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    EN IEC 62969-3-2018 en Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3 Shock driven piezoelectric energy harvesting for automotive vehicle sensors.pdf

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    EN IEC 62969-3-2018 en Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3 Shock driven piezoelectric energy harvesting for automotive vehicle sensors.pdf

    1、BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06Semiconductor devices - Semiconductor interface for automotive vehiclesPart 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensorsBS EN IEC 629693:2018EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE

    2、 NORM EN IEC 62969-3 June 2018 ICS 31.080.99 English Version Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors (IEC 62969-3:2018) Dispositifs semiconducteurs - Interface semiconducteurs pour l

    3、es vhicules automobiles - Partie 3: Rcupration de lnergie pizolectrique produite par les chocs pour les capteurs de vhicules automobiles (IEC 62969-3:2018) Halbleiterbauelemente - Halbleiterschnittstelle fr Automobile - Teil 3: Stogefhrtes piezoelektrisches Energie-Harvesting bei Sensoren fr Automob

    4、ile (IEC 62969-3:2018) This European Standard was approved by CENELEC on 2018-06-11. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lis

    5、ts and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation u

    6、nder the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark,

    7、Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. Europea

    8、n Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwi

    9、de for CENELEC Members. Ref. No. EN IEC 62969-3:2018 E National forewordThis British Standard is the UK implementation of EN IEC 629693:2018. It is identical to IEC 629693:2018.The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors.A list of organizations

    10、 represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2018 Published by BSI Standards Limited 2018ISBN 97

    11、8 0 580 93188 8ICS 31.080.99Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 30 June 2018.Amendments/corrigenda issued since publicationDate Text affectedBRITISH

    12、STANDARDBS EN IEC 629693:2018EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN IEC 62969-3 June 2018 ICS 31.080.99 English Version Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors (IEC 629

    13、69-3:2018) Dispositifs semiconducteurs - Interface semiconducteurs pour les vhicules automobiles - Partie 3: Rcupration de lnergie pizolectrique produite par les chocs pour les capteurs de vhicules automobiles (IEC 62969-3:2018) Halbleiterbauelemente - Halbleiterschnittstelle fr Automobile - Teil 3:

    14、 Stogefhrtes piezoelektrisches Energie-Harvesting bei Sensoren fr Automobile (IEC 62969-3:2018) This European Standard was approved by CENELEC on 2018-06-11. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard

    15、 the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (Englis

    16、h, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of A

    17、ustria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slo

    18、venia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels 2018 CENELEC

    19、 All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN IEC 62969-3:2018 E BS EN IEC 629693:2018EN IEC 62969-3:2018 2 European foreword The text of document 47/2461/FDIS, future edition 1 of IEC 62969-3, prepared by IEC/TC 47 “Semiconductor device

    20、s“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN IEC 62969-3:2018. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2019-03-11 latest date b

    21、y which the national standards conflicting with the document have to be withdrawn (dow) 2021-06-11 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights

    22、. Endorsement notice The text of the International Standard IEC 62969-3:2018 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 62047-5:2011 NOTE Harmonized as EN 62

    23、047-5:2011 (not modified). IEC 62047-7:2011 NOTE Harmonized as EN 62047-7:2011 (not modified). BS EN IEC 629693:2018EN IEC 62969-3:2018 3 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents are referred to in

    24、the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 Where an International Publicatio

    25、n has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu. Publication Year Title EN/HD Year IEC 60749-5 - Semiconductor devices -

    26、Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test EN 60749-5 - IEC 60749-10 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock EN 60749-10 - IEC 60749-12 - Semiconductor devices - Mechanical and climatic test metho

    27、ds - Part 12: Vibration, variable frequency EN IEC 60749-12 - IEC 62830-1 - Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting - - BS EN IEC 629693:2018This page deliberately left blank 2 IEC 62969-3:2018 IEC 2

    28、018 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope 7 2 Normative references 7 3 Terms and definitions 7 3.1 General terms . 8 3.2 Piezoelectric transducer 9 3.3 Characteristic parameters . 10 4 Essential ratings and characteristic parameters . 11 4.1 Identification and type . 11 4.2 Limiting values

    29、and operating conditions . 11 4.3 Additional information . 12 5 Test method 12 5.1 General . 12 5.2 Electrical characteristics . 13 5.2.1 Test procedure 13 5.2.2 Capacitance 14 5.2.3 Natural frequency 14 5.2.4 Damping ratio 15 5.2.5 Output voltage . 15 5.2.6 Output current . 16 5.2.7 Output power .

