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    DLA SMD-5962-91674 REV B-2004 MICROCIRCUIT LINEAR 15 VOLT STEP DOWN VOLTAGE REGULATOR MONOLITHIC SILICON《硅单块 逐步减低转换稳压器 15瓦特直线式微型电路》.pdf

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    DLA SMD-5962-91674 REV B-2004 MICROCIRCUIT LINEAR 15 VOLT STEP DOWN VOLTAGE REGULATOR MONOLITHIC SILICON《硅单块 逐步减低转换稳压器 15瓦特直线式微型电路》.pdf

    1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outline Z. Make changes to 1.3, and figure 2. - ro 00-07-06 R. MONNIN B Replaced reference to MIL-STD-973 with reference to MIL-PRF-38535. - ro 04-12-21 R. MONNIN REV SHET REV SHET REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHE

    2、ET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY RAJESH PITHADIA DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY RAJESH PITHADIA COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL FRYE MICROCIRCUIT

    3、, LINEAR, 15 VOLT, STEP DOWN, VOLTAGE REGULATOR, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 95-06-02 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-91674 SHEET 1 OF 14 DSCC FORM 2233 APR 97 5962-E054-05 Provided by IHSNot for ResaleNo reproduction or ne

    4、tworking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91674 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high rel

    5、iability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The P

    6、IN is as shown in the following example: 5962 - 91674 01 Q E X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA mark

    7、ed devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device

    8、 type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 LM1575-15 15 volt, 1 amp step-down voltage regulator 02 LM1575HV-15 15 volt, 1 amp step-down voltage regulator high voltage 1.2.3 Device class designator. The device class designator

    9、 is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and

    10、qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line X See figure 1 4 TO-3 Flange mount Y See figure 1 5 TO-220 Single row fla

    11、nge mount Z GDFP1-G16 16 Flat pack with gull wing leads 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-ST

    12、ANDARD MICROCIRCUIT DRAWING SIZE A 5962-91674 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Total supply voltage (VIN): Device type 01 . 45 V Device type 02 . 63 V ON/OFF pin input voltage -0.3 V V +VINOutput

    13、voltage to ground (steady state) -1 V Maximum power dissipation (PD): Device type 01 . Internally limited Device type 02 . Internally limited Storage temperature range (TSTG) . -65C to +150C Lead temperature range (soldering, 10 seconds) +260C Junction temperature (TJ) . +150C Thermal resistance, ju

    14、nction-to-case (JC): Case outline E . 1.7C/W at 1 W Case outline X . 3.3C/W at 1 W Case outline Y . 3.8C/W at 1 W Case outline Z . 3.0C/W at 0.5 W Thermal resistance, junction-to-ambient (JA): Case E . 67C/W at 0.5 W, no air flow 28C/W at 0.5 W, 500 LFPM Case X . 45C/W at 0.5 W, no air flow 10C/W at

    15、 0.5 W, 500 LFPM Case Y . 68C/W at 0.5 W, no air flow 16C/W at 0.5 W, 500 LFPM Case Z . 121C/W at 0.5 W, no air flow 73C/W at 0.5 W, 500 LFPM 1.4 Recommended operating conditions. Input voltage range: Device type 01 . 18 V to 40 V Device type 02 . 18 V to 60 V Ambient operating temperature range (TA

    16、) -55C to +125C _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDAR

    17、D MICROCIRCUIT DRAWING SIZE A 5962-91674 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this d

    18、rawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD

    19、-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at ht

    20、tp:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the

    21、text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-3

    22、8535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, append

    23、ix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M

    24、. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein,

    25、the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electric

    26、al tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has th

    27、e option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certif

    28、ication/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. Provided by IHSNot for ResaleNo reproduction or networking permitted withou

    29、t license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91674 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA +125C Group A subgroups Device type Limits

    30、 Unit unless otherwise specified Min Max SYSTEM PARAMETERS 2/ Output voltage VOUTTA= 25C 1 All 14.85 15.15 V 0.2 A ILOAD 1 A, 1 01 14.55 15.45 18 V VIN 40 V 2,3 14.40 15.60 0.2 A ILOAD 1 A, 1 02 14.55 15.525 18 V VIN 60 V 2,3 14.40 15.675 ON / OFF CONTROL VIHVOUT= 0 V 1 All 2.2 V ON /OFF pin logic i

    31、nput level 2,3 2.4 VILVOUT= 0 V 1 All 1.0 V ON /OFF pin logic input level 2,3 0.8 ON /OFF pin input current IIHON /OFF pin = 5 V (OFF), TA= 25C 1 All 30 A ON /OFF pin input current IILON /OFF pin = 0 V (ON), TA= 25C 1 All 10 A DEVICE PARAMETERS Saturation voltage VSATIOUT= 1 A 3/ 1 All 1.2 V 2,3 1.4

    32、 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91674 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrica

