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    DLA SMD-5962-90555 REV B-2006 MICROCIRCUIT MEMORY DIGITAL CMOS ONE TIME PROGRAMMABLE ASYNCHRONOUS PROGRAMMABLE LOGIC DEVICE MONOLITHIC SILICON《硅单片 异步可单次编程式逻辑设置 高速氧化物半导体数字记忆微型电路》.pdf

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    DLA SMD-5962-90555 REV B-2006 MICROCIRCUIT MEMORY DIGITAL CMOS ONE TIME PROGRAMMABLE ASYNCHRONOUS PROGRAMMABLE LOGIC DEVICE MONOLITHIC SILICON《硅单片 异步可单次编程式逻辑设置 高速氧化物半导体数字记忆微型电路》.pdf

    1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update drawing to current requirements. Editorial changes throughout. - gap 02-02-21 Raymond Monnin B Add QP Semiconductor as an approved source of supply and editorial changes throughout. - tcr 06-06-22 Raymond Monnin THE ORIGINAL FIRST PAGE OF

    2、THIS DRAWING HAS BEEN REPLACED REV SHET REV SHET REV STATUS REV B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Rajesh Pithadia DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Kenneth S. Rice COLUMBUS, OHIO 43218-3990 http:/www.dsc

    3、c.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL APPROVED BY Michael A. Frye DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 92-08-12 MICROCIRCUIT, MEMORY, DIGITAL, CMOS, ONE TIME PROGRAMMABLE, ASYNCHRONOUS PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON AMSC N/A REVISION

    4、 LEVEL B SIZE A CAGE CODE 67268 5962-90555 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E511-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90555 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVIS

    5、ION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following ex

    6、ample: 5962-90555 01 K X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function tPD01 C20RA10 Asynchronous PLD 35 ns 02 C20RA10 Asynchronous PL

    7、D 25 ns 03 C20RA10 Asynchronous PLD 20 ns 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style K GDFP2-F24 or CDFP3-F24 24 Flat pack L GDIP3-T24 or CDIP4-T24 24 Dual-in-line 3, X CQCC1-N28 28 Square

    8、 leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Supply voltage to ground potential -0.5 V dc to +7.0 V dc DC voltage applied to outputs in high Z state . -0.5 V dc to +7.0 V dc DC input voltage . -3.0 V dc to +7

    9、.0 V dc Maximum power dissipation (PD) 2/ . 1.0 W Lead temperature (soldering, 10 seconds) . +260C Thermal resistance, junction-to-case (JC): . See MIL-STD-1835 Junction temperature (TJ) . +175C Storage temperature range . -65C to +150C Temperature under bias -55C to +125C Output current into output

    10、s (low) . -16 mA _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Must withstand the added PDdue to short circuit test; e.g., IOS. Provided by IHSNot for ResaleNo repr

    11、oduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90555 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Supply voltage (VCC) . +4.5 V dc to +5.5 V dc Gr

    12、ound voltage (GND) 0 V dc Input high voltage (VIH) . 2.0 V dc minimum Input low voltage (VIL) . 0.8 V dc maximum Case operating temperature range (TC) -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks f

    13、orm a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFEN

    14、SE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are av

    15、ailable online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the reference

    16、s cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, a

    17、ppendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QM

    18、L product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, o

    19、r function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without licens

    20、e from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90555 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF

    21、-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.3.1 Unprogrammed devices.

    22、The truth table for unprogrammed devices for contracts involving no altered item drawing shall be as specified on figure 2. When required in groups A, B, C, or D (see 4.3), the devices shall be programmed by the manufacturer prior to test. A minimum of 50 percent of the total number of cells shall b

    23、e programmed or at least 25 percent of the total number of cells to any altered item drawing. 3.2.3.2 Programmed devices. The truth table for programmed devices shall be as specified by an attached altered item drawing. 3.3 Electrical performance characteristics. Unless otherwise specified herein, t

    24、he electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described

    25、in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations,

    26、 the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certi

    27、fication mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of com

    28、pliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, append

    29、ix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to r

    30、eview the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Processing options. Since the device is capable of being programmed by either the manufacturer or the user to result in a wide variety of

    31、 configurations; two processing options are provided for selection in the contract, using an altered item drawing. 3.10.1 Unprogrammed device delivered to the user. All testing shall be verified through group A testing as defined in 3.2.3.1 and table II. It is recommended that users perform subgroup

    32、s 7 and 9 after programming to verify the specific program configuration. 3.10.2 Manufacturer-programmed device delivered to the user. All testing requirements and quality assurance provisions herein, including the requirements of the altered item drawing, shall be satisfied by the manufacturer prio

    33、r to delivery. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90555 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance cha

    34、racteristics. Test Symbol Conditions -55C TC +125C 4.5 V VCC 5.5 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max Output high voltage VOHVCC= 4.5 V, IOH= -2.0 mA, 1, 2, 3 All 2.4 V IN= VIH, VILOutput low voltage VOLVCC= 4.5 V, IOL= 8.0 mA, 1, 2, 3 All 0.5 V IN= VIH, VIL

