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    DLA SMD-5962-90854 REV H-2007 MICROCIRCUIT HYBRID LINEAR SINGLE CHANNEL OPTOCOUPLER TRANSISTOR OUTPUT《晶体管输出光耦合器单一沟道直线式混合微型电路》.pdf

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    DLA SMD-5962-90854 REV H-2007 MICROCIRCUIT HYBRID LINEAR SINGLE CHANNEL OPTOCOUPLER TRANSISTOR OUTPUT《晶体管输出光耦合器单一沟道直线式混合微型电路》.pdf

    1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED E Added class K devices. Redrew entire document. -sld 98-02-23 K. A. Cottongim F Updated drawing to reflect the current requirements of MIL-PRF-38534. -sld 03-07-31 Raymond Monnin G Table I; For the Input-output insulation current test (II-O), unde

    2、r the condition block changed “45 percent RH “ to “RH 65 %“. Editorial changes throughout. -sld 04-10-21 Raymond Monnin H Table I; For Logic high output current (IOH) under conditions column, correct IFfrom 250A to 0. Also change max limit from 250A to 100A. Add “Output Leakage Current” test to Tabl

    3、e I. 07-03-30 Robert M. Heber REV SHEET REV SHEET REV STATUS REV H H H H H H H H H H H H OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Steve L. Duncan DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Robert M. Heber COLUMBUS, OHIO 43218-3990 http:/www.dscc.dl

    4、a.mil APPROVED BY William K. Heckman MICROCIRCUIT, HYBRID, LINEAR, SINGLE CHANNEL, OPTOCOUPLER, TRANSISTOR OUTPUT THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 90-09-28 AMSC N/A REVISION LEVEL H SIZE A CAGE CODE 67268 5962-90854

    5、SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E293-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90854 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 2 DSCC FORM 2234 APR 97 1

    6、. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assuranc

    7、e levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 - 90854 01 H P X Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing num

    8、ber 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as foll

    9、ows: Device type Generic number Circuit function 01 HCPL-5501, HCPL-550K, Transistor output, single channel optocoupler 66126-105, 66126-300 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the req

    10、uirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in sp

    11、ace applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a p

    12、ossible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requi

    13、rements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined b

    14、y the manufacturers internal, QML certified flow. This product may have a limited temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90854 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3

    15、990 REVISION LEVEL H SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style P CDIP2-T8 8 Dual-in-line X See figure 1 8 Dual-in-line Y See figure 1 8 Dual-in-line 1.2.5 Le

    16、ad finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) -0.5 V dc to +20 V dc Peak forward input current (t 1.0 ms). 40 mA Average input forward current (IFAVG) 20 mA Reverse input voltage (VR) 3.0 V dc Output current (IO): Avera

    17、ge. 8.0 mA Peak 16 mA Output voltage range (VO). -0.5 V dc to +20 V dc Emitter base reverse voltage (VEBO) . 3.0 V dc Base current (IB) . 5.0 mA Power dissipation (PD): Input 36 mW Output 50 mW Lead temperature (soldering, 10 seconds) +260C Storage temperatue range -65C to +150C Thermal resistance,

    18、junction-to-case (JC): Case outline P . See MIL-STD-1835 Case outlines X and Y. 28C/W Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . 2.0 V dc to 18 V dc Low Level input current (IFL) 250 A maximum High level input current range (IFH) 12 mA to 20

    19、mA Operating temperature range (TA). -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documen

    20、ts are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case O

    21、utlines. 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROC

    22、IRCUIT DRAWING SIZE A 5962-90854 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 4 DSCC FORM 2234 APR 97 DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents ar

    23、e available online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references

    24、cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and

    25、 K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize

    26、 the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, constr

    27、uction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as spe

    28、cified on figure 2. 3.2.3 Schematic diagram. The schematic diagram shall be as specified on figure 3. 3.2.4 Test circuit and waveforms. The test circuit and waveforms shall be as specified on figure 4. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical perf

