1、BSI Standards PublicationTest methods for electrical materials, printed boards and other interconnection structures and assembliesPart 5-3: General test methods for materials and assemblies Soldering paste for printed board assembliesBS IEC 61189-5-3:2015BS EN 61189-5-3:2015BS EN 61189-5-3:2015 BRIT
2、ISH STANDARDNational forewordThis British Standard is the UK implementation of EN 61189-5-3:2015. It is identical to IEC 61189-5-3:2015. It supersedes BS IEC 61189-5-3:2015, which is withdrawn.The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic Assembly T
3、echnology.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2015. Published by
4、 BSI Standards Limited 2015ISBN 978 0 580 90019 8ICS 31.180Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 January 2015.Amendments/corrigenda issued since pub
5、licationDate Text affected30 April 2015 This corrigendum renumbers BS IEC 61189-5-3:2015 as BS EN 61189-5-3:2015EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 61189-5-3 March 2015 ICS 31.180 English Version Test methods for electrical materials, printed boards and other interconnection structu
6、res and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015) Mthodes dessai pour les matriaux lectriques, les cartes imprimes et autres structures dinterconnexion et ensembles - Partie 5-3: Mthodes dessai gnrales
7、 pour les matriaux et les assemblages - Pte de brasage pour les assemblages de cartes imprimes (IEC 61189-5-3:2015) Prfverfahren fr Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen - Teil 5-3: Allgemeine Prfverfahren fr Materialien und Baugruppen - Lotpaste fr bestck
8、te Leiterplatten (IEC 61189-5-3:2015) This European Standard was approved by CENELEC on 2015-02-12. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration.
9、 Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made b
10、y translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Repu
11、blic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom.
12、European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2015 CENELEC All rights of exploitation in any form and by any means reserved worl
13、dwide for CENELEC Members. Ref. No. EN 61189-5-3:2015 E EN 61189-5-3:2015 - 2 - Foreword The text of document 91/1211/FDIS, future edition 1 of IEC 61189-5-3, prepared by IEC/TC 91 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 61189-5-
14、3:2015. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2015-11-12 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 20
15、18-02-12 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 61189-5-3:2015
16、was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60068-1:2013 NOTE Harmonized as EN 60068-1:2014 (not modified). IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20. I
17、EC 61189-1 NOTE Harmonized as EN 61189-1. IEC 61189-2 NOTE Harmonized as EN 61189-2. IEC 61189-3 NOTE Harmonized as EN 61189-3. IEC 61190-1-1 NOTE Harmonized as EN 61190-1-1. IEC 61249-2-7 NOTE Harmonized as EN 61249-2-7. IEC 62137:2004 NOTE Harmonized as EN 62137:2004 (not modified). ISO 9001 NOTE
18、Harmonized as EN ISO 9001. ISO 9455-2 NOTE Harmonized as EN ISO 9455-2. 2 BS EN 61189-5-3:2015EN 61189-5-3:2015EN 61189-5-3:2015 - 2 - Foreword The text of document 91/1211/FDIS, future edition 1 of IEC 61189-5-3, prepared by IEC/TC 91 “Electronics assembly technology“ was submitted to the IEC-CENEL
19、EC parallel vote and approved by CENELEC as EN 61189-5-3:2015. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2015-11-12 latest date by which the national standards conf
20、licting with the document have to be withdrawn (dow) 2018-02-12 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The
21、 text of the International Standard IEC 61189-5-3:2015 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60068-1:2013 NOTE Harmonized as EN 60068-1:2014 (not modifi
