1、 EIA STANDARD Thin Film Resistor Network Specification EIA-887-A August 2015 ANSI/EIA-887-A-2015 Approved: August 4, 2015 EIA-887-ANOTICE EIA Engineering Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, f
2、acilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of ECIA from manufa
3、cturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than ECIA members, whether the standard is to be used either domestically or internationally. Standards and Publicatio
4、ns are adopted by ECIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, ECIA does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the Standard or Publication. This EIA Standard is considere
5、d to have International Standardization implication, but the International Electrotechnical Commission activity has not progressed to the point where a valid comparison between the EIA Standard and the IEC document can be made. This Standard does not purport to address all safety problems associated
6、 with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the applicability of regulatory limitations before its use. (From Standards Proposal No. 5091, formulated under the cog
7、nizance of the P-1 Committee on Resistive Devices and reaffirmed and upgraded to ANS status under Standards Proposal No. 5305). Published by Electronic Components Industry Association 2015 EIA Standards each cycle consisting of a maximum of 1 minute exposure to heated (54 C - 65 C) demineralized wat
8、er at a maximum pressure of 207 kPa (30 lbf/ft2). This is followed by air-drying for 60 s to 90 s from 93 C to 121 C. 3.3.3 Lead integrity Lead integrity is determined by subjecting components to three bends of forty-five degrees for surface mount leads. No evidence of breakage or loosening exists w
9、hen viewing using 10X magnification. Refer to MIL-STD-883, Method 2004, Condition B1, bending stress. 3.3.4 Mechanical vibration Mechanical vibration is evaluated by performing ten sweeps for each axis at a rate of one octave per minute. The following condition that applies is given in table 1. Tabl
10、e 1 Mechanical vibration conditions Sinusoidal amplitude Frequency Hz 1.5 mm (0.059 in) 2 to 9 5 m/s2(0.51 gn) 9 to 200 Refer to IEC 68-2-6 or MIL-STD-883, Method 2007, Condition “A.” Perform a post electrical testing (25 5) C per the supplier specifications. 3.3.5 Mechanical shock For mechanical sh
11、ock testing apply 70 m/s2(7.1gn) half sine, 22 ms, 100 bumps in each direction of three perpendicular axis (refer to MIL-STD-883, Method 2002, Condition “B”). Perform a post electrical test (25 5) C per the supplier specifications. 3.3.6 Temperature humidity (biased) Devices are tested for 504 hours
12、 at (85 2) C, 85% relative humidity with adjacent pins biased. Parts are to be decapped and inspected for dendritic growth (MIL-STD-202, Method 103, Condition “B”). 3.3.7 Pressure pot test Pressure pot testing consists of immersing the parts for 168 hours at 103 kPa (15 lbf/in2) and 121 C. The parts
13、 shall meet all the electrical and mechanical parameters specified herein. 3.3.8 Post environmental conditioning Devices that require electrical testing after environmental stress may be allowed to remain at room temperature for a period of up to 24 hours prior to electrical testing. 4 3.3.9 Accepta
14、nce criteria for post environmental tests Devices shall meet all the specifications herein and there shall be no evidence of mechanical damage or corrosion. 4 Quality assurance provisions Parts shall be inspected to assure compliance to the requirements of this specification. 5 Packaging Devices sho
15、uld be packaged in tape and reel. The tape and reel shall meet the latest version of EIA standard (EIA-481). The size of the reel should be either 178 mm (7 in) or 330 mm (13 in). The tape and reel should be placed in a pizza-style box or sleeve and its material should comply with the EIA Packaging
16、Material Standards for ESD Sensitive Items (EIA-541). The outside of the pizza-style box or sleeve should be bar-coded in accordance with the latest version of EIA standard (EIA-556). 5 Figure 1 Physical dimensions BTALHWPLABHPWT.236 (5.99).150 (3.81).190 (4.82).063 (1.60).050 (1.27).016 (0.40).026
17、(0.66).236 (5.99).150 (3.81).340 (8.63).063 (1.60).050 (1.27).016 (0.40).026 (0.66).236 (5.99).150 (3.81).390 (9.90).063 (1.60).050 (1.27).016 (0.40).026 (0.66)DIMENSION 8 PIN NARROW 14 PIN NARROW 16 PIN NARROW.408 (10.36).300 (7.62).410 (10.41).097 (2.46).050 (1.27).016 (0.40).026 (0.66).408 (10.36
18、).300 (7.62).500 (12.7).097 (2.46).050 (1.27).016 (0.40).026 (0.66)16 PIN WIDE 20 PIN WIDEDIMENSIONS - inches (mm)LABHPWT.236 (5.99).150 (3.81).190 (4.82).063 (1.60).025 (0.63).010 (0.25).026 (0.66).236 (5.99).150 (3.81).340 (8.63).063 (1.60).025 (0.63).010 (0.25).026 (0.66).236 (5.99).150 (3.81).34
19、0 (8.63).063 (1.60).025 (0.63).010 (0.25).026 (0.66)DIMENSION 16 PIN NARROW 20 PIN NARROW 24 PIN NARROWQSOP & TSSOP.252 (6.40).173 (4.40).256 (6.50).043 (1.10).025 (0.65).008 (0.22).024 (0.60)20 PIN WIDE6 Figure 2 Available circuits NOTE Custom circuits would also be available depending on customer
20、needs and manufacturer capabilities. DUAL TERMINATORCUSTOM RESISTOR NETWORKn2 + 1n1 n2n2 + 1n1n2ISOLATED RESISTOR NETWORKRESISTOR BUSSED SINGLE COMMONBUSSED RESISTOR CENTER COMMONn2 + 111 n2n2 + 111 n2n2 + 1n1n2RESISTOR BUSSED DUAL COMMON1 2345678910112131415161718192021222324RR RR RRRRRRRRRRRRRRECI
21、A Document Improvement Proposal If in the review or use of this document, a potential change is made evident for safety, health or technical reasons, please fill in the appropriate information below and mail or FAX to: Electronic Components Industry Association EIA Standards & Technology Department
22、2214 Rock Hill Rd., Suite 265 Herndon, VA 20170 FAX: (571-323-0245) Document No.: Document Title: Submitters Name: Telephone No.: FAX No.: e-mail: Address: Urgency of Change: Immediate: At next revision: Problem Area: a. Clause Number and /or Drawing: b. Recommended Changes: c. Reason/Rationale for Recommendation: Additional Remarks: Signature: Date: FOR ECIA USE ONLY Responsible Committee: Chairman: Date comments forwarded to Committee Chairman: Electronic Components Industry Association 2214 Rock Hill Road, Suite 265 * Herndon, VA 20170 * tel 571-323-0294 * fax 571-323-0245 www.ecianow.org
