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    ECA 580AA00-1991 Blank Detail Specification for Fixed Metallized Polyethylene-Terephthalate Film Dielectric Chip Capacitors for Direct Current - Encapsulated《对苯二甲酸酯聚乙烯薄膜介质轴加铅直流电容器空.pdf

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    ECA 580AA00-1991 Blank Detail Specification for Fixed Metallized Polyethylene-Terephthalate Film Dielectric Chip Capacitors for Direct Current - Encapsulated《对苯二甲酸酯聚乙烯薄膜介质轴加铅直流电容器空.pdf

    1、ANSU EIA- 580AA00-1991 APPFIOMD: Novirlnr i, 1981 O O U U O CD v) I w 0 IA S P ECI FI CATI ON Blank Detail Specification for Fixed Metallized Polyethylene- Terephthalate Film Dielectric Chip Capacitors for Direct Current - Encapsulated EIA-580AA00 DECEMBER 1991 ELECTRONIC IN DUSTRIES ASSOCIATION ENG

    2、INEERING DEPARTMENT Aooroved kor Use In I. The NECQ Svstem EIA 580AA00 93 3234600 0078935 T I NOTICE EIA Engineering Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and im

    3、provement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or non- member of EIA from manufacturing or selling products not conf

    4、orming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than EIA members, whether the standard is to be used either domestically or internationally. Q Recommended Standards and Publications are adopted by EIA w

    5、ithout regard to whether their adoption may involve patents on articles, materials, or processes. By such action, EIA does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the Recommended Standard or Publication. This EIA Specification is c

    6、onsidered to have International Standardization implication, but the International Electrotechnical Commission activity has not progressed to the point where a valid comparison between the EIA Specification and the IEC document can be made. This Specification does not purport to address all safety p

    7、roblems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Speafication to establish appropriate safety and health practices and to determine the applicability of regulatory limitations before its use. (From Standards Proposal No. 2356 for

    8、mulated under the cognizance of P-2.2 Subcommittee on Plastic and Paper Dielectric) Published by ELECTRONIC INDUSTRIES ASSOCIATION Engineering Department 2001 Pennsylvania Avenue N.W. Washington, D.C. 2ooo6 PRICE: Please refer to the current Catalog Of EIA , Ct D 3 12 1 4.6 Resistance to soldering h

    9、eat 4.6.1 Initial measurements 4.6.2 Test conditions 4.6.3 Final measurements Capacitance Method: 1 Visual examination conditions, see 4.2.1 No signs of damage such as cracks. Capacitance - A c 13% of C value measured in 4.6.1 Subaroup C2 D 3 12 1 4.5 Bond Strength Capacitance (with A c 510% of of t

    10、he end board in bent position) C value face plating measured in 4.3.2 Visual examination No visible damage. Subaroux, C3 D 4.1 Mounting 66 (See Note 4) 4.2.1 Visual examination 4.3.2 Capacitance 4.3.3 Tangent of loss angle At 1 kHz and 10 kHz for all capacitance values. 4.3.4 insulation resistance N

    11、o visible damage. A c 12% of C value measured in Subgroup A2. As in 4.3.3 (Reference values for final measurements in Subgroups C3.1, C3.3 and C3.4). See 1.3 of t Detail Specification. EIA 58OAAOO 91 M 3234600 O078924 O EIA-580AA00 Page 9 SubarouD C3.1 D 4.4 Adhesion Subclause number D or Conditions

    12、 AQL Performance IL requirements (See Note 1) (See Note 1) (See Note 2) (See Note 1) % and test ND of test 6 27 1 After mounting (see 4.1) force of 5 N applied for 10 f 1 s. 4.4.3 Intermediate inspection 4.8 Rapid change of temperature 4.8.1 Initial measurements 4.8.2 Test conditions 0 4.8.3 Interme

    13、diate inspection 4.9 Climatic sequence 4.9.1 Initial measurements 4.9.2 Dry heat 4.9.3 Damp heat, cyclic, first cycle 4.9.4 Cold 4.9.5 Damp heat, cyclic, remaining cycles 4.9.6 Final measurements Visual examination Not required, see subgroup C3. 5 cycles TA = 1.c.t. T, = u.c.t. Exposure time: 30 min

