1、REVISIONSLTR DESCRIPTION DATE (YR -MO -DA) APPROVEDREVSHEETREVSHEET 15 16 17 18REV STATUS REV OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14PMIC N/A PREPARED BY Joseph A. Kerby DEFENSE SUPPLY CENTER COLUMBUSSTANDARDMICROCIRCUITDRAWINGCHECKED BYCharles F. Saffle, Jr.COLUMBUS, OHIO 43216THIS DRAWING
2、 IS AVAILABLEFOR USE BY ALLDEPARTMENTSAPPROVED BYMonica L. Poelking MICROCIRCUIT, DIGITAL, LOW VOLTAGE CMOS,16-BIT D-TYPE FLIP-FLOP WITH THREE-STATEOUTPUTS, MONOLITHIC SILICONAND AGENCIES OF THEDEPARTMENT OF DEFENSE DRAWING APPROVAL DATE99-06-17AMSC N/A REVISION LEVEL SIZEACAGE CODE67268 5962-99535S
3、HEET 1 OF 18DSCC FORM 2233APR 97 5962 -E351 -99DISTRIBUTION STATEMENT A . Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-99535DEFENSE SUPPLY CENTER COLUMBU
4、SCOLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 2DSCC FORM 2234APR 971. SCOPE1.1 Scope . This drawing documents two product assurance class levels consisting of high reliability (device classes Q andM) and space application (device class V). A choice of case outlines and lead finishes are available
5、and are reflected in thePart or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in thePIN.1.2 PIN . The PIN is as shown in the following example:5962 - 99535 01 Q X XFederal RHA Device Device Case Lead stock class designator type class ou
6、tline finishdesignator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3)/ Drawing number1.2.1 RHA designator . Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels andare marked with the appropriate RHA designator. Device class M RHA marked dev
7、ices meet the MIL-PRF-38535, appendix Aspecified RHA levels and are marked with the appropriate RHA designator. A dash ( -) indicates a non -RHA device.1.2.2 Device type(s) . The device type(s) identify the circuit function as follows:Device type Generic number Circuit function01 5 4LCX16374 16-bit
8、D-type flip-flop with three-state outputs1.2.3 Device class designator . The device class designator is a single letter identifying the product assurance level asfollows:Device class Device requirements documentationM Ven dor self -certification to the requirements for MIL-STD-883 compliant,non -JAN
9、 class level B microcircuits in accordance with MIL-PRF-38535,appendix AQ or V Certification and qualification to MIL-PRF-385351.2.4 Case outline(s) . The case outline(s) are as designated in MIL-STD-1835 and as follows:Outline letter Descriptive designator Terminals Package styleX GDFP1-F48 48 Flat
10、 pack1.2.5 Lead finish . The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,appendix A for device class M.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-99535DEFENSE SU
11、PPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 3DSCC FORM 2234APR 971.3 Absolute maximum ratings . 1 / 2 / 3 /Supply voltage range (V CC ) . -0.5 V dc to +7.0 V dcDC input voltage range (V IN ) -0.5 V dc to +7.0 V dc 4 /DC output voltage range (V OUT ) (high or low state) -0.5 V
12、dc to V CC +0.5 V dc 4 / 5 /DC output voltage range (V OUT ) (high impedance or power off state) . -0.5 V dc to +7.0 V dc 4 /DC input clamp current (I IK ) (V IN V CC ) . 50 mAContinuous output current (I O ) (per pin) . 50 mA 5 /Continuous current through V CC or GND . 400 mAMaximum power dissipati
13、on 750 mWStorage temperature range (T STG ) . -65 C to +150 CLead temperature (soldering, 10 seconds) . +300 CThermal resistance, junction-to-case ( JC ) . See MIL-STD-1835Junction temperature (T J ) . +175 C1.4 Recommended operating conditions . 2 / 3 / 6 /Supply voltage range (V CC ) (Operating) .