    29、ormance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5

    30、 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, t

    31、he manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those w

    32、hich, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to s

    33、upply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be pro

    34、vided with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not

    35、 affect the form, fit, or function as described herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90854 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 5 DSCC FORM 2234 A

    36、PR 97 TABLE I. Electrical performance characteristics. Limits Test Symbol Conditions -55C TA+125C unless otherwise specified Group A subgroups Device type Min Max Unit Current transfer ratio 1/ CTR IF= 16 mA, VO= 0.4 V, VCC= 4.5 V 1,2,3 01 9.0 % Logic high output current IOHVO= VCC= 18 V, IF= 0 1,2,

    37、3 01 100 A Output Leakage Current IOLeak VO= VCC= 18 V, IF= 250 A 1,2,3 01 250 A Logic low supply current ICCLVCC= 18 V, IF= 20 mA 1,2,3 01 200 A Logic high supply current ICCHVCC= 18 V, IF= 0 mA 1,2,3 01 10 A Input forward voltage VFIF= 20 mA 1,2,3 01 1.9 V Input reverse breakdown voltage VBRIR= 10

    38、 A 1,2,3 01 3.0 V Input-to-output isolation 2/ leakage current II-OVI-O= 1500 V dc , TA= +25C, RH 65%, t = 5.0 seconds 1 01 1.0 A Propagation delay time to logic high at output tPLHRL= 8.2 k , CL= 50 pF, IF= 16 mA, VCC= 5.0 V, See figure 3 9,10,11 01 6.0 s Propagation delay time to logic low at outp

    39、ut tPHLRL= 8.2 k , CL= 50 pF, IF= 16 mA, VCC= 5.0 V, See figure 3 9,10,11 01 2.0 s 1/ Current transfer ratio is defined at the ratio of output collector current, IO, to the forward LED input current, IF, times 100 percent. CTR is known to degrade slightly over the units lifetime as a function of inp

    40、ut current, temperature, signal duty cycle, and system time. In short, it is recommended that designers allow at least 20 to 25 percent guardband for CTR degradation. 2/ Device considered a two-terminal device: Pins 1 through 4 are shorted together , and pins 5 through 8 are shorted together. Provid

    41、ed by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90854 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 6 DSCC FORM 2234 APR 97 Case outline X Symbol Millimeters Inches Min Max Min Max

    42、 A 4.57 .180 A1 1.40 1.65 .055 .065 b 0.41 0.51 .016 .020 c 0.18 0.33 .007 .013 D 9.40 9.91 .370 .390 e 2.29 2.79 .090 .110 E 9.65 9.91 .380 .390 E1 8.13 .320 L 1.07 1.32 .042 .052 S 0.89 1.27 .035 .050 NOTES: 1. The U.S. government preferred system of measurement is the metric SI. This item was des

    43、igned using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin 1 is indicated by the ESD triangle marked on top of the package. FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction

    44、or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90854 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 7 DSCC FORM 2234 APR 97 Case outline Y Symbol Millimeters Inches Min Max Min Max A 4.32 .170 A1 1.14 1.40 .045 .055 b 0

    45、.41 0.51 .016 .020 c 0.18 0.33 .007 .013 D 9.40 9.91 .370 .390 e 2.29 2.79 .090 .110 E 8.13 .320 eA 7.37 7.87 .290 .310 Q 0.51 .020 S 0.89 1.27 .035 .050 NOTES: 1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In c

    46、ase of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin 1 is indicated by the ESD triangle marked on top of the package. FIGURE 1. Case outlines - Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without lice

    47、nse from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90854 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 8 DSCC FORM 2234 APR 97 Device type 01 Case outlines P, X, and Y Terminal numbers Terminal connections 1 NC 2 +VF3 -VF4 NC 5 GND 6 VO7 VB8 VCCFIGURE 2. Ter

    48、minal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90854 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 9 DSCC FORM 2234 APR 97 FIGURE 3. Schematic diagram. Provid


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