    14、. visual examination Not required, see Subgroup C3. Upper category temp. Duration: 16 H Lower category temp. Duration: 2 H Within 15 min. after removal from test chamber U, to be applied for 1 min. Visual examination No visible damage. No visible damage. No visible damage. Legible marking. EIA-580AA

    15、00 Page 10 EIA 58OAAOO 91 W 3234600 0078925 2 i Subclause number D or Conditions IL AQL Performance and test ND of test % requirements (See Note 1) (See Note 1) (See Note 2) (See Note 1) Subaroup C3.1 continued Capacitance Tangent of loss angle at 10 kHz Insulation A c 15% - C compared to values mea

    16、sured in subgroup C3 Increase of tan - 10 .O05 compared to values measured in Subgroup C3 resistance 250% of limits in 4.3.4 Subarour, C3.2 D 6 15 1 4.10 Damp heat, 4.10.1 Initial steady state measurements 4.10.2 Final measurements Not required, see Subgroup C3 Visual examination No visible damage.

    17、Capacitance Tangent of loss angle at 10 kHz insulation resistance - A c 15% C compared to values measured in Subgroup c3 Increase of tan - ,0.005 compared to values measured in Subgroup C3 150% of 1.3 limit in this Detail Specification EIA 580AA00 91 = 3234600 0078926 4 I EIA-58AA00 Page 11 0 Subcla

    18、use number D or Conditions IL AQL Performance requirements (See Note 1) (See Note 1) (See Note 2) (See Note 1) % and test ND of test 15 1 D 3 Cubarom C3.3 4.11 Endurance 4.11.1 Initial measurements 4.11.2 Test conditions 4.11.5 Final measurements Not required, see Subgroup C3. See 4.11.2 (2000 hrs 8

    19、5 1.25 U, 4.11.3 and 4.11.4 Visual examination capacitance Tangent of loss angle at 10 kHz for C I 1.0 uF Insulation resistance No visible damage. Legible marking. ACI5% C compared to values measured in Subgroup C3. - Increase of tan - 50.003 C I 1 uF 1 50% of 1.3 limit in this Detail Specification.

    20、 SubcrrouD C3.4 D 6 91 4.12 Charge and Discharge 4.12.1 Initial Not required, see measurements Subgroup C3 4.12.2 Test conditions 10,000 cycles 4.12.3 Final Capacitance measurements Tangent of loss angle at 10 kHz C, I 1 uF Insulation resistance ACI3% - C compared to values measured in Subgroup C3.

    21、Increase of tan uF compared to values measured in subgroup C3. - 5 0.003 C I 1 250% of limit in 1.3 of this Detail Spec EIA 580AA00 91 3234600 0078727 b = EIA STANDARD AND SPECIFICATION NUMBERING STAN DARD A document that establishes engineering and technical requirements for processes, procedures,

    22、practices and methods that have been decreed by authority or adopted by consensus. Standards may also be established for selection, application and design criteria for material. Standards and other documents not in the specification format use only the EIA basic numbering system as follows: IA-1 23

    23、Original Standard EIA-123-1 Addendum to Original Standard EIA-123-A First Revision of original Standard incorpcrating all Addenda SPECIFICATION A document prepared specifically to facilitate procurement which clearly and accurately describes the essential technical requirements for purchased materia

    24、l. Procedures necessary to determine that the requirements for the purchased material covered by the specification have been met shall also be referenced or included. EIA Specifications use the following system: EjA 1 3 Standard Prefix for all Numbers Standard or Generic Specification Sectional Spec

    25、ification Designator Blank Detail Specification Designator Detail Specification Designator A - EIA 123 EIA 123A EIA 123AA EIA 123W EIA 123OOAA is a Generic Specification is a Sectional Specification is a Blank Detail Specification is a Detail Specification is a Detail Specification for which no Sectional or Blank Detail Specification was issued. NOTES: 1. Some older specifications may not have been converted to this numbering system. 2. See EP-11 “Guide for the Preparation of Specification Using IECQ-System Format, for more detail.


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