1、Synthetic quartz crystal Specifications and guidelines for useBS EN 60758:2016BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06National forewordThis British Standard is the UK implementation of EN 60758:2016. It is identical to IEC 60758:2016. It supersedes BS EN 6075
2、8:2009 which is withdrawn.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/49, Piezoelectric devices for frequency control and selection.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport t
3、o include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2016.Published by BSI Standards Limited 2016ISBN 978 0 580 82515 6ICS 31.140Compliance with a British Standard cannot confer immunity fromlegal obligations.This
4、British Standard was published under the authority of theStandards Policy and Strategy Committee on 30 September 2016.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 60758:2016EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 60758 September 2016 ICS 31.140 S
5、upersedes EN 60758:2009 English Version Synthetic quartz crystal - Specifications and guidelines for use (IEC 60758:2016) Cristal de quartz synthtique - Spcifications et lignes directrices dutilisation (IEC 60758:2016) Synthetischer Quarzkristall - Festlegungen und Leitfaden fr die Anwendung (IEC 60
6、758:2016) This European Standard was approved by CENELEC on 2016-06-22. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and biblio
7、graphical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the resp
8、onsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finl
9、and, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Elect
10、rotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2016 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. R
11、ef. No. EN 60758:2016 E BS EN 60758:2016EN 60758:2016 2 European foreword The text of document 49/1185/FDIS, future edition 5 of IEC 60758, prepared by IEC/TC 49 “Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection” was submitte
12、d to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60758:2016. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2017-04-07 latest date by which the national
13、standards conflicting with the document have to be withdrawn (dow) 2019-10-07 This document supersedes EN 60758:2009. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying
14、 any or all such patent rights. Endorsement notice The text of the International Standard IEC 60758:2016 was approved by CENELEC as a European Standard without any modification. BS EN 60758:2016EN 60758:2016 3 Annex ZA (normative) Normative references to international publications with their corresp
15、onding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any
16、 amendments) applies. NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu Publication
17、Year Title EN/HD Year IEC 60068-1 2013 Environmental testing - Part 1: General and guidance EN 60068-1 2014 IEC 60122-1 2002 Quartz crystal units of assessed quality - Part 1: Generic specification EN 60122-1 2002 IEC 60410 - Sampling plans and procedures for inspection by attributes - - IEC 61994 S
18、eries Piezoelectric and dielectric devices for frequency control and selection - Glossary - - BS EN 60758:2016 2 IEC 60758:2016 IEC 2016 CONTENTS FOREWORD . 6 INTRODUCTION . 8 1 Scope 9 2 Normative references. 9 3 Terms and definitions 9 4 Specification for synthetic quartz crystal . 13 4.1 Standard
19、 values 13 4.1.1 Shape of synthetic quartz for optical applications 13 4.1.2 Orientation of the seed . 13 4.1.3 Inclusion density 13 4.1.4 Striae in synthetic quartz for optical applications . 14 4.1.5 Infrared quality indications of 3 500 and 3 585for piezoelectric applications . 14 4.1.6 Grade cla
20、ssification by value and Schlieren method for optical applications . 15 4.1.7 Frequency-temperature characteristics of synthetic quartz for piezoelectric applications . 15 4.1.8 Etch channel density . 15 4.1.9 Internal transmittance for optical applications . 16 4.2 Requirements and measuring method
21、s 17 4.2.1 Orientation . 17 4.2.2 Handedness . 18 4.2.3 Synthetic quartz crystal dimensions 18 4.2.4 Seed dimensions . 19 4.2.5 Imperfections . 19 4.2.6 Evaluation of infrared quality by measurement . 22 4.2.7 Frequency versus temperature characteristics for piezoelectric applications . 24 4.2.8 Str
22、iae in synthetic quartz for optical applications . 25 4.2.9 Growth band in synthetic quartz for optical applications 25 4.2.10 Etch channel density 26 4.2.11 Internal transmittance for optical applications . 27 4.3 Marking . 27 4.3.1 General . 27 4.3.2 Shipping requirements . 28 5 Specification for
23、lumbered synthetic quartz crystal . 28 5.1 Standard values 28 5.1.1 Tolerance of dimensions 28 5.1.2 Reference surface flatness . 29 5.1.3 Angular tolerance of reference surface . 29 5.1.4 Centrality of the seed . 30 5.2 Requirements and measuring methods 31 5.2.1 As-grown quartz bars used for lumbe
24、red quartz bars 31 5.2.2 Dimensions of lumbered synthetic quartz crystal . 31 5.2.3 Identification on reference surface 31 5.2.4 Measurement of reference surface flatness . 31 BS EN 60758:2016IEC 60758:2016 IEC 2016 3 5.2.5 Measurement of reference surface angle tolerance . 31 5.2.6 Centrality of th
