1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Made technical changes to 1.3. Changed footnote 1/ of table I. Added a new vendor CAGE code 01295. Editorial changes throughout. 89-11-22 W. Heckman B Update to reflect latest changes in format and requirements. Editorial changes throughout. -les
2、 05-03-08 Raymond Monnin C Update drawing as part of 5 year review. -jt 11-11-08 C. SAFFLE THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Tim H. Noh DLA LAND AND MARITIME COLU
3、MBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Tim H. Noh APPROVED BY William K. Heckman MICROCIRCUITS, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY TTL, DUAL AND-O
4、R-INVERT GATE, MONOLITHIC SILICON DRAWING APPROVAL DATE 88-11-21 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-88774 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E035-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWIN
5、G SIZE A 5962-88774 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or I
6、dentifying Number (PIN). The complete PIN is as shown in the following example: 5962-88774 01 C X Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type. The device type identify the circuit function as follows: Device type Generic number Circuit fu
7、nction 01 54F51 Dual 2-wide 2-input, 2-wide 3-input AND-OR-invert gate 1.2.2 Case outline. The case outline are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 dual-in-line D GDFP1-F14 or CDFP2-F14 14 flat 2 CQCC
8、1-N20 20 leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range -0.5 V dc to +7.0 V dc Input voltage range . -0.5 V dc to +7.0 V dc Input current range -30 mA to +5.0 mA Voltage range applied to output
9、 in high output state -0.5 V dc to +VCCCurrent applied to output in low output state . 40 mA Storage temperature range . -65C to +150C Maximum power dissipation (PD) 1/ 41.25 mW Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction tem
10、perature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage (VCC) +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (VIH) . 2.0 V dc Maximum low level input voltage (VIL) 0.8 V dc Input clamp current -18 mA High level output current (IOH) -1.0 mA Low level output c
11、urrent (IOL) 20 mA Case operating temperature range (TC) -55C to +125C _ 1/ Maximum power dissipation is defined as VCCx ICC, and must withstand the added PDdue to short-circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDAR
12、D MICROCIRCUIT DRAWING SIZE A 5962-88774 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to
13、 the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Te
14、st Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assi
15、st.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence
16、. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specif
17、ied herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved p
18、rogram plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not a
19、ffect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535,
20、 appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Test circuit and switching wave
21、forms. The test circuit and switching waveforms shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4
22、 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWI
23、NG SIZE A 5962-88774 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be m
24、arked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in complianc
25、e to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in ord
26、er to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and
27、the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required
28、 for any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore
29、 at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88774 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical perform
30、ance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max High level output voltage VOHVCC= 4.5 V, IOH= -1.0 mA, 1, 2, 3 All 2.5 V VIL= 0.8 V, VIH= 2.0 V Low level output voltage VOLVCC= 4.5 V, IOL= 20 mA, VIL= 0.8 V, VIH=
31、 2.0 V 1, 2, 3 All 0.5 V Input clamp voltage VIKVCC= 4.5 V, IIN= -18 mA 1, 2, 3 All -1.2 V High level input current IIH1VCC= 5.5 V, VIN= 2.7 V 1, 2, 3 All 20 A IIH2VCC= 5.5 V, VIN= 7.0 V 1, 2, 3 All 100 A Low level input current IILVCC= 5.5 V, VIN= 0.5 V 1, 2, 3 All -600 A Short circuit output curre
32、nt IOSVCC= 5.5 V, VOUT= 0.0 V 1/ 1, 2, 3 All -60 -150 mA Supply current ICCHVCC= 5.5 V, VIN= 0.0 V 1, 2, 3 All 3.0 mA ICCLVCC= 5.5 V, VIN 4.0 V 7.5 Functional tests See 4.3.1c 7, 8 All Propagation delay time, tPLHVCC= 5.0 V, 9 All 2.0 5.5 ns A, B, C, D, E, F, to Y RL= 500 , 10, 11 1.5 7.5 tPHLCL= 50
33、 pF, 9 All 1.0 4.0 ns See figure 3 10, 11 1.0 5.0 1/ Not more than one output will be shorted at one time and the duration of the test condition shall not exceed 1 second. (For testing IOS, the use of high-speed test apparatus and/or sample-and-hold techniques are preferable in order to minimize int
34、ernal heating and more accurately reflect operational values. Otherwise, prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests.) Provided by IHSNot for ResaleNo reproduction or networking permitted without lic
35、ense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88774 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines C and D 2 Terminal number Terminal symbol Terminal symbol 1 1A NC 2 2A 1A 3 2B 2A 4 2C 2B 5 2D NC 6 2 Y 2C 7 G
36、ND NC 8 1 Y 2D 9 1D 2 Y 10 1E GND 11 1F NC 12 1B 1 Y 13 1C 1D 14 VCC1E 15 - - - NC 16 - - - 1F 17 - - - NC 18 - - - 1B 19 - - - 1C 20 - - - VCCNC = No connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD
37、 MICROCIRCUIT DRAWING SIZE A 5962-88774 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 Three-input gates Inputs Output A B C D E F 1 Y H H H X X X L X X X H H H L All other combinations H Two-input gates Inputs Output A B C D 2 Y H H X X L X X H H L Al
38、l other combinations H H = High voltage level L = Low voltage level X = Irrelevant FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88774 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990
39、REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 NOTES: 1. CL includes probe and jig capacitance. 2. RT= termination resistance and should be equal to ZOUTof the pulse generators. 3. VX= unclocked pins and must be held 0.8 V; 2.7 V or open per function table. 4. Input pulse characteristics: PRR = 1 MH
40、z, pulse width = 500 ns, tTLH= tTHL 2.5 ns, duty cycle = 50%. FIGURE 3. Test circuit and switching waveforms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88774 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3
41、990 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all dev
42、ices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to th
43、e preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as
44、 specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical para
45、meters (method 5004) - Final electrical test parameters (method 5004) 1*, 2, 3, 7, 8, 9, 10, 11 Group A test requirements (method 5005) 1, 2, 3, 7, 8, 9, 10, 11 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. 4.3 Quality conformance inspection. Quali
46、ty conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, and 6 in table I, method 5005 o
47、f MIL-STD-883 shall be omitted. c. Subgroups 7 and 8 shall include verification of the truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88774 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISI
48、ON LEVEL C SHEET 10 DSCC FORM 2234 APR 97 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, o
