1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device type 03. Make changes to 1.2.1, 1.2.2, table I, and figure 1. 95-01-13 M. A. FRYE B Update boilerplate for class V requirements. Change to the input noise voltage test, output voltage swing test, and slew rate test in table I. Add tabl
2、e IIB. rrp 00-08-14 R. MONNIN C Add case outline D. Make changes to 1.2.4, 1.3, and figure 1. - ro 01-04-16 R. MONNIN D Drawing updated to reflect current requirements. - ro 06-03-20 R. MONNIN E Update drawing as part of 5 year review. - jt 13-01-22 C. SAFFLE THE ORIGINAL FIRST SHEET OF THIS DRAWING
3、 HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY RICK C. OFFICER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY AL
4、L DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY CHARLES E. BESORE APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, QUAD, MATCHED, OPERATIONAL AMPLIFIER, MONOLITHIC SILICON DRAWING APPROVAL DATE 89-10-31 AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 67268 5962-89801 SHEET 1 OF 10 DSC
5、C FORM 2233 APR 97 5962-E171-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89801 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This dr
6、awing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiatio
7、n Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 5962 - 89801 01 C X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Case outline (see 1.2.4) Lead finish (see 1.2.5) / / Dr
8、awing number For device class V: 5962 - 89801 01 V C X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked dev
9、ices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device types
10、. The device types identify the circuit function as follows: Device type Generic number Circuit function 01 OP-11A Quad, matched operational amplifier 02 OP-11B Quad, matched operational amplifier 03 OP-11A Quad, matched operational amplifier (without noise testing) 1.2.3 Device class designator. Th
11、e device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device.
12、 Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduc
13、tion or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89801 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline le
14、tter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A f
15、or device class M. 1.3 Absolute maximum ratings. 1/ Positive supply voltage (+VS) +22 V dc Negative supply voltage (-VS) . -22 V dc Differential input voltage 30 V dc Input voltage (VIN) . Supply voltage Output short circuit duration . Continuous Power dissipation (PD): Cases C, D, and 2 800 mW Stor
16、age temperature range -65C to +150C Junction temperature (TJ) +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Case C . 91C/W Case D . 140C/W Case 2 110C/W 1.4 Recommended operating condition
17、s. Positive supply voltage (+VS) +15 V dc Negative supply voltage (-VS) . -15 V dc Ambient operational temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this draw
18、ing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-88
19、3 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by
20、 IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89801 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microc
21、ircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event
22、of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individua
23、l item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual it
24、em requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein f
25、or device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics an
26、d postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test
27、requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN
28、number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device cla
29、ss M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6
30、 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer
31、in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and
32、V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A sha
33、ll be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affect
34、s this drawing. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89801 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteris
35、tics. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min Max Input offset voltage VOSRS= 50 , 10 k 1 01, 03 0.5 mV 2, 3 1.0 1 02 2.5 2, 3 3.5 Input offset current IOS1 01, 03 20 nA 2, 3 40 1 02 50 2, 3 80 Input bias current IIB1 01, 03
36、 300 nA 2, 3 375 1 02 500 2, 3 650 Common mode rejection ratio CMRR VCM= 12 V, 3/ RS= 50 and 10 k, 1, 2, 3 All 100 dB VCM= IVR = 12 V Power supply rejection PSRR VS= 5 V, 15 V RS= 50 and 10 k 1, 2, 3 All 32 V/V Input offset voltage match VOS1 01, 03 0.75 mV 2, 3 1.0 1 02 2.0 2, 3 2.5 Common mode rej
37、ection match CMR VCM= IVR = 12 V 1, 2, 3 All 94 dB Differential input 4/ 5/ resistance RIN1 01, 03 173 k 02 100 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89801 DLA LAND AN
38、D MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits 2/ Unit Min Max Large signal voltage gain AVOLVOUT= 1
39、0 V, 4 All 100 V/mV RL= 2 k 5, 6 50 Output voltage swing VOUTRL= 2 k 4, 5, 6 All 11 V Output resistance 4/ ROUTTA= +25C 4 01, 02 150 Quiescent power 4/ 6/ consumption PCVOUT= 0 V, IOUT= 0 mA 4 All 180 mW 5, 6 200 Channel separation CS TA= +25C 4 All 100 dB Input noise voltage eNfO= 1 to 100 Hz, Gain
40、 = 1 M 7 01, 02 350 nVRMSSlew rate SR+ AVCL = +1 7,8 4/ All 0.7 V/s SR- 0.7 Overshoot OS TA= +25C 9 All 25 % Rise time trAVCL = +1, VIN= 50 mV, TA= +25C 9 All 145 ns 1/ Unless otherwise specified, VS= 15 V, RS= 50 , and VCM= 0 V. 2/ The limiting terms “min” (minimum) and “max” (maximum) shall be con
41、sidered to apply to magnitudes only. Negative current shall be defined as conventional current flow out of a device terminal. 3/ IVR is defined as the VCM= range used for the CMRR test. 4/ If not tested, shall be guaranteed to the limits specified in table I herein. 5/ RINis derived from IB by the r
42、elationship: RIN= 2kT/qIB, where kT/q = 0.026 V at +25C. 6/ Quiescent power consumption based on quiescent power supply current test maximum (no load on outputs). 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime s agent, and the acquiri
43、ng activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall
44、be in microcircuit group number 49 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89801 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 7 DSCC FORM 223
45、4 APR 97 Device types 01, 02, and 03 Case outlines C and D 2 Terminal number Terminal symbol 1 OUTPUT 1 NC 2 -INPUT 1 OUTPUT 1 3 +INPUT1 -INPUT 1 4 +VS+INPUT 1 5 +INPUT 2 NC 6 -INPUT 2 +VS7 OUTPUT 2 NC 8 OUTPUT 3 +INPUT 2 9 -INPUT 3 -INPUT 2 10 +INPUT 3 OUTPUT 2 11 -VSNC 12 +INPUT 4 OUTPUT 3 13 -INP
46、UT 4 -INPUT 3 14 OUTPUT 4 +INPUT 3 15 - NC 16 - -VS17 - NC 18 - +INPUT 4 19 - -INPUT 4 20 - OUTPUT 4 NC = No connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89801 DL
47、A LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 8 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Manage
48、ment (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class
