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    EIA ECA-576-B-2014 Resistors Rectangular Surface Mount Precision.pdf

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    EIA ECA-576-B-2014 Resistors Rectangular Surface Mount Precision.pdf

    1、 EIA STANDARD Resistors, Rectangular, Surface Mount Precision EIA/ECA-576-B (Revision of EIA/ECA-576-A) May 2014 EIA/ECA-576-B ANSI/EIA-576-B-2014 Approved: May 9, 2014 NOTICE EIA Engineering Standards and Publications are designed to serve the public interest through eliminating misunderstandings b

    2、etween manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any m

    3、ember or nonmember of ECIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than ECIA members, whether the standard is to be used either domestically or int

    4、ernationally. Standards and Publications are adopted by ECIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, ECIA does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the Standard or Publi

    5、cation. This EIA Standard is considered to have International Standardization implication, but the International Electrotechnical Commission activity has not progressed to the point where a valid comparison between the EIA Standard and the IEC document can be made. This Standard does not purport to

    6、address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the applicability of regulatory limitations before its use. (From Standards Propo

    7、sal No. 5242, formulated under the cognizance of the P-1 Committee on EIA National Resistive Devices Standards). Published by Electronic Components Industry Association 2014 Engineering Department 2214 Rock Hill Road, Suite 265 Herndon, VA 20170 PLEASE! DONT VIOLATE THE LAW! This document is copyrig

    8、hted by the ECIA and may not be reproduced without permission. Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. For information, contact: IHS 15 Inverness Way East Englewood, CO 80112-5704 or call USA and Canada (1-877-413-5184),

    9、International (303-397-7956) i CONTENTS Clause Page 1.0 Scope . 1 2.0 Definitions 5 3.0 Standard Tests 5 4.0 Quality Assessment 11 Figures Page Ambient Temperature in Degrees Celsius . 5 Tables I 2 II 3 III 3 IV 4 V 12 EIA/ECA-576-B Page 1 RESISTORS, RECTANGULAR, SURFACE MOUNT PRECISION (From Standa

    10、rds Proposal No. 5242, formulated under the cognizance of the EIA P-1.2 Subcommittee on Non-Wirewound Fixed Resistors.) 1.0 SCOPE This standard covers thin film precision rectangular leadless discrete fixed resistors with temperature coefficients of 50 PPM/C and tighter and resistance tolerances of

    11、1%, 0.5%, 0.25%, 0.1% and 0.05% for use in surface mounting applications using soldering techniques. 1.1 Typical Construction Characteristics The termination shall include a leach-resistant barrier layer, made of nickel or an equivalent material. The barrier layer shall be covered with a layer of so

    12、lderable material. 1.2 Classification The type designation shall be as follows: PRC3216 C 1003 D Style Characteristic Resistance Tolerance (1.2.1) (1.2.2) (1.2.3) (1.2.4) 1.2.1 Style The style is identified by three letters describing the type of surface mount component (Precision Resistor Chip) fol

    13、lowed by four digits giving the resistors nominal length and width in millimeters per Table I. 1.2.2 Characteristics The characteristic is identified by a single letter in accordance with Table II. Individual part requirements shall be specified in Table II and the test paragraphs. 1.2.3 Resistance

    14、The nominal resistance expressed in ohms is identified by four digits; the first three digits represent significant figures and the last digit represents the number of zeros to follow. When the value of resistance is less than 1000, the letter “R” shall be substituted for one of the significant digi

    15、ts to represent the decimal point. When the letter “R“ is used, succeeding digits of the group represent significant figures. The resistance value designations are shown in Table III. Zero ohm jumper chip resistors are identified by three zeros. 1.2.3.1 Standard Values The standard values for every

    16、decade shall follow the sequence of IEC Publication 63. Refer to Table IV. 1.2.4 Resistance Tolerance The resistance tolerance is identified by a single letter: “F” for 1%, “D” for 0.5%, “C” for 0.25%, “B” for 0.1%, and “A” for 0.05%. EIA/ECA-576-B Page 2 1.2.5 Resistance Range The resistance range

    17、applicable to this standard is 10 ohms to l megohm, inclusive. Characteristics for nominal resistance values less than 10 ohms or greater than l megohm may differ from those specified in Table II. TABLE I TYPE BODY LENGTH (L) BODY WIDTH(W) BODY (*) THICKNESS(H) TERM WIDTH(P) RATED POWER mW MAX CWV I

