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    DLA SMD-5962-93102 REV A-2010 MICROCIRCUIT DIGITAL ECL 4-BIT D-TYPE FLIP FLOP MONOLITHIC SILICON.pdf

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    DLA SMD-5962-93102 REV A-2010 MICROCIRCUIT DIGITAL ECL 4-BIT D-TYPE FLIP FLOP MONOLITHIC SILICON.pdf

    1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change part title on page 1 from “BIPOLAR, ADVANCED SHOTTKY TTL“ to “ECL“. Update drawing to current requirements. Editorial changes throughout. - gap 10-04-15 Charles F. Saffle REV SHET REV SHET REV STATUS REV A A A A A A A A A A A A A A OF SHEE

    2、TS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Jeffery Tunstall DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Thom

    3、as M. Hess APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, ECL, 4-BIT D-TYPE FLIP FLOP, MONOLITHIC SILICON DRAWING APPROVAL DATE 93-10-13 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-93102 SHEET 1 OF 14 DSCC FORM 2233 APR 97 5962-E059-10 Provided by IHSNot for ResaleNo reproduction or

    4、 networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93102 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high

    5、reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. Th

    6、e PIN is as shown in the following example: 5962 - 93102 01 M X X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA ma

    7、rked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Devi

    8、ce type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 10E531 4-bit D type flip flop 02 100E531 4-bit D-type flip flop, temperature compensated 1.2.3 Device class designator. The device class designator is a single letter identifying t

    9、he product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.

    10、2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style Y See figure 1 28 Quad flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, a

    11、ppendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93102 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum

    12、 ratings. 1/ Supply voltage range (VEE) 2/ -8.0 V dc to 0.0 V dc Input voltage range (VIN) 2/ . -6.0 V dc to 0.0 V dc Minimum input swing (VPP) 0.150 V dc Output current (IOUT): Continuous . 50 mA Surge 100 mA Storage temperature range . -65C to +165C Lead temperature (soldering, 10 seconds) +300C J

    13、unction temperature (TJ) +165C Maximum power dissipation (PD): Device type 01 382 mW Device type 02 442 mW Thermal resistance, junction-to-case (JC) 1.23C/W 1.4 Recommended operating conditions. Supply voltage range (VEE): 2/ Device type 01 -4.94 V dc to -5.46 V dc Device type 02 -4.20 V dc to -5.46

    14、 V dc Input voltage range (VIN): 2/ Device type 01 -0.660 V dc to -1.950 V dc Device type 02 -0.880 V dc to -1.810 V dc Output voltage range (VOUT): 2/ Device type 01 -0.672 V dc to -1.972 V dc Device type 02 -0.880 V dc to -1.810 V dc Input rise and fall times, 20% to 80% (tr, tf) . 500 ps maximum

    15、Case operating temperature range (TC) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these docume

    16、nts are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Compo

    17、nent Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Ro

    18、bbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Ratings apply when referenced to VCC= 0.0 V dc. Provided by I

    19、HSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93102 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the

    20、 text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for d

    21、evice classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for devic

    22、e class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V

    23、 or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table. The truth table shall be as specified on

    24、 figure 3. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 4. 3.2.5 Test circuit and switching waveforms. Test circuit and switching waveforms shall be as specified on figure 5. 3.2.6 Inner-layer dielectric. Polyimide and silicon coatings are allowed as part of the wafer fabri

    25、cation process provided that each microcircuit inspection lot (see MIL-PRF-38535, “Inspection lot - class B”) shall be subjected to and pass the internal water vapor content test in accordance with group D6 of test method 5005 of MIL-STD-883. The frequency of the internal water vapor testing may not

    26、 be decreased unless approved by the preparing activity. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply ove

    27、r the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In add

    28、ition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Ma

    29、rking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. T

    30、he compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6

    31、.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this dra

    32、wing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classe

    33、s Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices

    34、 acquired to this drawing is required for any change that affects this drawing. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93102 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A

    35、SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C Unless otherwise specified Group A subgroupsDevice type Limits 1/ Unit Min Max High level input voltage VIH -5.46 V VCC -4.94 V for type 01 -5.46 V VCC -4.20 V for type 02 1 2 3 01 -1.

