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    DLA SMD-5962-89803 REV A-2009 MICROCIRCUIT LINEAR WIDEBAND LOG AMPLIFIER MONOLITHIC SILICON.pdf

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    DLA SMD-5962-89803 REV A-2009 MICROCIRCUIT LINEAR WIDEBAND LOG AMPLIFIER MONOLITHIC SILICON.pdf

    1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update standard SMD paragraphs. -rrp 09-02-03 R. HEBER THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Rick C. Officer DEFE

    2、NSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles E. Besore COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, WIDEBAND LOG AMPLIFIER, MONOLITHIC SILICON AND AGENCIES OF THE

    3、 DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 90-10-05 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-89803 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E255-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 59

    4、62-89803 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Ide

    5、ntifying Number (PIN). The complete PIN is as shown in the following example: 5962-89803 01 X X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type. The device type identifies the circuit function as follows: Device type Generic number Circuit funct

    6、ion 01 SL523AC 120 MHz wideband log amplifier 1.2.2 Case outlines. The case outline are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 8 Can 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.

    7、3 Absolute maximum ratings. 1/ Supply voltage (V+) +9.0 V dc Maximum instantaneous voltage at video output . +12 V dc Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Power dissipation (PD) 500 mW Thermal resistance, junction-to-case (JC) 60C/W Thermal resista

    8、nce, junction-to-ambient (JA) . 70C/W Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage (V+) +6 V Supply current (I+) +36 mA Ambient operating temperature range (TA) . -55C to +125C 1/ All outputs may be shorted to ground.Provided by IHSNot for ResaleNo reproductio

    9、n or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89803 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following

    10、 specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, Gene

    11、ral Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit D

    12、rawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and

    13、the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL

    14、-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be pr

    15、ocessed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect

    16、 form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, constru

    17、ction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Circuit diagram. T

    18、he circuit diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requireme

    19、nts. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, th

    20、e manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all n

    21、on-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted w

    22、ithout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89803 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TC+125C unless otherwise specified Group

    23、 A subgroups Device type Limits Unit Min MaxSupply current I+ 1, 2, 3 01 25 36 mA Small signal voltage gain AVSf = 30 MHz 4 01 22.6 25.4 dB f = 60 MHz 22.0 26.0 f = 60 MHz 5, 6 20.0 28.0 Upper cut-off frequency fCU5, 6 01 100 MHz Lower cut-off frequency fCL5, 6 01 20 MHz Maximum rectified video outp

    24、ut current IRVVIN= 0.5 V rms, f = 60 MHz 4 01 1.9 2.3 mA 5, 6 1.7 2.5 Noise figure N RS= 450 , f = 60 MHz, TA= +25C 4 01 5.25 dB 1/ Unless otherwise specified, V+ = +6.0 V dc, source impedance = 10 , VIN= 7 mV, load impedance = 8 pF, f = 60 MHz and dc connection between pins 6 and 7. 3.6 Certificate

    25、 of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufact

    26、urers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change.

    27、 Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made

    28、 available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89803 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97

    29、Case X NOTES: 1. Dimensions are in inches. 2. Metric equivalents are for general information only. 3. All leads: b applies between L1 and L2. b1 applies between L2 and .500 (12.70 mm) from the reference plane. Diameter is uncontrolled in L1 and beyond .500 (12.70 mm) from the reference plane. 4. Mea

    30、sured from maximum diameter of the product. 5. Leads having a maximum diameter .019 (0.48 mm) measured in gauging plane .054 (1.37 mm) + .001 (0.03 mm) - .000 (0.0 mm) below the base plane of the product shall be within .007 (0.18 mm) of their true position relative to a maximum width tab. 6. The pr

    31、oduct may be measured by direct methods or by gauge. 7. All leads: Increase maximum limit by .003 (0.08 mm) when lead finish A or B is applied. 8. The location, alpha, of the leads N is 360/N, N is total number of leads or lead positions. FIGURE 1. Case outline. Provided by IHSNot for ResaleNo repro

    32、duction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89803 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 Case X Dimensions Inches Millimeters Symbol Min Max Min Max Notes A .165 .185 4.19 4.70

    33、 b .016 .019 0.41 0.48 3, 5, 7 b1 .016 .021 0.41 0.53 3, 5, 7 D .335 .370 8.51 9.40 D1 .305 .335 7.75 8.51 D2 .110 .160 2.79 4.06 e .200 BSC 5.08 BSC 5 e1 .100 BSC 2.54 BSC 5 F - .040 - 1.02 k .027 .034 0.69 0.86 k1 .027 .045 0.69 1.14 4 L .500 .750 12.70 19.05 3 L1 - .050 - 1.27 3 L2 .250 - 6.35 -

    34、3 45 BSC 45 BSC 5 N 8 8 FIGURE 1. Case outline Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89803 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 7 DSCC FORM 2234

    35、 APR 97 Device type 01 Case outline X Terminal number Terminal symbol 1 GND 2 V+ 3 RF OUTPUT 4 VIDEO OUTPUT 5 INPUT GND 6 RF INPUT 7 BIAS 8 GND FIGURE 2. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAW

    36、ING SIZE A 5962-89803 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 One amplifier FIGURE 3. Circuit diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE

    37、A 5962-89803 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance

    38、with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under

    39、 document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, mi

    40、nimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance wi

    41、th method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.3.2 Group

    42、s C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and s

    43、hall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours,

    44、 except as permitted by method 1005 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89803 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 10 DSCC FORM 2234 APR

    45、97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) 1 Final electrical test parameters (method 5004) 1*, 2, 3, 4, 5 Group A test requirements (method 5005) 1, 2, 3, 4, 5,

    46、 6 Groups C and D end-point electrical parameters (method 5005) 1 * PDA applies to subgroup 1. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intend

    47、ed for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control o

    48、f SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Use


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