14、 +2.7 V dc to +3.6 V dcMinimum supply voltage (Data retention only) . +1.5 V dcMinimum high level input voltage (V IH ) (V CC = 2.7 V to 3.6 V) . +2.0 VMaximum low level input voltage (V IL ) (V CC = 2.7 V to 3.6 V) +0.8 VInput voltage range (V IN ) 0.0 V to +5.5 V dcOutput voltage range (V OUT ) (h
15、igh or low state) 0.0 V to V CCOutput voltage range (V OUT ) (high impedance state) 0.0 V to 5.5 V dcMaximum high level output current (I OH )V CC = 2.7V -12 mAV CC = 3.0 V to 3.6 V -24 mAMaximum low level output current (I OL ):V CC = 2.7V +12 mAV CC = 3.0 V to 3.6 V +24 mAInput transition rise or
16、fall rate ( t/ V): 0 to 10 ns/VCase operating temperature range (T C ) . -55 C to +125 C_1 / Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at themaximum levels may degrade performance and affect reliability. Maximum junction temperature shall
17、 not be exceededexcept for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883.2 / Unless otherwise noted, all voltages are referenced to GND.3 / The limits for the parameters specified herein shall apply over the full specified V CC range and case tem
18、perature rangeof -55 C to +125 C.4 / The input and output negative voltage ratings may be exceeded provided that the input and output clamp currentratings are observed.5 / The value of V CC is provided in the recommended operating conditions table.6 / Unused inputs must be held high or low to preven
19、t them from floating.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-99535DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 4DSCC FORM 2234APR 972. APPLICABLE DOCUMENTS2.1 Government s
20、pecification, standards, and handbooks . The following specification, standards, and handbooks form apart of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listedin the issue of the Department of Defense Index of Specifications and St
21、andards (DoDISS) and supplement thereto, cited inthe solicitation.SPECIFICATIONDEPARTMENT OF DEFENSEMIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.STANDARDSDEPARTMENT OF DEFENSEMIL -STD -883 - Test Method S tandard Microcircuits.MIL-STD-973 - Configuration Management.M
22、IL-STD-1835 - Interface Standard For Microcircuit Case Outlines.HANDBOOKSDEPARTMENT OF DEFENSEMIL-HDBK-103 - List of Standard Microcircuit Drawings (SMDs).MIL -HDBK -780 - Standard Microcircuit Drawings.(Unless otherwise indicated, copies of the specification, standards, and handbooks are available
23、from the StandardizationDocument Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)2.2 Order of precedence . In the event of a conflict between the text of this drawing and the references cited herein, the textof this drawing takes precedence. Nothing in this document, howeve
24、r, supersedes applicable laws and regulations unless aspecific exemption has been obtained.3. REQUIREMENTS3.1 Item requirements . The individual item requirements for device classes Q and V shall be in accordance withMIL-PRF-38535 and as specified herein or as modified in the device manufacturers Qu
25、ality Management (QM) plan. Themodification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements fordevice class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specifiedherein.3.2 Design, co
26、nstruction, and physical dimensions . The design, construction, and physical dimensions shall be asspecified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.3.2.1 Case outlines . The case outlines shall be in accordance with 1.2.4 her
27、ein.3.2.2 Terminal connections . The terminal connections shall be as specified on figure 1.3.2.3 Truth table . The truth table shall be as specified on figure 2.3.2.4 Logic diagram . The logic diagram shall be as specified on figure 3.3.2.5 Ground bounce load circuit and waveforms . The ground boun
28、ce load circuit and waveforms shall be as specified onfigure 4.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-99535DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 5DSCC FORM 2234APR
29、 973.2.6 Switching waveforms and test circuit . The switching waveforms and test circuit shall be as specified on figure 5.3.2.7 Radiation exposure circuit . The radiation exposure circuit shall be as specified when available.3.3 Electrical performance characteristics and postirradiation parameter l
30、imits . Unless otherwise specified herein, theelectrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over thefull case operating temperature range.3.4 Electrical test requirements . The electrical test requirements shall be the subgrou
31、ps specified in table II. The electricaltests for each subgroup are defined in table I.3.5 Marking . The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also bemarked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is