    18、NCH SIZE (REF) PRC0603 0.6 0.03 0.3 0.03 0.25 0.05 0.10 0.05 50 25 0201 .024 .001 .012 .001 .010 .002 .004 .002 PRC1005 1.0 0.10 0.5 0.10 0.30 0.10 0.20 0.10 62.5 25 0402 .039 .004 .020 .004 .012 .004 .008 .004 PRC1608 1.60 0.10 0.80 0.10 0.50 0.10 0.20 0.10 62.5 50 0603 .063 .004 .031 .004 .020 .00

    19、4 .008 .004 PRC2012 2.00 0.15 1.25 0.15 0.50 0.15 0.40 0.25 100 100 0805 .079 .006 .049 .006 .020 .006 .016 .010 PRC3216 3.20 0.15 1.60 0.15 0.56 0.15 0.50 0.25 125 200 1206 .126 .006 .063 .006 .022 .006 .020 .010 PRC3225 3.20 0.15 2.50 0.15 0.56 0.15 0.50 0.25 250 200 1210 .126 .006 .098 .006 .022

    20、.006 .020 .010 PRC5025 5.00 0.15 2.50 0.15 0.56 0.15 0.60 0.25 500 225 2010 .197 .006 .098 .006 .022 .006 .024 .010 PRC6332 6.30 0.15 3.20 .015 0.56 0.15 0.60 0.25 1000 250 2512 .248 .006 .126 .006 .022 .006 .024 .010 Reference: EIA PDP-100 * Dimension H includes termination solder finish EIA/ECA-57

    21、6-B Page 3 WORKING TEMPERATURE RANGE: - 55 C to + 150 C TABLE II CHARACTERISTICS C E T Y RESISTANCE TEMPERATURE COEFFICIENT (PPM/C) 50 25 10 5 RESISTANCE TOLERANCE (%) 1.0 (F) 0.5 (D) 0.50 (D) 0.25 (C) 0.10 (B) 0.25 (C) 0.10 (B) 0.05 (A) 0.25 (C) 0.10 (B) 0.05 (A) MAXIMUM AMBIENT TEMPERATURE AT RATE

    22、D WATTAGE (C) 70 70 70 70 MAXIMUM AMBIENT TEMPERATURE AT ZERO WATTAGE (C) 150 150 150 150 MAXIMUM CHANGE IN RESISTANCE (% + 0.05) THERMAL SHOCK (3.5) 0.25 0.20 0.15 0.15 SHORT TIME OVERLOAD (3.6) 0.25 0.20 0.15 0.15 HIGH TEMPERATURE EXPOSURE (3.7) 0.50 0.30 0.20 0.20 EFFECTS OF BONDING (3.8) 0.30 0.

    23、15 0.10 0.10TERMINAL STRENGTH (3.9) 0.50 0.25 0.15 0.15 MOISTURE RESISTANCE (3.10) 0.50 0.30 0.20 0.20LIFE (3.14) 0.50 0.30 0.20 0.20 TABLE III DESIGNATION OF RESISTANCE VALUES FOR E-24, 96 it does, however, indicate whether adequate wetting can be achieved within the specified time. Evaluation: Uni

    24、ts shall be visually examined under magnification to confirm a minimum coverage of 95% of clean and smooth solder on both top and bottom surface of the wrap-around termination. The solder coated surfaces may contain small amounts of scattered imperfections, such as pin holes, non-wetted or dewetted

    25、areas; however, these areas shall not be concentrated in one area or on one terminal surface. 3.13 Leach Resistance - Demetallization a) Preparation: The resistors shall be prepared for solder bath immersion as specified in 3.12.1 (a) and (b). b) Immersion: Specimen shall be immersed in molten solde

    26、r as specified in 3.12.1 (c), except the immersion profile shall be 30 5 seconds at 260 C + 5 C. NOTE: In wave soldering, the speed of dissolution of metallization is much greater than in a static dip. With wave, reflow or vapor-phase soldering, the component may be subjected to subsequent iron sold

    27、ering for touchup repair. A long immersion at high temperature is therefore specified for testing the resistance of the metallization to dissolution in molten solder. Evaluation: a) Areas where metallization is lost during immersion as indicated by a void in the termination surface, shall not indivi

    28、dually exceed 5% of the area of any single face of the terminal area, nor collectively exceed 10% of the total terminal area. b) The functional connection of the terminal area to the resistive element connection shall not be exposed. c) Where the metallization of a terminal extends over edges onto a

    29、djacent surfaces, loss of metallization on the edges shall not exceed 10% of their total length. 3.14 Life Resistors shall be tested in accordance with the following: a) Mounting: Resistors shall be mounted on a test board as specified in 3.2.1. b) Measurement before test: Prior to the start of the