22、ed). IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20. IEC 61189-1 NOTE Harmonized as EN 61189-1. IEC 61189-2 NOTE Harmonized as EN 61189-2. IEC 61189-3 NOTE Harmonized as EN 61189-3. IEC 61190-1-1 NOTE Harmonized as EN 61190-1-1. IEC 61249-2-7 NOTE Harmonized as EN 61249-2-7. IEC 62137:2004 NOTE Har
23、monized as EN 62137:2004 (not modified). ISO 9001 NOTE Harmonized as EN ISO 9001. ISO 9455-2 NOTE Harmonized as EN ISO 9455-2. - 3 - EN 61189-5-3:2015 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in wh
24、ole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 When an International Publicat
25、ion has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu Publication Year Title EN/HD Year IEC 61189-5 - Test methods for electr
26、ical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies EN 61189-5 - IEC 61189-6 - Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies E
27、N 61189-6 - IEC 61190-1-2 2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly EN 61190-1-2 2014 IEC 61190-1-3 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grad
28、e solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications EN 61190-1-3 - 3 BS EN 61189-5-3:2015EN 61189-5-3:2015 2 IEC 61189-5-3:2015 IEC 2015 CONTENTS FOREWORD . 5 INTRODUCTION . 7 1 Scope 8 2 Normative references 8 3 Accuracy, precision and resolution 8 3.1 Gene
29、ral . 8 3.2 Accuracy . 9 3.3 Precision . 9 3.4 Resolution 10 3.5 Report. 10 3.6 Students t distribution 10 3.7 Suggested uncertainty limits . 11 4 X: Miscellaneous test methods 12 4.1 Test 5-3X01: Paste flux viscosity T-Bar spindle method . 12 Object 12 4.1.1Test specimen . 12 4.1.2Apparatus and rea
30、gents . 12 4.1.3Procedure 12 4.1.4Safety notes 12 4.1.54.2 Test 5-3X02: Spread test, extracted solder flux, paste flux and solder paste . 12 Object 12 4.2.1Method A . 13 4.2.2Method B . 14 4.2.3Additional information 15 4.2.44.3 Test 5-3X03: Solder paste viscosity T-Bar spin spindle method (applicab
31、le for 300 Pas to 1 600 Pas) . 15 Object 15 4.3.1Test specimen . 15 4.3.2Equipment/apparatus . 15 4.3.3Procedure 16 4.3.4Evaluation . 16 4.3.5Additional information 16 4.3.64.4 Test 5-3X04: Solder paste viscosity T-Bar spindle method (applicable to 300 Pas) 16 Object 16 4.4.1Test specimen . 17 4.4.2
32、Equipment/apparatus . 17 4.4.3Procedure 17 4.4.4Evaluation . 17 4.4.5Additional information 17 4.4.64.5 Test 5-3X05: Solder paste viscosity Spiral pump method (applicable for 300 Pas to 1 600 Pas) 18 Object 18 4.5.1Test specimen . 18 4.5.2Equipment/apparatus . 18 4.5.3Procedure 18 4.5.4BS IEC 61189-
33、5-3:2015BS EN 61189-5-3:2015IEC 61189-5-3:2015 IEC 2015 4 791010101011111212121314141414141414141415161717171717181818181819191919192020202020 2 IEC 61189-5-3:2015 IEC 2015 CONTENTS FOREWORD . 5 INTRODUCTION . 7 1 Scope 8 2 Normative references 8 3 Accuracy, precision and resolution 8 3.1 General .
34、8 3.2 Accuracy . 9 3.3 Precision . 9 3.4 Resolution 10 3.5 Report. 10 3.6 Students t distribution 10 3.7 Suggested uncertainty limits . 11 4 X: Miscellaneous test methods 12 4.1 Test 5-3X01: Paste flux viscosity T-Bar spindle method . 12 Object 12 4.1.1Test specimen . 12 4.1.2Apparatus and reagents
35、. 12 4.1.3Procedure 12 4.1.4Safety notes 12 4.1.54.2 Test 5-3X02: Spread test, extracted solder flux, paste flux and solder paste . 12 Object 12 4.2.1Method A . 13 4.2.2Method B . 14 4.2.3Additional information 15 4.2.44.3 Test 5-3X03: Solder paste viscosity T-Bar spin spindle method (applicable for
36、 300 Pas to 1 600 Pas) . 15 Object 15 4.3.1Test specimen . 15 4.3.2Equipment/apparatus . 15 4.3.3Procedure 16 4.3.4Evaluation . 16 4.3.5Additional information 16 4.3.64.4 Test 5-3X04: Solder paste viscosity T-Bar spindle method (applicable to 300 Pas) 16 Object 16 4.4.1Test specimen . 17 4.4.2Equipm
37、ent/apparatus . 17 4.4.3Procedure 17 4.4.4Evaluation . 17 4.4.5Additional information 17 4.4.64.5 Test 5-3X05: Solder paste viscosity Spiral pump method (applicable for 300 Pas to 1 600 Pas) 18 Object 18 4.5.1Test specimen . 18 4.5.2Equipment/apparatus . 18 4.5.3Procedure 18 4.5.4BS IEC 61189-5-3:20