32、not feasible due to spacelimitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, theRHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall b
33、e in accordance with MIL-PRF-38535, appendix A.3.5.1 Certification/compliance mark . The certification mark for device classes Q and V shall be a “QML“ or “Q“ as requiredin MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A.3.6 Certificate o
34、f compliance . For device classes Q and V, a certificate of compliance shall be required from a QML -38535listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificateof compliance shall be required from a manufacturer in order to be
35、 listed as an approved source of supply in MIL-HDBK-103(see 6.6.2 herein). The certificate of compliance submitted to DSCC -VA prior to listing as an approved source of supply forthis drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-3
36、8535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.3.7 Certificate of conformance . A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 orfor device class M in MIL-PRF-38535, appendix A shall be provided with each lot of m
37、icrocircuits delivered to this drawing.3.8 Notification of change for device class M . For device class M, notification to DSCC -VA of change of product (see 6.2herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-973.3.9 Verification and review for dev
38、ice class M . For device class M, DSCC, DSCCs agent, and the acquiring activity retainthe option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be madeavailable onshore at the option of the reviewer.3.10 Microcircuit group assignment for devi
39、ce class M . Device class M devices covered by this drawing shall be inmicrocircuit group number 38 (see MIL-PRF-38535, appendix A).Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-99535DEFENSE SUPPLY CENTER COLU
40、MBUSCOLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 6DSCC FORM 2234APR 97Table I. Electrical performance characteristics .Test andMIL-STD-883test method 1 /Symbol Test conditions 2 /-55 C T C +125 C+2.7 V V CC +3.6 VDevicetypeandV CC Group AsubgroupsLimits 3 / Unitunless otherwise specified Devicecla
41、ssMin MaxHigh level outputvoltage3006V OH For all inputs affectingoutput under test, V IN = V IL or V IHI OH = -100 AAllAll2.7 Vand3.6 V1, 2, 3 V CC-0.2V4 / For all other inputs, V IN = V CC or GND I OH = -12 mAAllAll2.7 V 1, 2, 3 2.23.0 V 2.4I OH = -24 mA AllAll3.0 V 1, 2, 3 2.2Low level outputvolt
42、age3007V OL For all inputs affectingoutput under test, V IN = V IL or V IHI OL = 100 AAllAll2.7 Vand3.6 V1, 2, 3 0.2 V4 / For all other inputs, V IN = V CC or GNDI OL = 12 mA AllAll2.7 V 1, 2, 3 0.4I OL = 24 mA AllAll3.0 V 1, 2, 3 0.55Input current high3010I IH All inputsFor input under test, V IN =
43、 5.5 VFor all other inputs,AV IN = V CC or GNDAllAll3.6 V 1, 2, 3 +5.0Input current low3009I IL All inputsFor input under test, V IN = 0.0 VFor all other inputs,AV IN = V CC or GNDAllAll3.6 V 1, 2, 3 -5.0Three-state outputleakage currentI OZH Ahigh30215 / V OUT = 5.5 V AllAll2.7 Vand3.6 V1, 2, 3 +5.
44、0Three-state outputleakage currentlowI OZL 5 /A3020V OUT = GND AllAll2.7 Vand3.6 V1, 2, 3 -5.0Quiescent supply currentI CC Outputs high, low, and disabledFor all inputs, V IN = V CC or GNDI OUT = 0.0 AAllAll3.6 V 1, 2, 3 20.0 A3005 For all inputs, 3.6 V V IN 5.5 VFor all outputs, 3.6 V V OU T 5.5 V5
45、 /AllAll2.7 Vand 3.6 V1, 2, 3 -20.0 20.0Quiescent supplycurrent delta, TTL input levels3005I CC6 /One input at V IN = V CC 0.6 VOther inputs at V IN = V CC or GNDAllAll2.7 Vand3.6 V1, 2, 3 500.0 AOff-state leakagecurrentI OFF For input or output under test,V IN or V OUT = 5.5 VAll other inputs or ou
46、tputs at 0.0 VAllAll0.0 V 1, 2, 3 10.0 ASee footnotes at end of table.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-99535DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000 REVISION LEVEL SHEET 7DSCC FORM
47、2234APR 97Table I. Electrical performance characteristics Continued.Test andMIL-STD-883test method 1 /Symbol Test conditions 2 /-55 C T C +125 C+2.7 V V CC +3.6 VDevicetypeandV CC Group AsubgroupsLimits 3 / Unitunless otherwise specified DeviceclassMin MaxNegative inputclamp voltage3022V IC- For inp
48、ut under test, I IN = -18 mA AllAll3.0 V 1, 2, 3 -1.2 VInput capacitance3012C IN T C = +25 CSee 4.4.1cAllAllGND 4 10.0 pFOutput capacitance3012C OUT T C = +25 CSee 4.4.1cAllAll3.3 V 4 12.0 pFPower dissipationcapacitanceper bufferC PD Outputs enabledT C = +25 Cf = 10 MHz, See 4.4.1cAllAll3.3 V 4 40.0 pFLow level groundbounce noiseV OLP7 /V IH = 2.7 V, V IL = 0.0 VT A = +25 CSee figure 4AllAll3.3 V 4 1200 mVLow level ground bounce noiseV OLV7 /See 4.4.1d AllAll3.3 V 4 -1100 mVHigh level V CCbounce noiseV OHP7 /AllAll3.3 V 4 900 m
