1、REVISIONSLTR DESCRIPTION DATE (YR-MO-DA) APPROVEDREVSHEETREVSHEETREV STATUS REVOF SHETS SHET 1234567891011213PMIC N/A PREPARED BY RICK C. OFFICERDEFENSE ELECTRONICS SUPPLY CENTERSTANDARDIZEDMILITARYDRAWINGCHECKED BYCHARLES E. BESOREDAYTON, OHIO 45444THIS DRAWING IS AVAILABLEFOR USE BY ALLDEPARTMENTS
2、APPROVED BYMICHAEL A. FRYEMICROCIRCUIT, LINEAR, LOGARITHMICAMPLIFIER, MONOLITHIC SILICONAND AGENCIES OF THEDEPARTMENT OF DEFENSEDRAWING APPROVAL DATE92-11-25AMSC N/AREVISION LEVEL SIZEACAGE CODE672685962-92084SHEET1 OF 13DESC FORM 193JUL 91 5962-E519-92DISTRIBUTION STATEMENT A. Approved for public r
3、elease; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGSIZEA5962-92084DEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444REVISION LEVEL SHEET2DESC FORM 193AJUL 911. SCOPE1.1 Scope. This drawing f
4、orms a part of a one part - one part number documentation system (see 6.6 herein). Twoproduct assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (deviceclasses S and V), and a choice of case outlines and lead finishes are available and are re
5、flected in the Part or IdentifyingNumber (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 ofMIL-STD-883, “Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“. When available, achoice of Radiation Hardness Assurance
6、(RHA) levels are reflected in the PIN.1.2 PIN. The PIN shall be as shown in the following example:5962 - 92084 01 M X X| | | | | | | | Federal RHA Device Device Case Lead stock class designator type class outline finishdesignator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.
7、3)/ Drawing number1.2.1 RHA designator. Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levelsand shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet theMIL-I-38535 specified RHA levels and shall be marked w
8、ith the appropriate RHA designator. A dash (-) indicates a non-RHAdevice.1.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:Device type Generic number Circuit function01 SL531 250 MHz logarithmic amplifier1.2.3 Device class designator. The device class designator
9、 shall be a single letter identifying the product assurance level asfollows:Device class Device requirements documentationM Vendor self-certification to the requirements for non-JAN class B microcircuitsin accordance with 1.2.1 of MIL-STD-883B or S Certification and qualification to MIL-M-38510Q or
10、V Certification and qualification to MIL-I-385351.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:Outline letter Descriptive designator Terminals Package styleX See figure 1 8 Can1.2.5 Lead finish. The lead finish shall be as specified in MIL-M-38510 fo
11、r class M, B, or S or MIL-I-38535 for classes Q andV. Finish letter “X“ shall not be marked on the microcircuit or its packaging. The “X“ designation is for use in specificationswhen lead finishes A, B, and C are considered acceptable and interchangeable without preference.Provided by IHSNot for Res
12、aleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGSIZEA5962-92084DEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444REVISION LEVEL SHEET3DESC FORM 193AJUL 911.3 Absolute maximum ratings. 1/ Supply voltage (V+)+15 V dcStorage temperature range-65G01C
13、to +150G01CLead temperature (soldering, 10 seconds) +300G01CPower dissipation (PD) .250 mWInput voltage (VIN)2.5 VPPThermal resistance, junction-to-case (G01JC)60G01C/WThermal resistance, junction-to-ambient (G01JA).210G01C/WJunction temperature (TJ) +175G01C1.4 Recommended operating conditions. 2/S
14、upply voltage range (V+).+9.0 V dcFrequency60 MHzBandwidth 500 MHzAmbient operating temperature range (TA)-55G01C to +125G01C2. APPLICABLE DOCUMENTS2.1 Government specification, standards, bulletin, and handbook. Unless otherwise specified, the following specification,standards, bulletin, and handbo
15、ok of the issue listed in that issue of the Department of Defense Index of Specifications andStandards specified in the solicitation, form a part of this drawing to the extent specified herein.SPECIFICATIONMILITARYMIL-M-38510 - Microcircuits, General Specification for.MIL-I-38535 - Integrated Circui
16、ts, Manufacturing, General Specification for.STANDARDSMILITARYMIL-STD-480 - Configuration Control-Engineering Changes, Deviations and Waivers.MIL-STD-883 - Test Methods and Procedures for Microelectronics.MIL-STD-1835 - Microcircuit Case Outlines.BULLETINMILITARYMIL-BUL-103 - List of Standardized Mi
