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    DLA SMD-5962-92177 REV C-2013 MICROCIRCUIT DIGITAL ADVANCED CMOS 8-BIT BIDIRECTIONAL TRANSCEIVER WITH THREE-STATE OUTPUTS MONOLITHIC SILICON.pdf

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    DLA SMD-5962-92177 REV C-2013 MICROCIRCUIT DIGITAL ADVANCED CMOS 8-BIT BIDIRECTIONAL TRANSCEIVER WITH THREE-STATE OUTPUTS MONOLITHIC SILICON.pdf

    1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Change limits for VOL. Editorial changes throughout. - jak 98-11-05 Monica L. Poelking B Update the boilerplate to current requirements as specified in MIL-PRF-38535. Editorial changes throughout. jak 07-02-21 Thomas M. Hess C Update vendor cage

    2、code and approved source of supply information in bulletin page. Update DC VCCor GND current (ICC, IGND) per pin to section 1.3. Update boilerplate paragraphs to current requirements of MIL-PRF-38535. MAA 13-06-20 Thomas M. Hess REV SHEET REV C C SHEET 15 16 REV STATUS REV C C C C C C C C C C C C C

    3、C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Thomas J. Ricciuti DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY Thomas J. Ricciuti THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Mo

    4、nica L. Poelking MICROCIRCUIT, DIGITAL, ADVANCED CMOS, 8-BIT BIDIRECTIONAL TRANSCEIVER WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-12-22 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-92177 SHEET 1 OF 16 DSCC FORM 2233 APR 97

    5、 5962-E111-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92177 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents tw

    6、o product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assuran

    7、ce (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 92177 01 M R A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing num

    8、ber 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA design

    9、ator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ACQ245 8-bit bidirectional transceiver with three-state outputs 1.2.3 Device class designator. The device class designator

    10、is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and q

    11、ualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square leadless chip

    12、carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92177 DL

    13、A LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) . -0.5 V dc to +7.0 V dc DC input voltage range (VIN) . -0.5 V dc to VCC + 0.5 V dc DC output voltage range (VOUT) -0.5 V dc to VCC+ 0.5 V dc

    14、 DC input clamp current (IIK) (VIN= -0.5 V and VCC+ 0.5 V) . 20 mA DC output clamp current (IOK) (VOUT= -0.5 V and VCC+ 0.5 V) . 20 mA DC output current (IOUT) (per output pin) . 50 mA DC VCCor GND current (ICC, IGND) (per pin) 50 mA Maximum power dissipation (PD) 500 mW Storage temperature range (T

    15、STG) -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) . +2.0 V dc to +6.0 V dc Input voltage range (VIN) . 0.0 V to VCC

    16、Output voltage range (VOUT) 0.0 V to VCCMinimum high level input voltage (VIH): VCC= 3.0 V . 2.10 V VCC= 3.6 V . 2.52 V VCC= 4.5 V . 3.15 V VCC= 5.5 V . 3.85 V Maximum low level input voltage (VIL): VCC= 3.0 V . 0.90 V VCC= 3.6 V . 1.08 V VCC= 4.5 V . 1.35 V VCC= 5.5 V . 1.65 V Case operating temper

    17、ature range (TC) -55C to +125C Minimum input edge rate (V/t): (VINfrom 0.3VCCto 0.7VCCor from 0.7VCCto 0.3VCC) 125 mV/ns Maximum high level output current (IOH): VCC= 3.0 V . -12 mA VCC= 4.5 V . -24 mA Maximum low level output current (IOL): VCC= 3.0 V . +12 mA VCC= 4.5 V . +24 mA 1/ Stresses above

    18、the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full sp

    19、ecified VCCrange and case temperature range of -55C to +125C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92177 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR

    20、97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contra

    21、ct. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOO

    22、KS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/quicksearch.dla.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 N

    23、on-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEDEC Standard JESD20 - Stand

