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    DLA SMD-5962-96816 REV A-2009 MICROCIRCUIT DIGITAL ADVANCED HIGH SPEED CMOS QUADRUPLE 2-INPUT EXCLUSIVE-OR-GATE MONOLITHIC SILICON.pdf

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    DLA SMD-5962-96816 REV A-2009 MICROCIRCUIT DIGITAL ADVANCED HIGH SPEED CMOS QUADRUPLE 2-INPUT EXCLUSIVE-OR-GATE MONOLITHIC SILICON.pdf

    1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update the boilerplate paragraphs to current MIL-PRF-38535 requirements - MAA 09-01-27 Charles F. Saffle REV SHEET REV SHEET REV A A SHEET 15 16 REV A A A A A A A A A A A A A A REV STATUS OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A

    2、PREPARED BY Joseph A. Kerby CHECKED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY Monica L. Poelking DRAWING APPROVAL DATE 96-07-01 MICROCIRCUIT, DIGITAL, ADVANCED HIGH SPEED CMOS, QUADRUPLE 2-INPUT EXCLUSIVE-OR-GATE, MONOLITHIC SILICO

    3、N SIZE A CAGE CODE 67268 5962-96816 STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A REVISION LEVEL A SHEET 1 OF 16 DSCC FORM 2233 APR 97 5962-E146-09 Provided by IHSNot for ResaleNo reproduction or networking permi

    4、tted without license from IHS-,-,-SIZE A 5962-96816 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (de

    5、vice classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as sho

    6、wn in the following example: 5962 - 96816 01 Q C A Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices

    7、 meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s).

    8、The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54AHC86 Quadruple 2-input exclusive-OR-gate 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Devic

    9、e requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designat

    10、ed in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device c

    11、lasses Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-96816 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL A SHEET 3 DSCC F

    12、ORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to +7.0 V dc 4/ DC output voltage range (VOUT). -0.5 V dc to VCC+ 0.7 V dc 4/ DC input clamp current (IIK) (VIN 0.0 V ) -20 mA DC output clamp current (IOK)

    13、 (VOUT 0.0 V or VOUT VCC) 20 mA Continuous output current (IOUT) (VOUT= 0.0 V to VCC) 25 mA Continuous current through VCCor GND . 50 mA Maximum power dissipation at TA= +55C (in still air) (PD ) 500 mW Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds) +300C T

    14、hermal resistance, junction-to-case (JC). See MIL-STD-1835 Junction temperature (TJ) +150C 1.4 Recommended operating conditions. 2/ 3/ 5/ Supply voltage range (VCC) +2.0 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V to VCCOutput voltage range (VOUT) +0.0 V to VCCMinimum high level input voltage

    15、 (VIH): VCC = 2.0 V. +1.5 V VCC = 3.0 V. +2.1 V VCC = 5.0 V 0.5 V +3.85 V Maximum low level input voltage (VIL): VCC = 2.0 V. +0.5 V VCC = 3.0 V. +0.9 V VCC = 5.0 V 0.5 V +1.65 V Maximum high level output current (IOH): VCC = 2.0 V. -50 A VCC = 3.3 V 0.3 V -4 mA VCC = 5.0 V 0.5 V -8 mA Maximum low l

    16、evel output current (IOL): VCC = 2.0 V. +50 A VCC = 3.3 V 0.3 V +4 mA VCC = 5.0 V 0.5 V +8 mA Maximum input rise or fall rate (t/V): VCC = 3.3 V 0.3 V 100 ns/V VCC = 5.0 V 0.5 V 20 ns/V Case operating temperature range (TC) -55C to +125C 1/ Stresses above the absolute maximum rating may cause perman

    17、ent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits of the parameters specified herein shall apply over the full specified VCCrange and case temperature range o

    18、f -55C to +125C. Unused inputs must be held high or low 4/ The input and output voltage ratings may be exceeded provided that the input and output current ratings are observed. 5/ Unused inputs must be held high or low to prevent them from floating. Provided by IHSNot for ResaleNo reproduction or ne

    19、tworking permitted without license from IHS-,-,-SIZE A 5962-96816 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following spec

    20、ification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits Manufacturing, General Spe

    21、cification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings

    22、. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the ref

    23、erences cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in

    24、 accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance

    25、with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and

    26、 herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Block or Logic diagram. The

    27、 block or logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce load circuit and waveforms. The ground bounce load circuit and waveforms shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on fig