17、litary Drawings (SMDs).HANDBOOKMILITARYMIL-HDBK-780 - Standardized Military Drawings.(Copies of the specification, standards, bulletin, and handbook required by manufacturers in connection with specificacquisition functions should be obtained from the contracting activity or as directed by the contr
18、acting activity.)1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extendedoperation at the maximum levels may degrade performance and affect reliability.2/ All outputs may be shorted to ground.Provided by IHSNot for ResaleNo reproduction or networking permitted
19、 without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGSIZEA5962-92084DEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444REVISION LEVEL SHEET4DESC FORM 193AJUL 912.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the textof this d
20、rawing shall take precedence.3. REQUIREMENTS3.1 Item requirements. The individual item requirements for device class M shall be in accordance with 1.2.1 ofMIL-STD-883, “Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“ and as specifiedherein. The individual item re
21、quirements for device classes B and S shall be in accordance with MIL-M-38510 and as specifiedherein. For device classes B and S a full electrical characterization table for each device type shall be include in this SMD. The individual item requirements for each device classes Q and V shall be in ac
22、cordance with MIL-I-38535, the devicemanufacturers Quality Management (QM) plan, and as specified herein.3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specifiedin MIL-M-38510 for device for device class M, B, and S and MIL-I-38535 fo
23、r device classes Q and V and herein.3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein.3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.3.3 Electrical performance characteristics and postirradiation parameter limits. Unless other
24、wise specified herein, theelectrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the fullambient operating temperature range.3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in ta
25、ble II. The electricaltests for each subgroup are defined in table I.3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. Marking for device class M shall be in accordancewith MIL-STD-883 (see 3.1 herein). In addition, the manufacturers PIN may also be marked as listed in MIL-BUL
26、-103. Marking for device classes B and S shall be in accordance with MIL-M-38510. Marking for device classes Q and V shall be inaccordance with MIL-I-38535.3.5.1 Certification/compliance mark. The compliance mark for device class M shall be a “C“ as required in MIL-STD-883 (see3.1 herein). The certi
27、fication mark for device classes B and S shall be a “J“ or “JAN“ as required in MIL-M-38510.The certification mark for device classes Q and V shall be a “QML“ as required in MIL-I-38535.3.6 Certificate of compliance. For device class M, a certificate of compliance shall be required from a manufactur
28、er in orderto be listed as an approved source of supply in MIL-BUL-103 (see 6.7.3 herein). For device classes Q and V, a certificate ofcompliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see6.7.2 herein). The certificate of compli
29、ance submitted to DESC-EC prior to listing as an approved source of supply for thisdrawing shall affirm that the manufacturers product meets, for device class M, the requirements of MIL-STD-883 (see 3.1herein), or for device classes Q and V, the requirements of MIL-I-38535 and the requirements herei
30、n.3.7 Certificate of conformance. A certificate of conformance as required for device class M in MIL-STD-883 (see 3.1 herein)or device classes B and S in MIL-M-38510 or for device classes Q and V in MIL-I-38535 shall be provided with each lot ofmicrocircuits delivered to this drawing.3.8 Notificatio
31、n of change for device class M. For device class M, notification to DESC-EC of change of product (see 6.2herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-480.3.9 Verification and review for device class M. For device class M, DESC, DESCs agent, and
32、the acquiring activity retainthe option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be madeavailable onshore at the option of the reviewer.3.10 Microcircuit group assignment for device class M, B, and S. Device classes M, B, and S devices
33、covered by thisdrawing shall be in microcircuit group number 49 (see MIL-M-38510, appendix E).3.11 Serialization for device class S. All device class S devices shall be serialized in accordance with MIL-M-38510.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from
