1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. gt 03-02-20 R. MONNIN B Modify drawing to current requirements. -rrp 10-04-20 C. SAFFLE REV SHEET REV SHEET REV STATUS REV B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PRE
2、PARED BY RICK OFFICER DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY RAJESH PITHADIA APPROVED BY RAYMOND MONNIN MICROCIRCUIT, LINEA
3、R, QUAD, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON DRAWING APPROVAL DATE 98-09-03 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-98645 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E041-10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MI
4、CROCIRCUIT DRAWING SIZE A 5962-98645 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (de
5、vice class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 98645 01 Q
6、C A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels an
7、d are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit functio
8、n as follows: Device type Generic number Circuit function 01 HA-4741 Quad operational amplifier 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification
9、 to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descrip
10、tive designator Terminals Package style C GDIP1-T14 14 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fro
11、m IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98645 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Voltage between +VSand -VSterminals 40 V Differential input voltage . 15 V Voltage at either input termin
12、al . +VSto -VSOutput current (IOUT) Indefinite (one amplifier shorted to GND) Power dissipation (PD) 1.33 W 2/ Junction temperature (TJ) +175C Lead temperature (soldering 10 seconds) +300C Storage temperature range . -65C to +150C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Thermal re
13、sistance, junction-to-ambient (JA) 75C/W 1.4 Recommended operating conditions. Operating supply voltage (VS) . 5 V to 15 V Common mode input voltage (VINCM) (+VS- -VS) Load resistance (RL) . 2 k Operating ambient temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specifica
14、tion, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-385
15、35 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Dra
16、wings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a
17、conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause
18、 permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Derating factor (above TA= +75C) for case C is 13.3 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCU
19、IT DRAWING SIZE A 5962-98645 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or
20、 as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B
21、devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case
22、outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and
23、 postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in tabl
24、e I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the dev
25、ice. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mar
26、k for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
27、 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of complianc
28、e submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Ce
29、rtificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device clas
30、s M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to r
31、eview the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 49
32、 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98645 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electri
33、cal performance characteristics. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Input offset voltage VIOVCM= 0 V 1 01 -3 3 mV 2,3 -5 5 Input bias current +IBVCM= 0 V, +RS= 10 k, 1 01 -200 200 nA -RS= 100 2,3 -325 325 -IBVCM= 0 V,
34、+RS= 100 , 1 -200 200 -RS= 10 k 2,3 -325 325 Input offset current IIOVCM= 0 V, +RS= 10 k, 1 01 -30 30 nA -RS= 10 k 2,3 -75 75 Common mode range +CMR +VS= 3 V, -VS= -27 V 1,2,3 01 12 V -CMR +VS= 27 V, -VS= -3 v -12 Common mode rejection ratio +CMRR VCM= -10 V, +VS= 5 V, -VS= -25 V 1 01 80 dB VOUT= -1
35、0 V 2,3 74 -CMRR VCM= +10 V, +VS= 25 V, -VS= -5 V 1 80 VOUT= 10 V 2,3 74 Quiescent power supply current +ICCVOUT= 0 V, IOUT= 0 mA 1 01 5 mA 2,3 7 -ICC1 -5 2,3 -7 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD
36、MICROCIRCUIT DRAWING SIZE A 5962-98645 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type
37、 Limits Unit Min Max Power supply rejection ratio +PSRR VSUP= 5 V +VS= 10 V, -VS= -15 V 1 01 80 dB +VS= 20 V, -VS= -15 V 2,3 80 -PSRR VSUP= -5 V +VS= 15 V, -VS= -10 V 1 80 +VS= 15 V, -VS= -20 V 2,3 80 Quiescent power 2/ 3/ consumption PC VOUT= 0 V, IOUT= 0 mA 1,2,3 01 180 mW Large signal voltage gai
38、n +AVOLVOUT= 0 V and +10 V, 4 01 50 kV/V RL= 2 k 5,6 25 -AVOLVOUT= 0 V and -10 V, 4 50 RL= 2 k 5,6 25 Output voltage swing +VOUT1RL= 10 k 4,5,6 01 12 V -VOUT1RL= 10 k -12 +VOUT2RL= 2 k 10 -VOUT2RL= 2 k -10 Output current +IOUTVOUT= -10 V 4,5,6 01 5 mA -IOUTVOUT= 10 V -5 Differential input 2/ 4/ resi
39、stance RINVCM= 0 V 4 01 260 k Full power 2/ 4/ 5/ bandwidth FPBW VPEAK= 10 V 4 01 14 kHz Minimum closed 2/ 4/ loop stable gain CLSG RL= 2 k, CL= 50 pF 4,5,6 01 1 V/V Output resistance 2/ 4/ ROUTOpen loop 4 01 350 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networki
40、ng permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98645 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ -55C TA +125C unles
41、s otherwise specified Group A subgroups Device type Limits Unit Min Max Channel separation 2/ 4/ CS f = 10 kHz, RS= 1 k, referred to input, 4 01 -66 dB AV= 100 V/V, VIN= 100 mVPEAKSlew rate 6/ +SR VOUT= -5 V to +5 V 7 01 0.9 V/s -SR VOUT= +5 V to -5 V 0.9 Overshoot 6/ +OS VOUT= 0 to +200 mV 7 01 40
42、% -OS VOUT= 0 to -200 mV 40 Gain bandwidth 6/ product (small signal) GBWP VOUT= 50 mV 7 01 2.5 MHz Rise and fall time 6/ TRVOUT= 0 to +200 mV, 10% TR 90% 7 01 140 ns TFVOUT= 0 to -200 mV, 10% TF 90% 140 1/ Unless otherwise specified, VS= 15 V, source resistance (RS) = 100 , RL= 500 k, and VOUT= 0 V.
43、 2/ If not tested, shall be guaranteed to the limits specified in table I herein. 3/ Quiescent power consumption is based upon quiescent supply current test maximum. No load on outputs. 4/ Unless otherwise specified, VS= 15 V, RL= 5 k, and load capacitance (CL) = 50 pF. 5/ Full power bandwidth guara
44、ntee is based on slew rate measurement using FPBW = slew rate / (2 x x VPEAK). 6/ Unless otherwise specified, VS= 15 V, source resistance (RS) = 50 , RL= 2 k, load capacitance (CL) = 50 pF, and AVCL= +1 V/V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IH
45、S-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98645 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 Device type 01 Case outline C Terminal number Terminal symbol 1 OUTPUT 1 2 -INPUT 1 3 +INPUT 1 4 +VS5 +INPUT 2 6 -INPUT 2 7 OUTPUT 2 8 OUTPUT
46、3 9 -INPUT 3 10 +INPUT 3 11 -VS12 +INPUT 4 13 -INPUT 4 14 OUTPUT 4 FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-98645 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-399
47、0 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM p
48、lan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 50