    33、l performance characteristics Continued. Test Symbol Conditions 1/ -55C TA +125C Group A subgroups Device type Limits Unit unless otherwise specified Min Max DEVICE PARAMETER Continued. Current limit ICLPeak current, tON 3 s 1 All 1.7 3.0 A 3/ 2,3 1.3 3.2 Output leakage current ILVIN= 35 V, output =

    34、 0 V 1 All 2 mA TA= 25C 4/ VIN= 35 V, output = -1 V 30 TA= 25C 4/ Quiescent current IQ4/ 1 All 10 mA 2,3 12 Standby quiescent current ISTBYON /OFF pin = 5 V (OFF) 1 All 200 A 2,3 500 Oscillator frequency fO4 All 47 58 kHz 5,6 43 62 Maximum duty DC TA= +25C 5/ 9 All 93 % cycle (ON) 1/ VIN= 30 V and I

    35、LOAD= 200 mA. 2/ External components such as the catch diode, inductor, input and output capacitors can affect switching regulator system performance. 3/ No diode, inductor or capacitor is connected to output sourcing current. 4/ Feedback is removed from output and connected to 25 V to force the out

    36、put transistor OFF. 5/ Feedback is removed from output and connected to 0 V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91674 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHE

    37、ET 7 DSCC FORM 2234 APR 97 Case outline X FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91674 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC F

    38、ORM 2234 APR 97 Case outline X continued. Symbol Dimension Notes Inches Millimeters Min Max Min Max A .285 .305 7.24 7.75 A1 - .085 - 2.16 a .460 .480 11.68 12.19 b .038 .043 .97 1.09 3, 5 D .880 .915 22.35 23.24 D1 .760 .775 19.30 19.69 e .460 .480 11.68 12.19 2 F .060 .070 1.52 1.78 G1 .490 .510 1

    39、2.45 12.95 L .420 .500 10.67 12.70 L1 - .025 - .64 5 p .151 .161 3.84 4.09 3 q 1.177 1.197 29.90 30.40 R .490 .510 12.45 12.95 3 R1 .168 .178 4.27 4.52 3 18 18 72 72 N 4 4 Note 1, 4 NOTES: 1. The US government preferred system of measurement is the metric SI system. However, since this item was orig

    40、inally designed using inch-pound units of measurement, in the event of conflict between the metric and inch- pound units, the inch-pound units shall take precedence. 2. These dimensions should be measured at points .050 inch (1.27 mm) + .005 inch (0.13 mm) - .000 inch (0.00 mm) below seating plane.

    41、When gauge is not used, measurement will be made at the seating plane. 3. Two places. 4. The seating plane of the header shall be flat within .001 inch (0.03 mm) concave to .004 inch (0.10 mm) convex inside a .930 inch (23.62 mm) diameter circle on the center of the header and flat within .001 inch

    42、(0.03 mm) concave to .006 inch (0.15 mm) convex overall. 5. Lead diameter and glass meniscus shall not exceed twice b within L1. FIGURE 1. Case outline Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 59

    43、62-91674 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 Case outline Y FIGURE 1. Case outline Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 596

    44、2-91674 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 10 DSCC FORM 2234 APR 97 Case outline Y - continued Symbol Dimensions Inches Millimeter Min Max Min Max A .240 .270 6.10 6.86 A1 .035 .045 .89 1.14 A2 .135 .155 3.43 3.94 b .025 .035 .64 .89 D .815 .835 20.70 21.

    45、21 D1 .530 .550 13.46 13.97 D3 - .092 - 2.34 E .685 .695 17.40 17.65 e .095 .105 2.41 2.67 L .500 .750 12.70 19.05 L1 .045 .055 1.14 1.40 p .155 .165 3.94 4.19 Q .697 .707 17.70 17.96 N 5 5 Note 1, 2, 3 NOTES: 1. The US government preferred system of measurement is the metric SI system. However, sin

    46、ce this item was originally designed using inch-pound units of measurement, in the event of conflict between the metric and inch- pound units, the inch-pound units shall take precedence. 2. Metric equivalents are given for general information only. 3. Unless otherwise specified, tin dip leads below

    47、.051 inch (1.27 mm) clearance from the case body. FIGURE 1. Case outline Continued Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91674 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL

    48、 B SHEET 11 DSCC FORM 2234 APR 97 Device types 01 01 and 02 01 01 Case outlines E X Y Z Terminal number Terminal symbol 1 NC +VIN-VINNC 2 NC OUTPUT OUTPUT NC 3 OUTPUT FEEDBACK GND OUTPUT 4 NC ON / OFF FEEDBACK NC 5 GND - ON / OFF NC 6 NC - - NC 7 FEEDBACK - - FEEDBACK 8 NC - - GROUND 9 ON / OFF - - ON / OFF 10 NC - - NC 11 GND - - NC 12 GND - - GROUND 13 GND - - NC 14 GND - - NC 15 NC - - NC 16 VIN- - INPUTFIGURE 2. T


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