    35、Input high voltage 1/ VIH1, 2, 3 All 2.0 V Input low voltage 1/ VIL1, 2, 3 All 0.8 V Input leakage current IIXVIN= 5.5 V to GND 1, 2, 3 All -10 10 A Output leakage current IOZVCC= 5.5 V, 1, 2, 3 All -40 40 A OUT= 5.5 V and GND Output short circuit IOSVCC= 5.5 V, 1, 2, 3 All -30 -90 mA current 2/ 3/

    36、VOUT= 0.5 V Standby power supply ICC1VCC= 5.5 V, IOUT= 0 mA, 1, 2, 3 All 80 mA current VIN= GND Power supply current ICC2VCC= 5.5 V, IOUT= 0 mA, 1, 2, 3 All 85 mA at frequency 3/ VIN= 0 to 3 V, f = fMAXInput capacitance 3/ CINVCC= 5.0 V 4 All 10 pF TA= +25C, f = 1 MHz Output capacitance 3/ COUT(see

    37、4.3.1c) 4 All 10 pF Functional tests see 4.3.1d 7, 8A, 8B All L H V Input or feedback to tPD9, 10, 11 01 35 ns nonregistered output 4/ 02 25 03 20 Input to output enable tEA9, 10, 11 01 35 ns 5/ 02 30 03 20 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking per

    38、mitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90555 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C 4.5 V VCC 5.5

    39、V Group A subgroups Device type Limits Unit unless otherwise specified Min Max Input to output disable tER9, 10, 11 01 35 ns 3/ 5/ 02 30 03 20 OE to output enable tPZX9, 10, 11 01 25 ns 5/ 02 20 03 15 OE to output disable tPXZ9, 10, 11 01 25 ns 3/ 5/ 02 20 03 15 Clock to output 4/ tCO9, 10, 11 01 35

    40、 ns 02 25 03 20 Input or feedback tSU9, 10, 11 01 20 ns setup time 4/ 02 15 03 10 Hold time 4/ tH9, 10, 11 01, 02 5 ns 03 3 Clock period tP9, 10, 11 01 55 ns (tSU+ tCO) 4/ 02 40 03 30 Clock width high 4/ tWH9, 10, 11 01 25 ns 02 18 03 12 Clock width low 4/ tWL9, 10, 11 01 25 ns 02 18 03 12 See footn

    41、otes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90555 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performa

    42、nce characteristics - Continued. Test Symbol Conditions -55C TC +125C 4.5 V VCC 5.5 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max Maximum frequency fMAX9, 10, 11 01 18.1 MHz (1/(tP) 3/ 4/ 02 25.0 03 33.3 Input to asynchronous tS9, 10, 11 01 40 ns set of registered 02

    43、 25 output 4/ 03 20 Input to asynchronous tR9, 10, 11 01 40 ns reset of registered 02 25 output 4/ 03 20 Asynchronous set/reset tAR9, 10, 11 01 20 ns recovery time 4/ 02 15 03 12 Preload pulse width 4/ tWP9, 10, 11 All 15 ns Preload setup time 3/ 4/ tSUP9, 10, 11 All 15 ns Preload hold time 3/ 4/ tH

    44、P9, 10, 11 All 15 ns 1/ These are absolute values with respect to device ground and all overshoots due to system or tester noise are included. 2/ For test purposes, not more than one output at a time should be shorted. Short circuit test duration should not exceed 1 second. VOUT= 0.5 V has been chos

    45、en to avoid test problems caused by tester ground degradation. 3/ Tested initially and after any design or process changes that affect that parameter, and therefore shall be guaranteed to the limits specified in table I. 4/ AC tests are performed with input rise and fall times of 5 ns or less, timin

    46、g reference levels of 1.5 V, input pulse levels of 0 to 3.0 V, and the output load on figure 3, circuit A. See figure 4 for waveforms. 5/ Measured using the test load on figure 3, circuit B. See figure 4 for waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without lice

    47、nse from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90555 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 Device types 01 through 03 Case outlines K, L 3 X Terminal number Terminal symbol 1 PL PL PL 2 I0I0I03 I1 1 14 I2NC I25 I3I2NC 6 I4

    48、 3I37 I5I4 48 I6 5NC 9 I7I6I510 I8 7 611 I9NC NC 12 GND I8I713 OE I9 814 I/O9GND I915 I/O8OE GND 16 I/O7I/O9OE 17 I/O6I/O8I/O918 I/O5NC I/O819 I/O4I/O7NC 20 I/O3I/O6I/O721 I/O2I/O5I/O622 I/O1I/O4I/O523 I/O0I/O3I/O424 VCCI/O2I/O325 - NC I/O226 - I/O1I/O127 - I/O0I/O028 - VCCVCCProvided by IHSNot for ResaleNo reproduction or networking permitted without license from


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