    28、ure 5. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-96816 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristic

    29、s and post-irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post-irradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical te

    30、st requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PI

    31、N number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device c

    32、lass M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3

    33、.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacture

    34、r in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirem

    35、ents of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided

    36、with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification

    37、 and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit grou

    38、p assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 36 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-96816 STANDARD MICROCIRCUIT DRAWING

    39、DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits 3/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +2.0 V VCC +5.5 V unless otherwise specified VCCGroup A sub

    40、groups Min Max Unit 2.0 V 1.9 3.0 V 2.9 IOH= -50 A 4.5 V 1, 2, 3 4.4 1 2.58 IOH= -4 mA 3.0 V 2, 3 2.48 1 3.94 High level output voltage 3006 VOHFor all inputs affecting output under test, VIN= VIHor VIL For all other inputs, VIN= VCCor GND IOH= -8 mA 4.5 V 2, 3 3.8 V 2.0 V 0.1 3.0 V 0.1 IOL= +50 A 4

    41、.5 V 1, 2, 3 0.1 1 0.36 IOL= +4 mA 3.0 V 2, 3 0.5 1 0.36 Low level output voltage 3007 VOLFor all inputs affecting output under test, VIN= VIHor VIL For all other inputs, VIN= VCCor GND IOL= +8 mA 4.5 V 2, 3 0.5 V 1 +0.1 Input current high 3010 IIHFor input under test, VIN= VCCFor all other inputs,

    42、VIN= VCCor GND 5.5 V 2, 3 +1.0 A 1 -0.1 Input current low 3009 IILFor input under test, VIN= GND For all other inputs, VIN= VCCor GND 5.5 V 2, 3 -1.0 A 1 2.0 Quiescent supply current 3005 ICCFor all inputs, VIN= VCCor GND IOUT= 0.0 A 5.5 V 2, 3 20.0 A Input capacitance 3012 CINTA= +25C, VIN= VCCor G

    43、ND See 4.4.1c 5.0 V 4 10.0 pF Power dissipation capacitance CPD4/ CL= 50 pF minimum f = 1 MHz See 4.4.1c 5.0 V 4 18.0 pF See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-96816 STANDARD MICROCIRCUIT DRAWING DE

    44、FENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218 - 3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits 3/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +2.0 V VCC +5.5 V unless otherwise specified VCCG

    45、roup A subgroups Min Max Unit VOLP5/ 5.0 V 4 900 mV Low level ground bounce noise VOLV5/ 5.0 V 4 -950 mV VOHP5/ 5.0 V 4 250 mV High level VCCbounce noise VOHV5/ VIH= VCC, VIL= 0.0 V TA= +25C See 4.4.1d See figure 4 5.0 V 4 -550 mV 4.5 V Functional test 3014 6/ VIN= VIHor VILVerify output VOSee 4.4.1

    46、b 5.5 V 7, 8 L H 9 11.0 3.0 V and 3.6 V 10, 11 1.0 13.0 9 6.8 CL= 15 pF minimum RL= open See figure 5 8/ 4.5 V and 5.5 V 10, 11 1.0 8.0 9 14.5 3.0 V and 3.6 V 10, 11 1.0 16.5 9 8.8 tPLH 7/ CL= 50 pF minimum RL= open See figure 5 4.5 V and 5.5 V 10, 11 1.0 10.0 ns 9 11.0 3.0 V and 3.6 V 10, 11 1.0 13

    47、.0 9 6.8 CL= 15 pF minimum RL= open See figure 5 8/ 4.5 V and 5.5 V 10, 11 1.0 8.0 ns 9 14.5 3.0 V and 3.6 V 10, 11 1.0 16.5 9 8.8 Propagation delay time, mA or mB to mY 3003 tPHL 7/ CL= 15 pF minimum RL= open See figure 5 8/ 4.5 V and 5.5 V 10, 11 1.0 10.0 ns 1/ For tests not listed in the referenc

    48、ed MIL-STD-883, utilize the general test procedure of 883 under the conditions listed herein. 2/ Each input/output, as applicable, shall be tested at the specified temperature, for the specified limits, to the tests in table I herein. Output terminals not designated shall be high level logic, low level logic, or open, except for the ICCtests, where the output terminals shall be open. When performing ICCtest, the current meter shall be placed in the circuit such that all current flows through the mete


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