    30、test, the dc resistance shall be measured as specified in 3.4. c) Measurements: At the option of the tester, dc resistance measurement may be performed at the elevated ambient temperature (see (d) below). The initial dc resistance measurement shall be performed after stabilization and within 8 hours

    31、 of placement in the chamber. d) The test temperature shall be 70 C ambient forced circulating air. The test specimen, however, shall be baffled so as not to be subjected to direct air-flow. EIA/ECA-576-B Page 11 e) Operating Conditions - Rated dc continuous working voltage shall be applied intermit

    32、tently for 1.5 hours on, 0.5 hour off. f) Measurements during test - The dc resistance shall be measured at 100 4, 500 8, and 1000 24 hours and the change in resistance calculated. Measurements may be taken in or out of the chamber, but all measurements must be made under the same conditions. Evalua

    33、tion: When resistors are tested as specified, there shall be no evidence of mechanical damage and the change in resistance between the initial measurement and any of the succeeding measurements shall not exceed the value specified in Table II. 3.15 Resistance to Solvents: Resistors shall be tested f

    34、or resistance to solvents in accordance with the procedures specified in Method 215 of MIL-STD-202. a) They shall be visually examined for evidence of damage to the marking and coating over the resistive element. 4.0 QUALITY ASSESSMENT 4.1 Qualification (Certification of Design Performance) For qual

    35、ification of a style, the test group shall comprise, as a minimum, the lowest, the critical and highest value for the style and resistance range being qualified. For qualification, a complete test sequence consisting of all the tests of Table V shall be conducted and the acceptability levels complie

    36、d with. 4.2 Quality Assurance Requirements: The testing listed below shall be conducted on an ongoing basis in order to verily the continued acceptability of the resistor performance. Where approved by the qualifying activity, the use of process control techniques may be substituted for some of the

    37、verification tests. The manufacturer shall prepare a test plan that describes the procedure to be used for test sampling and should include the frequency and resistance values of decades to be tested. 4.2.1 Group A: Tests listed under Group I of Table V are to be conducted on samples used for Groups

    38、 II, III, IV and IX. 4.2.2 Group B: Tests listed under Groups III through IX of Table V, shall be conducted as required for quality/performance audits, but not less frequently than monthly for Groups V and VI, quarterly for Group VIII, semiannually for Group VII and annually for Groups III, IV and I

    39、X. 4.2.3 Group C: Tests listed under Group II of Table V, shall be conducted on a semiannual basis. 4.2.4 A complete product evaluation consisting of all of Table V groups shall be conducted for qualification.EIA/ECA-576-B Page 12 TABLE V TEST SEQUENCE AND ACCEPTABILITY LEVELS EXAMINATION/TEST TEST

    40、METHOD # UNITS/STYLE ACC/REJ GROUP I Visual & Mechanical DC Resistance 3.3 3.4 120 0/1 GROUP II Resistance-Temperature Characteristic Thermal Shock Short-Time Overload 3.11 3.5 3.6 30 0/1 GROUP III Moisture Resistance 3.10 30 0/1 GROUP IV Life 3.14 30 0/1 GROUP V Solderability Resistance to Solvents

    41、 3.12 3.15 36 0/1 GROUP VI Leaching 3.13 30 0/1 GROUP VII Effects of Bonding 3.8 30 0/1 GROUP VIII Terminal Strength 3.9 30 0/1 GROUP IX High Temperature Exposure 3.7 30 0/1 * NOTE: Number of units per Group are the minimum acceptable to statistically support reliability. When more than one value is

    42、 tested, the test group shall be equally divided between the values, but shall have no fewer than 10 units per value.ECIA Document Improvement Proposal If in the review or use of this document, a potential change is made evident for safety, health or technical reasons, please fill in the appropriate

    43、 information below and mail or FAX to: Electronic Components Industry Association EIA Standards & Technology Department 2214 Rock Hill Rd., Suite 265 Herndon, VA 20170 FAX: (571-323-0245) Document No.: Document Title: Submitters Name: Telephone No.: FAX No.: e-mail: Address: Urgency of Change: Immed

    44、iate: At next revision: Problem Area: a. Clause Number and /or Drawing: b. Recommended Changes: c. Reason/Rationale for Recommendation: Additional Remarks: Signature: Date: FOR ECIA USE ONLY Responsible Committee: Chairman: Date comments forwarded to Committee Chairman: Electronic Components Industry Association 2214 Rock Hill Road, Suite 265 * Herndon, VA 20170 * tel 571-323-0294 * fax 571-323-0245


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