1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. Editorial changes throughout. - les. 00-11-06 Raymond Monnin B Update drawing to current requirements. Editorial changes throughout. - gap. 08-05-20 Robert M. Heber REV SHET REV SHET REV STATUS REV
2、 B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Larry T. Gauder DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Thomas M. Hess COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROV
3、ED BY Thomas M. Hess MICROCIRCUIT, DIGITAL, BIPOLAR, TTL, 4-LINE TO 16-LINE DECODERS/ AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 95-01-26 DEMULTIPLEXERS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-95581 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E049-
4、08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95581 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two
5、product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance
6、 (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 95581 01 Q J X Federal stock class designator RHA designator (see 1.2.1) Devicetype (see 1.2.2)Deviceclass designatorCaseoutline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2
7、.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A
8、 dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54154 4-line to 16-line decoders/demultiplexers 1.2.3 Device class designator. The device class designator is a single letter identi
9、fying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-3
10、8535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style J GDIP1-T24 or CDIP2-T24 24 dual in line package K GDFP2-F24 or CDFP3-F24 24 flat package 1.2.5 Lead finish. The lead finish is as specified
11、 in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95581 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REV
12、ISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range -0.5 V dc minimum to +7.0 V dc maximum Input voltage . 5.5 V dc Storage temperature . -65C to +150C Maximum power dissipation (PD) 269.5 mW 2/ Lead temperature (soldering, 10 seconds) . +300C Thermal re
13、sistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V Maximum low level input voltage (VIL) . 0.8 V dc Ambient operating
14、temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those
15、 cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Out
16、lines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue,
17、Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
18、exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Maximum power dissipation is defined as VCCx ICC, and must withstand the added PDdue to s
19、hort circuit test, e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95581 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1
20、Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as des
21、cribed herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specifi
22、ed in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth tab
23、le. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figure 4. 3.3 Electrical performance characteristics and post
24、irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requir
25、ements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number
26、is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M sh
27、all be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certif
28、icate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in orde
29、r to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of M
30、IL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each
31、 lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and revi
32、ew for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignm
33、ent for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 003 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95581 DEFENSE
34、SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA+125C Group A subgroups Limits Unit unless otherwise specified Min Max High level output voltage VOHVCC= 4.5 V, VIL= 0.8 V, V
35、IH= 2.0 V, IOH= -0.8 mA 1, 2, 3 2.4 V Low level output voltage VOLVCC= 4.5 V, VIH= 2.0 V, VIL= 0.8 V, IOL= 16 mA 1, 2, 3 0.4 V Input clamp voltage VIKVCC= 4.5 V, IIN= -12 mA 1, 2, 3 -1.5 V High level input current IIH1 VCC= 5.5 V, VIN= 5.5 V 1, 2, 3 1 mA Low level input current IIL VCC= 5.5 V, VIN=
36、0.4 V 1, 2, 3 -1.6 mA High level input current IIH2 VCC= 5.5 V, VIN= 2.4 V 1, 2, 3 40 A Short circuit input current IOSVCC= 5.5 V 1/ 1, 2, 3 -20 -55 mA Supply current ICC VCC= 5.5 V 2/ 1, 2, 3 49 mA Functional test VCC= 4.5 V, 5.5 V See 4.4.1b 7, 8 tPLH 36 Propagation delay time, from A, B, C, or D
37、inputs through 3 levels of logic tPHLVCC= 5.0 V, RL= 400 , CL= 15 pF See figure 4 9 33 ns tPLH 30 Propagation delay time, from either strobe input tPHL9 27 ns 1/ Not more than 1 output should be shorted at a time. 2/ ICCis measured with all inputs grounded and all outputs open. Provided by IHSNot fo
38、r ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95581 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines J and K Terminal number Terminal symbol 1
39、0 2 1 3 2 4 3 5 4 6 5 7 6 8 7 9 8 10 9 11 10 12 GND 13 11 14 12 15 13 16 14 17 15 18 G 1 19 G 2 20 D 21 C22 B 23 A 24 VCCFIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95581 D
40、EFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 INPUTS OUTPUTS G 1 G 2 D C B A 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 L L L L L L L H H H H H H H H H H H H H H H L L L L L H H L H H H H H H H H H H H H H H L L L L H L H H L H H H H H H H H H H H
41、H H L L L L H H H H H L H H H H H H H H H H H H L L L H L L H H H H L H H H H H H H H H H H L L L H L H H H H H H L H H H H H H H H H H L L L H H L H H H H H H L H H H H H H H H H L L L H H H H H H H H H H L H H H H H H H H L L H L L L H H H H H H H H L H H H H H H H L L H L L H H H H H H H H H H L
42、H H H H H H L L H L H L H H H H H H H H H H L H H H H H L L H L H H H H H H H H H H H H H L H H H H L L H H L L H H H H H H H H H H H H L H H H L L H H L H H H H H H H H H H H H H H L H H L L H H H L H H H H H H H H H H H H H H L H L L H H H H H H H H H H H H H H H H H H H L L H X X X X H H H H H H
43、H H H H H H H H H H H L X X X X H H H H H H H H H H H H H H H H H H X X X X H H H H H H H H H H H H H H H H Notes: H = High voltage level. L = Low voltage level. FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIR
44、CUIT DRAWING SIZE A 5962-95581 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-
45、95581 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 NOTES: 1. CLincludes probe and jig capacitance. 2. All diodes are 1N3064, 1N916 or equivalent. FIGURE 4. Test circuit and switching waveforms. Provided by IHSNot for ResaleNo reproduction or
46、 networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-95581 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 10 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection
47、 procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordanc
48、e with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test conditio