34、 IHS-,-,-STANDARDIZEDMILITARY DRAWINGSIZEA5962-92084DEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444REVISION LEVEL SHEET5DESC FORM 193AJUL 91TABLE I. Electrical performance characteristics.Test SymbolConditions 1/-55G02C G03 TAG03 +125G02CGroup AsubgroupsDevicetypeLimits 2/ Unitunless otherwise s
35、pecified Min MaxSupply current I+ 1,2,3 01 25.0 mASmall signalvoltage gainAVS4,5,6 01 7.5 12.5 dBHigh level slopegain4,5,6 01 -1.2 +1.2 dBUpper cut-offfrequencyfCU-3 dB with respect to60 MHz gain4,5,6 01 250 MHzLower cut-offfrequencyfCL-3 dB with respect to60 MHz gain4,5,6 01 10 MHzPhase change with
36、input amplitudeVIN= 7.07 mV rms to707.10 mV rms4 01 -2 +2 Degrees5,6 -4 +41/ Unless otherwise specified, V+ = +9 V, f = 60 MHz, and VIN= 7.07 mV rms. See figure 3.2/ The algebraic convention, whereby the most negative value is a minimum and the most positive is a maximum,is used in this table. Negat
37、ive current shall be defined as conventional current flow out of a device terminal.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGSIZEA5962-92084DEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444REVISION LEVEL SHEET6DESC
38、 FORM 193AJUL 91NOTES:1. Dimensions are in inches.2. Metric equivalents are for general information only.3. All leads: G04b applies between L1 and L2. G04b1 applies between L2 and .500 (12.70 mm) fromthe reference plain. Diameter is uncontrolled in L1 and beyond .500 (12.70 mm) from the reference pl
39、ane.4. Measured from maximum diameter of the product.5. Leads having a maximum diameter .019 (0.48 mm) measured in gauging plane .054 (1.37 mm) +.001 (0.03 mm) - .000 (0.00 mm) below the base plane of the product shall be within .007 (0.18 mm)of their true position relative to a maximum tab width.6.
40、 The product may be measured by direct methods or by gauge.7. All leads: Increased maximum limit by .003 (0.08 mm) when lead finish A or B is applied.8. The location, G05 of the leads is 360G02 / N, where N is total number of leads or lead positions.FIGURE 1. Case outline X.Provided by IHSNot for Re
41、saleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGSIZEA5962-92084DEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444REVISION LEVEL SHEET7DESC FORM 193AJUL 91Symbol Dimensions NotesInches MillimetersMin Max Min MaxA .165 .185 4.19 4.70G04b .016 .019
42、0.41 0.48 3,5,7G04b1 .016 .021 0.41 0.53 3,5,7G04D .335 .370 8.51 9.40G04D1 .305 .335 7.75 8.51G04D2 .110 .160 2.79 4.06F - .040 - 1.02k .027 .034 0.69 0.86k1 .027 .045 -.69 1.14 4L .500 .750 12.70 19.05 3L1 - .050 - 1.27 3L2 .250 - 6.35 - 3Case outline Symbol NotesG05 ee1NX45G02 BSC .200 BSC .100 B
43、SC 8 5FIGURE 1. Case outline X. Continued.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGSIZEA5962-92084DEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444REVISION LEVEL SHEET8DESC FORM 193AJUL 91Device type 01Case outlin
44、e XTerminal number Terminal symbol1V+2BIAS3 INPUT4 INPUT GROUND5 DECOUPLE (LF ONLY) (See note 1)6 OUTPUT7 OUTPUT GROUND8 V+ 2 (see note 2)NOTES:1. This pin is used to extend the low frequency (LF) response.2. An on chip resistor of 166 G06 is provided which can be used to dropvoltage instead of the
45、180 G06 shown in the test circuit, figure 3.The extra dissipation in this resistor reduces the maximum operatingtemperature to 100G02C.FIGURE 2. Terminal connections.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGSIZEA596
46、2-92084DEFENSE ELECTRONICS SUPPLY CENTERDAYTON, OHIO 45444REVISION LEVEL SHEET9DESC FORM 193AJUL 91FIGURE 3. Test circuit.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZEDMILITARY DRAWINGSIZEA5962-92084DEFENSE ELECTRONICS SUPPLY CENTERDAYT
47、ON, OHIO 45444REVISION LEVEL SHEET10DESC FORM 193AJUL 914. QUALITY ASSURANCE PROVISIONS4.1 Sampling and inspection. For device class M, sampling and inspection procedures shall be in accordance with section 4of MIL-M-38510 to the extent specified in MIL-STD-883 (see 3.1 herein). For device classes B
48、 and S, sampling and inspectionprocedures shall be in accordance with MIL-M-38510 and method 5005 of MIL-STD-883, except as modified herein. For deviceclasses Q and V, sampling and inspection procedures shall be in accordance with MIL-I-38535 and the device manufacturersQM plan.4.2 Screening. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall beconducted on all devices prior to quality conformance inspection. For device classes B and S, screening shall be inaccordance with method