25、e seed . 31 5.3 Delivery conditions 32 5.3.1 General . 32 5.3.2 Marking . 32 5.3.3 Packing . 32 5.3.4 Making batch . 32 6 Inspection rule for synthetic quartz crystal and lumbered synthetic quartz crystal 32 6.1 Inspection rule for as-grown synthetic quartz crystal 32 6.1.1 Inspection 32 6.1.2 Lot-b
26、y-lot test . 32 6.2 Inspection rule for lumbered synthetic quartz crystal 33 6.2.1 General . 33 6.2.2 Lot-by-lot test . 34 7 Guidelines for the use of synthetic quartz crystal for piezoelectric applications 34 7.1 General . 34 7.1.1 Overview . 34 7.1.2 Synthetic quartz crystal 34 7.2 Shape and size
27、of synthetic quartz crystal . 35 7.2.1 Crystal axis and face designation . 35 7.2.2 Seed 36 7.2.3 Shapes and dimensions . 36 7.2.4 Growth zones . 37 7.3 Standard method for evaluating the quality of synthetic quartz crystal 37 7.4 Other methods for checking the quality of synthetic quartz crystal 38
28、 7.4.1 General . 38 7.4.2 Visual inspection 38 7.4.3 Infrared radiation absorption method 38 7.4.4 Miscellaneous 39 7.5 grade for piezoelectric quartz . 40 7.6 Optional grading (only as ordered), in inclusions, etch channels, Al content 40 7.6.1 Inclusions 40 7.6.2 Etch channels 40 7.6.3 Al content
29、40 7.6.4 Swept quartz 41 7.7 Ordering . 42 (informative) Frequently used sampling procedures . 43 Annex AA.1 Complete volume counting 43 A.2 Commodity Y-bar sampling Method 1 43 A.3 Commodity Y-bar sampling Method 2 43 A.4 Use of comparative standards for 100 % crystal inspection 44 (informative) Nu
30、merical example . 45 Annex B(informative) Example of reference sample selection . 46 Annex C(informative) Explanations of point callipers 47 Annex D(informative) Infrared absorbance value compensation . 48 Annex EE.1 General . 48 E.2 Sample preparation, equipment set-up and measuring procedure . 48
31、E.2.1 General . 48 BS EN 60758:2016 4 IEC 60758:2016 IEC 2016 E.2.2 Sample preparation 48 E.2.3 Equipment set-up . 48 E.2.4 Measurement procedure . 49 E.3 Procedure to establish correction terms . 49 E.4 Calculation of compensated (corrected) absorbance values . 51 (informative) Differences of the o
32、rthogonal axial system for quartz between Annex FIEC standard and IEEE standard . 52 (informative) value measurement consistency between dispersive infrared Annex Gspectrometer and fourier transform infrared spectrometer 54 G.1 General . 54 G.2 Experiment . 54 G.3 Experimental result . 55 Bibliograp
33、hy . 58 Figure 1 Quartz crystal axis and cut direction . 17 Figure 2 Idealized sections of a synthetic quartz crystal grown on a Z-cut seed . 19 Figure 3 Typical example of cutting wafers of AT-cut plate, minor rhombohedral-cut plate, X-cut plate, Y-cut plate and Z-cut plate 21 Figure 4 Frequency-te
34、mperature characteristics deviation rate of the test specimen . 25 Figure 5 Typical schlieren system setup . 25 Figure 6 Lumbered synthetic quartz crystal outline and dimensions along X-, Y- and Z-axes 29 Figure 7 Angular deviation for reference surface . 30 Figure 8 Centrality of the seed with resp
35、ect to the dimension along the Z- or Z-axis 31 Figure 9 Quartz crystal axis and face designation . 36 Figure 10 Synthetic quartz crystal grown on a Z-cut seed of small X-dimensions . 37 Figure 11 Example of a relation between the value and the Q value at wave number 3 500 cm-1. 39 Figure D.1 Point c
36、allipers . 47 Figure D.2 Digital point callipers . 47 Figure E.1 Schematic of measurement set-up . 49 Figure E.2 Graph relationship between averaged and measured at two wave numbers of 3 500and 3 585. 50 Figure F.1 Left- and right-handed quartz crystals 53 Figure G.1 Relationship of between measurin
37、g value and reference value 57 Table 1 Inclusion density grades for piezoelectric applications 14 Table 2 Inclusion density grades for optical applications . 14 Table 3 Infrared absorbance coefficient grades for piezoelectric applications 14 Table 4 Infrared absorbance coefficient grades and Schlier
38、en method for optical applications 15 Table 5 Etch channel density grades for piezoelectric applications 16 Table 6 Test conditions and requirements for the lot-by-Iot test for group A . 33 Table 7 Test conditions and requirements for the lot-by-lot test for group B . 33 Table 8 Test conditions and
39、requirements for the lot-by-lot test . 34 Table B.1 Commodity bar sampling, method 1 45 BS EN 60758:2016IEC 60758:2016 IEC 2016 5 Table B.2 Commodity bar sampling 45 Table E.1 Example of calibration data at 3 585. 50 Table E.2 Example of calibration data at 3 500. 50 BS EN 60758:2016 6 IEC 60758:201
40、6 IEC 2016 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SYNTHETIC QUARTZ CRYSTAL SPECIFICATIONS AND GUIDELINES FOR USE FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Comm
41、ittees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Avail
42、able Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental org
43、anizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical
44、 matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC Na
45、tional Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity
46、, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC i
47、tself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure tha
48、t they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nat
49、ure whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of