    30、16 5.2.8 Optimal load impedance 17 5.2.9 Maximum output power 17 5.3 Mechanical characteristics 18 5.3.1 Test procedure 18 5.3.2 Temperature range 19 5.3.3 Shock magnitude . 20 5.3.4 Temperature and humidity testing 20 5.3.5 Mechanical reliability (shock) testing . 20 Annex A (informative) Mechanica

    31、l shock pulses . 21 Annex B (informative) Electromechanical coupling . 23 B.1 Compliance and coupling coefficient relation. 23 B.2 Youngs modulus and coupling coefficient relation 23 Bibliography 24 Figure 1 Shock driven energy harvester using cantilever with piezoelectric film 8 Figure 2 Conceptual

    32、 diagram of shock driven piezoelectric energy harvester 9 Figure 3 Equivalent circuit of shock driven piezoelectric energy harvester 10 Figure 4 Measurement procedure of shock driven piezoelectric energy harvester 13 Figure 5 Test setup for the electrical characteristics of shock driven piezoelectri

    33、c energy harvester . 14 Figure 6 Output waveform and its frequency component of a shock driven piezoelectric energy harvester 15 Figure 7 Output voltages of shock excited piezoelectric energy harvester at various external loads . 16 2 IEC 62969-3:2018 IEC 2018 CONTENTS FOREWORD . 4 INTRODUCTION . 6

    34、1 Scope 7 2 Normative references 7 3 Terms and definitions 7 3.1 General terms . 8 3.2 Piezoelectric transducer 9 3.3 Characteristic parameters . 10 4 Essential ratings and characteristic parameters . 11 4.1 Identification and type . 11 4.2 Limiting values and operating conditions . 11 4.3 Additiona

    35、l information . 12 5 Test method 12 5.1 General . 12 5.2 Electrical characteristics . 13 5.2.1 Test procedure 13 5.2.2 Capacitance 14 5.2.3 Natural frequency 14 5.2.4 Damping ratio 15 5.2.5 Output voltage . 15 5.2.6 Output current . 16 5.2.7 Output power . 16 5.2.8 Optimal load impedance 17 5.2.9 Ma

    36、ximum output power 17 5.3 Mechanical characteristics 18 5.3.1 Test procedure 18 5.3.2 Temperature range 19 5.3.3 Shock magnitude . 20 5.3.4 Temperature and humidity testing 20 5.3.5 Mechanical reliability (shock) testing . 20 Annex A (informative) Mechanical shock pulses . 21 Annex B (informative) E

    37、lectromechanical coupling . 23 B.1 Compliance and coupling coefficient relation. 23 B.2 Youngs modulus and coupling coefficient relation 23 Bibliography 24 Figure 1 Shock driven energy harvester using cantilever with piezoelectric film 8 Figure 2 Conceptual diagram of shock driven piezoelectric ener

    38、gy harvester 9 Figure 3 Equivalent circuit of shock driven piezoelectric energy harvester 10 Figure 4 Measurement procedure of shock driven piezoelectric energy harvester 13 Figure 5 Test setup for the electrical characteristics of shock driven piezoelectric energy harvester . 14 Figure 6 Output wav

    39、eform and its frequency component of a shock driven piezoelectric energy harvester 15 Figure 7 Output voltages of shock excited piezoelectric energy harvester at various external loads . 16 BS EN IEC 629693:2018IEC 62969-3:2018 IEC 2018 3 Figure 8 Output currents of shock driven piezoelectric energy

    40、 harvester at various output voltages . 16 Figure 9 Output power of shock driven piezoelectric energy harvester at various external loads . 17 Figure 10 Output power and voltage of shock driven piezoelectric energy harvester at various shock amplitudes 18 Figure 11 Block diagram of a test setup for

    41、evaluating the reliability of shock driven piezoelectric energy harvester 19 Figure A.1 Comparison of general shock patterns and shock pattern from automobile . 21 Figure A.2 Impact (or shock) recorded by an electronic impact recorder 22 Table 1 Specification parameters for shock driven piezoelectri

    42、c energy harvesters 11 BS EN IEC 629693:2018 4 IEC 62969-3:2018 IEC 2018 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES SEMICONDUCTOR INTERFACE FOR AUTOMOTIVE VEHICLES Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors FOREWORD 1) The International

    43、 Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fi

    44、elds. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any I

    45、EC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardiza

    46、tion (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has represen

    47、tation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC ca

    48、nnot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publicati

    49、ons. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users shoul


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