    24、ard for Description of 54/74ACXXXX and 54/74ACTXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10th Street, Suite 240S, Arlington, VA 22201.) 2.3 Order of precedence. In the eve

    25、nt of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The indivi

    26、dual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual

    27、 item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herei

    28、n for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall b

    29、e as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce waveforms and test circuit. The ground bounce waveforms and test circuit shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switching waveforms an

    30、d test circuit shall be as specified on figure 5. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92177 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 3.3 Elect

    31、rical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test r

    32、equirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages wher

    33、e marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-P

    34、RF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required i

    35、n MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall

    36、be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product

    37、meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M

    38、in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is req

    39、uired for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore d

    40、ocumentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 37 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or

    41、networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92177 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test and MIL-STD-883 test method 1/ Symbol Test conditions

    42、 2/ -55C TC +125C +3.0 VCC +5.5 V unless otherwise specified VCCGroup A subgroups Limits 3/ Unit Min Max High level output voltage 3006 VOHFor all inputs affecting outputs under test, VIN= VIHor VILFor all other inputs, VIN= VCCor GND IOH= -50 A 3.0 V 1, 2, 3 2.90 V 4.5 V 1, 2, 3 4.40 5.5 V 1, 2, 3

    43、5.40 IOH= -12 mA 3.0 V 1 2.56 2, 3 2.40 IOH= -24 mA 4.5 V 1 3.86 2, 3 3.70 5.5 V 1 4.86 2, 3 4.70 IOH= -50 mA 4/ 5.5 V 1, 2, 3 3.85 Low level output voltage 3007 VOLFor all inputs affecting outputs under test, VIN= VIHor VILFor all other inputs, VIN= VCCor GND IOL= 50 A 3.0 V 1, 2, 3 0.10 V 4.5 V 5.

    44、5 V IOL= 12 mA 3.0 V 1 0.36 2, 3 0.50 IOL= 24 mA 4.5 V 1 0.36 2, 3 0.50 5.5 V 1 0.36 2, 3 0.50 IOL= 50 mA 4/ 5.5 V 1, 2, 3 1.65 Positive input clamp voltage 3022 VIC+For input under test, IIN= 18 mA GND 1, 2, 3 -1.2 V Negative input clamp voltage 3022 VIC-For input under test, IIN= -18 mA Open 1, 2,

    45、 3 5.7 Three-state output leakage current, high 3021 IOZH5/ OE = VIHor GND For all other inputs, VIN= VCCor GND VOUT= 5.5 V 5.5 V 1 0.5 A 2, 3 10.0 Three-state output leakage current, low 3020 IOZL5/ OE = VIHor GND For all other inputs, VIN= VCCor GND VOUT= 0.0 V 5.5 V 1 -0.5 A 2, 3 -10.0 Input curr

    46、ent high 3010 IIHFor input under test, VIN= VCCFor all other inputs, VIN= VCCor GND 5.5 V 1 0.1 A 2, 3 1.0 Input current low 3009 IILFor input under test, VIN= GND For all other inputs, VIN= VCCor GND 5.5 V 1 -0.1 A 2, 3 -1.0 Quiescent supply current, output high 3005 ICCHOE = GND For all other inpu

    47、ts, VIN= VCCor GND 5.5 V 1 8.0 A 2, 3 160 Quiescent supply current, output low 3005 ICCL5.5 V 1 8.0 A 2, 3 160 Quiescent supply current, output three-state 3005 ICCZOE = VCCFor all other inputs, VIN= VCCor GND 5.5 V 1 8.0 A 2, 3 160 See footnotes at end of table. Provided by IHSNot for ResaleNo repr

    48、oduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92177 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +3.0 VCC +5.5 V unless otherwise specified VCCGroup A subgroups Limits 3/ Unit Min Max Input capacitance 3012 CINTC= +25C See 4.4.1c GND 4 10 pF Input/output capacitance 3012 CI/O5/ 5


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