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    DLA SMD-5962-95614 REV A-2008 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS SCAN TEST DEVICE WITH 18-BIT BUS TRANSCEIVER THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON《高.pdf

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    DLA SMD-5962-95614 REV A-2008 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS SCAN TEST DEVICE WITH 18-BIT BUS TRANSCEIVER THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON《高.pdf

    1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update the boilerplate to the current requirements of MIL-PRF-38535. - jak. 08-07-21 Thomas M. Hess REV SHET REV A A A A A A A A A A A A A A A SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 REV STATUS REV A A A A A A A A A A A A A A OF SHEETS

    2、 SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Joseph A Kerby STANDARD MICROCIRCUIT DRAWING CHECKED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking AND

    3、 AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 95-10-13 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, SCAN TEST DEVICE WITH 18-BIT BUS TRANSCEIVER, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-95614 SHEET 1 OF 29 D

    4、SCC FORM 2233 APR 97 5962-E453-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95614 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Sco

    5、pe. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice

    6、of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 95614 01 Q X A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5)

    7、/ (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with

    8、 the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ABTH18502A Scan test device with 18-bit universal bus transceiver, three-state outputs, TTL comp

    9、atible inputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuit

    10、s in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 68 Quad flat pack 1.2.5 Lea

    11、d finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q, and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95614 DEFENSE SUPPLY CEN

    12、TER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) . -0.5 V dc to +7.0 V dc DC input voltage range (except I/O ports) (VIN). -0.5 V dc to +7.0 V dc 4/ DC input voltage range (I/O ports) (VIN) -0.5 V

    13、dc to +5.5 V dc 4/ DC output voltage range (VOUT) -0.5 V dc to +5.5 V dc 4/ DC output current (IOL) (per output). +96 mA DC input clamp current (IIK) (VIN= 0.0 V). -18 mA DC output clamp current (IOK) (VOUT 0.0 V). -50 mA VCCcurrent (IVCC) +576 mA GND current (IGND) +1152 mA Storage temperature rang

    14、e (TSTG) -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) 1.9C/W Junction temperature (TJ) . +175C Maximum power dissipation (PD) . 635 mW 5/ 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) . +4.5 V dc to +5.5 V dc Input vo

    15、ltage range (VIN) . +0.0 V dc to VCCOutput voltage range (VOUT) +0.0 V dc to VCCMaximum low level input voltage (VIL ) 0.8 V Minimum high level input voltage (VIH ) . 2.0 V Maximum high level output current (IOH) -24 mA Maximum low level output current (IOL) . +48 mA Minimum input edge rate (V/t) .

    16、10 ns/V Case operating temperature range (TC) -55C to +125C 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND.

    17、3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ The input negative voltage rating may be exceeded provided that the input clamp current rating is observed. 5/ Power dissipation values are derived using the

    18、 formula PD= VCCICC+ nVOLIOL, where VCCand IOLare as specified in 1.4 above, ICC and VOLare as specified in table I herein, and n represents the total number of outputs.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZ

    19、E A 5962-95614 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent speci

    20、fied herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standar

    21、d Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/qu

    22、icksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents

    23、 are those cited in the solicitation or contract. INSTITUTE OF ELECTRICAL AND ELECTRONIC ENGINEERS (IEEE) IEEE Standard 1149.1 - IEEE Standard Test Access Port and Boundary Scan Architecture. (Applications for copies should be addressed to the institute of Electrical and Electronics Engineers, 445 H

    24、oes Lane, Piscataway, NJ 08854-4150.) 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemp

    25、tion has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall

    26、not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction,

    27、 and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 and figure 1. 3.2.2 Terminal connections. The terminal connection

    28、s shall be as specified on figure 2. 3.2.3 Truth table. The truth table shall be as specified on figure 3. 3.2.4 Block diagram. The block diagram shall be as specified on figure 4. 3.2.5 Test access port controller and scan test registers. The test access port controller and scan test registers shal

    29、l be as specified on figure 5. 3.2.6 Ground bounce waveforms and test circuit. The ground bounce waveforms and test circuit shall be as specified on figure 6. 3.2.7 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 7. Provided by IHSNot fo

    30、r ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95614 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics and postirradiation paramete

    31、r limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the sub

    32、groups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to

    33、space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance wi

    34、th MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. Fo

    35、r device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an ap

    36、proved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein

    37、 or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits d

    38、elivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M.