38、15IEC 61189-5-3:2015 IEC 2015 3 Evaluation . 18 4.5.5Additional information 18 4.5.64.6 Test 5-3X06: Solder paste viscosity Spiral pump method (applicable to 300 Pas) . 19 Object 19 4.6.1Test specimen . 19 4.6.2Equipment/apparatus . 19 4.6.3Procedure 19 4.6.4Evaluation . 19 4.6.5Additional informati
39、on 19 4.6.64.7 Test 5-3X07: Solder paste Slump test 20 Object 20 4.7.1Test specimen . 20 4.7.2Equipment/apparatus . 20 4.7.3Procedure 20 4.7.4Evaluation . 22 4.7.54.8 Test 5-3X08: Solder paste Solder ball test . 22 Object 22 4.8.1Test specimen . 23 4.8.2Equipment/apparatus . 23 4.8.3Procedure 23 4.8
40、.4Evaluation . 24 4.8.54.9 Test 5-3X09: Solder paste Tack test 25 Object 25 4.9.1Method A . 25 4.9.2Method B . 26 4.9.3Test equipment sources . 27 4.9.44.10 Test 5-3X10: Solder paste Wetting test 27 Object 27 4.10.1Test specimen . 27 4.10.2Equipment/materials/apparatus 27 4.10.3Procedure 27 4.10.4Ev
41、aluation . 28 4.10.54.11 Test 5-3X11: Determination of solder powder particle size distribution Screen method for types 1-4 . 28 Object 28 4.11.1Test specimen . 28 4.11.2Equipment/apparatus . 28 4.11.3Procedure 28 4.11.44.12 Test 5-3X12: Solder powder particle size distribution Measuring microscope
42、method . 30 Object 30 4.12.1Test specimen . 30 4.12.2Equipment/apparatus . 30 4.12.3Procedure 30 4.12.44.13 Test 5-3X13: Solder powder particle size distribution Optical image analyser method . 31 Object 31 4.13.1Test specimen . 31 4.13.2Equipment/apparatus . 31 4.13.3BS IEC 61189-5-3:2015BS EN 6118
43、9-5-3:2015IEC 61189-5-3:2015 IEC 2015 5 20202121212121212122222222222424242525252627272728292929292929303030303030323232323233333333 4 IEC 61189-5-3:2015 IEC 2015 Procedure 32 4.13.44.14 Test 5-3X14: Solder powder particle size distribution Measuring laser diffraction method . 33 Object 33 4.14.1Tes
44、t specimen . 33 4.14.2Equipment/apparatus . 33 4.14.3Preparation 34 4.14.4Test procedure 34 4.14.5Test . 34 4.14.6Evaluation . 34 4.14.74.15 Test 5-3X15: Determination of maximum solder powder particle size 35 Object 35 4.15.1Test specimen . 35 4.15.2Evaluation . 35 4.15.34.16 Test 5-3X16: Solder pa
45、ste metal content by weight . 36 Object 36 4.16.1Test specimen . 36 4.16.2Equipment/apparatus . 36 4.16.3Procedure 36 4.16.4Annex A (informative) Typical comparison of particle size distributions between laser diffraction method and screen method 38 Bibliography 39 Figure 1 Slump test stencil thickn
46、ess, 0,20 mm 21 Figure 2 Slump test stencil thickness, 0,10 mm 21 Figure 3 Solder-ball test evaluation 24 Figure 4 Solder wetting examples 28 Figure A.1 Typical comparison between laser diffraction and sieving . 38 Table 1 Students t distribution . 11 Table 2 Typical spread areas defined in mm213 Ta
47、ble 3 Example of a test report Stencil thickness, 0,2 mm . 22 Table 4 Example of a test report Stencil thickness, 0,1 mm . 22 Table 5 Screen opening . 29 Table 6 Portions of particle sizes by weight % nominal values 30 Table 7 Powder particle size distribution record . 30 Table 8 Powder particle siz
48、e distribution record . 31 Table 9 Powder particle size distribution record (optical analysis) 33 Table 10 Powder particle size distribution record . 34 Table 11 Acceptance of powders by particle sizes . 36 Table 12 Example of a test report on solder paste . 37 BS IEC 61189-5-3:2015BS EN 61189-5-3:2
49、015IEC 61189-5-3:2015 IEC 2015 6 34353535353636363637373737383838383840412323263040131524243132323335363839 4 IEC 61189-5-3:2015 IEC 2015 Procedure 32 4.13.44.14 Test 5-3X14: Solder powder particle size distribution Measuring laser diffraction method . 33 Object 33 4.14.1Test specimen . 33 4.14.2Equipment/apparatus . 33 4.14.3Preparation 34 4.14.4Test procedure 34 4.14.5Test . 34 4.14.6Evaluation . 34 4.14.74.1
