glazing material so that all of the soldered area and part of the steel are covered. Use a rubber squeegee for glaze application. Air dry for 5 to 10 min and spray one double coat, 0.00125 - 0.00175 in (32-44 m) dry film thickness, of ESB-M6J49, e
8、poxy primer surfacer, reduced to 20 s (Ford #4 Cup at 27C) with M-14J210. One test panel, of each group, shall be baked at one of each of the following baking schedules: 10 min at 205 C 20 min at 177 C 35 min at 149 C After baking, water sand with #360 paper to a prime film thickness of 0.00075 - 0.
9、001 in (20 - 25 m) as determined by measurement on either side the solder area. Force dry panels for 7 min at 121 C. Wipe clean with M-14J147 and tack off. Spray a double coat, 0.0015 - 0.0020 in (39 - 50 m) dry film thickness, of ESB-M30J100 Quality, black enamel, reduced to 20 s (Ford #4 Cup at 27
10、C) with M -14J210. Bake for 30 min at 121 C. After baking, age panels for 72 h at 23 +/- 2C, or for 16 h at 43 C. Immerse panels in distilled water at 49 C, for 16 h. Examine for film structure change. Comparison should be made of test panels with a control, for change of paint film appearance over
11、solder, as compared with change of paint film appearance over steel on the same panel. Air dry at 23 +/- 2 C for 8 h. Immerse panel again, as before, and continue cycling until film breakdown, by blistering, is complete over steel or over solder. Film failure usually occurs by appearance of fine bli
12、sters or wrinkling (solder mapping), and progresses to the appearance of humidity blisters 1/16 - 1/8 in (1.6 - 3 mm) in diameter, which have a random distribution. When blistering occurs, it should appear over the unglazed, primed and enameled steel before it appears on the solder Mapping before 192 h (8 cycles of 24 h) of this cycle test shall be cause for rejection.