    36、130 -1.020 -1.258 -0.810 -0.660 -0.906 V 1, 2, 3 02 -1.165 -0.880 Low level input voltage VIL 1, 2 01 -1.950 -1.950 -1.480 -1.421 V 1, 2, 3 02 -1.810 -1.475 High level output voltage VOH VCC= VCCO = GND VBB= open VIN= VIHmaximum, VILminimum Outputs terminated through 50 to -2.0 V VEE= -4.94 V 1 2 3

    37、01 -0.980 -0.862 -1.097 -0.810 -0.672 -0.906 V EE= -4.20 V 1, 2 3 02 -1.025 -1.097 -0.880 -0.880 Low level output voltage VOL VEE= -5.46 V 1 2 3 01 -1.950 -1.934 -1.972 -1.630 -1.579 -1.652 V 1, 2 3 02 -1.810 -1.810 -1.620 -1.600 High level threshold output voltage VOHT VCC= VCCO = GND VBB= open VIN

    38、= VIHmaximum, VILminimum Outputs terminated through 50 to -2.0V VEE= -5.46 V 1 2 3 01 -0.980 -0.862 -1.097 -0.810 -0.672 -0.906 V 1, 2 3 02-1.025 -1.097 -0.880 -0.880 Low level threshold output voltage VOLT VEE= -4.94 V 1 2 3 01 -1.950 -1.934 -1.972 -1.630 -1.579 -1.652 V EE= -4.20 V 1, 2 3 02-1.810

    39、 -1.810 -1.620 -1.600 Power supply drain current IEEVCC= VCCO = GND, VEE= -5.46 V VIN= VIHmaximum, VILminimum Outputs terminated through 50 to -2.0 V 1, 2, 3 01 -70 mA 1, 3 2 02-70 -81 High level input current IIH VCC= VCCO = GND VEE= -4.94 V for type 01 = -4.20 V for type 02 VIN= VIHmaximum, VILmin

    40、imum Outputs terminated through 50 to -2.0 V CC input 1, 2, 3 All 10 350 A Sn inputs 10 450 Rn inputs 10 300 CE$ $ $ $n inputs 10 300 Dn inputs 10 150 Low level input current IIL VEE= -5.46 V VIN= VIHmaximum, VILminimum Outputs terminated through 50 to -2.0 V 1, 2, 3 All .05 A See footnotes at end o

    41、f table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93102 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance character

    42、istics - continued Test Symbol Conditions -55C TC +125C Unless otherwise specified Group A subgroupsDevice type Limits 1/ Unit Min Max Functional test See 4.4.1b, VCC= VCCO= GND VEE= -4.94 V, -5.46 V for type 01 = -4.20 V, -5.46 V for type 02 7, 8 All Propagation delay time, CE$ $ $ $n to Qn or Q%n

    43、tPLH1,tPHL1 See figure 5 9 10 11 01 355 475 215 775 1175 615 ps 9, 1110 02 335 335 775 825 Propagation delay time, CC to Qn or Q%n tPLH2,tPHL2 9 10 11 01 355 625 225 750 1125 585 ps 9, 1110 02 335 335 775 825 Propagation delay time, Rn to Qn or Q%n tPLH3,tPHL3 9 10 11 01 395 650 250 745 1225 625 ps

    44、9, 1110 02 325 325 750 805 Propagation delay time, Sn to Qn or Q%n tPLH4,tPHL4 9 10 11 01 395 775 250 785 1275 615 ps 9, 1110 02 325 325 825 925 Maximum toggle frequency fMAX9, 10, 11 All 1100 MHZ Setup time, CC or CE$ $ $ $n to Dn tSU9, 11 10 01 150 590 ps 9, 10, 11 02 300 Hold time, CC or CE$ $ $

    45、$n to Dn th9, 1110 01 175 590 ps 9, 10, 11 02 290 Reset recovery time trr9, 10, 11 All 400 ps Minimum pulse width, (CC, Sn, and Rn inputs) tPW 9, 10, 11 All 400 ps Output transition time tTLH,tTHL9, 10, 11 01 275 700 ps 02 275 700 1/ The limits are determined after a device has reached thermal equil

    46、ibrium. This is defined as the reading taken with the device in a socket with 500 LFPM of +125C or -55C (as applicable) air blowing on the unit in a transverse direction with power applied for at least four minutes before the reading is taken. Provided by IHSNot for ResaleNo reproduction or networki

    47、ng permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93102 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234 APR 97 Case Y Dimension Millimeters Inches Min Max Min Max D1 8.89 10.16 .350 .400 E1 8.89 10.16 .350 .400 A 1.52

    48、 2.03 .060 .080 b 0.36 0.48 .014 .019 e 1.27 BSC .050 BSC Q 0.89 1.09 .035 .043 c 0.10 0.18 .004 .007 L 7.49 8.38 .295 .330 D 23.88 25.65 .940 1.010 E 23.88 25.65 .940 1.010 NOTES: 1. The preferred unit of measurement is millimeters. However, this item was designed using inch-pound units of measurement. In case problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Dimensions D1 and E1 allow for lid misalignment and glass meniscus. 3. Dimension Q shall be measured at the point of exit of the


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