    39、For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M.

    40、 Device class M devices covered by this drawing shall be in microcircuit group number 126 (see MIL-PRF-38535, appendix A). 3.11 IEEE 1149.1 compliance. The device shall be compliant with IEEE 1149.1. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-ST

    41、ANDARD MICROCIRCUIT DRAWING SIZE A 5962-95614 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless

    42、otherwise specified VCCGroup A subgroups Limits 3/ Unit Min MaxNegative input clamp voltage 3022 VIC-For input under test, IIN= -18 mA 4.5 V 1, 2, 3 -1.2 V 4.5 V 1, 2, 3 2.5 V IOH= -3 mA 5.0 V 1, 2, 3 3.0 V High level output voltage 3006 VOHFor all inputs affecting output under test, VIN= 2.0 V or 0

    43、.8 V IOH= -24 mA 4.5 V 1, 2, 3 2.0 V Low level output voltage 3007 VOLFor all inputs affecting output under test, VIN= 2.0 V or 0.8 V IOL= 48 mA 4.5 V 1, 2, 3 0.55 V mOEAB, mOEBA, TDI, TMS 4.5 V 1, 2, 3 10.0 mCLKAB, mCLKBAmLEAB, mLEBA, TCK 4.5 V 1, 2, 3 +1.0 Input current high 3010 IIH4/ For input u

    44、nder test, VIN= VCCmAn or mBn ports 4.5 V 1, 2, 3 20.0 A mOEAB, mOEBA, TDI, TMS 4.5 V 1, 2, 3 -150 mCLKAB, mCLKBAmLEAB, mLEBA, TCK 4.5 V 1, 2, 3 -1.0 Input current low 3009 IIL4/ For input under test, VIN= GND mAn or mBn ports 4.5 V 1, 2, 3 -20.0 A VIN= 0.8 V 75 500 Input hold current I I(HOLD) A or

    45、 B ports VIN= 2.0 V 4.5 V 1, 2, 3 -75 -500 A Three-state output leakage current high 3021 IOZH5/ For control inputs affecting output under test, VIN= 2.0 V or 0.8 V VOUT= 2.7 V 2.1 V and 5.5 V 1, 2, 3 10.0 A Three-state output leakage current low 3020 IOZL5/ For control inputs affecting output under

    46、 test, VIN= 2.0 V or 0.8 V VOUT= 0.5 V 2.1 V and 5.5 V 1, 2, 3 -10.0 A Off-state leakage current IOFFFor input or output under test, VINor VOUT= 4.5 V 0.0 V 1 100 A High-state leakage current ICEXFor output under test, VOUT= 5.5 V Outputs at high logic state 5.5 V 1, 2, 3 50 A Output current 3011 IO

    47、6/ VOUT= 2.5 V 5.5 V 1, 2, 3 -50 -200 mA See footnotes at end of table.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95614 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 D

    48、SCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test and MIL-STD-883 test method 1/ Symbol VCCGroup A subgroups Limits 3/ Unit Test conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified Min Max Quiescent supply current, output high 3005 ICCH5.5 V 1, 2, 3 5.5 mA Quiescent supply current, output low 3005 ICCL5.5 V 1, 2, 3 24 mA Quiescent supply current, outputs disabled 3005 ICCZFor all inputs, VIN= VCCor GND IOUT= 0 A A or B ports 5.5 V 1, 2, 3 3.6 mA Quiescent supply current delta, TTL input level ICC7/ For


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