1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changed maximum limits for (VR) from 5 V to 3 V in 1.3. Made technical changes to table I. Changed drawing to reflect MIL-PRF-38534 processing. Made changes to table II. Editorial changes throughout. 90-09-24 W. Heckman B Add case outlines X and
2、Y. Redrew entire document. 93-09-03 K. A. Cottongim C Changes in accordance with NOR 5962-R033-94. 93-11-12 K. A. Cottongim D Changes in accordance with NOR 5962-R067-95. 95-02-06 K. A. Cottongim E Added device type 02 for class K. Redrew entire document. -sld 98-05-15 K. A. Cottongim F Updated draw
3、ing to reflect the current requirements of MIL-PRF-38534. -sld 03-05-14 Raymond Monnin G Update drawing. -gz 09-04-08 Joseph D. RodenbeckTHE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV G SHEET 15 REV STATUS REV G G G G G G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10
4、 11 12 13 14 PMIC N/A PREPARED BY Robert M. Heber STANDARD MICROCIRCUIT DRAWING CHECKED BY Ray Monnin DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY Michael A. Frye MICROCIRCUIT, HYBRID, DIGITAL, SINGLE CHANNEL, HIGH SPEED LOGIC GATE OPTICALLY COUPLED ISO
5、LATOR THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-03-02 AMSC N/A REVISION LEVEL G SIZE A CAGE CODE 67268 5962-88768 SHEET 1 OF 15 DSCC FORM 2233 APR 97 5962-E263-09Provided by IHSNot for ResaleNo reproduction or networking p
6、ermitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88768 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MI
7、L-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: For class H d
8、evices: 5962-88768 01 P X Drawing number Device type Case outline Lead finish (see 1.2.2) (see 1.2.4) (see 1.2.5) For class K devices: 5962 - 88768 02 K P X Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4)
9、(see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s
10、) identify the circuit function as follows: Device type Generic number Circuit function 01 HCPL-5201 Single channel optocoupler 02 HCPL-520K Single channel optocoupler 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All le
11、vels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This leve
12、l is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-P
13、rocess Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C and D). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from
14、 IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88768 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 3 DSCC FORM 2234 APR 97 E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class.
15、These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers int
16、ernal, QML certified flow. This product may have a limited temperature range. 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style P CDIP2-T8 8 Dual-in-line X See figure 1 8 Dual-in-line Y See figur
17、e 1 8 Dual-in-line 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC), 0.0 V dc to 20 V dc Average forward current (IAVG) . 8.0 mA Peak forward current (IFPK). 20 mA 2/ Reverse input voltage (VR). 3.0 V dc Average ou
18、tput current, single channel device (IO) 15 mA Output voltage range (VO) -0.3 V dc to +20 V dc Three state enable voltage (VE) . -0.3 V dc to +20 V dc Power dissipation, single channel device (PD) . 200 mW Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) +260C Junctio
19、n temperature (TJ). +175C Thermal resistance, junction-to-case (JC): Case outline P See MIL-STD-1835 Case outlines X and Y 28 C/W Case temperature (TC) . +170C 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.5 V dc to 20 V dc High level input current range (IF(ON) 2.0 mA to 8.0
20、mA Low level input voltage range (VF(OFF) 0.V dc to 0.8 V dc High level enable voltage range (VEH) 2.0 V dc to 20 V dc Low level enable voltage range (VEL). 0 V dc to 0.8 V dc Fan out (N). 4 TTL loads maximum Ambient operating temperature range (TA) -55C to +125C 1/ Stresses above the absolute maxim
21、um rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Peak forward input current pulse width VCC1,2,3 All 100 A VO= 20 V, IF= 8.0 mA, VCC= 4.5 V, VOUT VCC500 Supply current ICCLVF= 0.0 V, VCC= 5.5 V, VE= dont c
22、are 1,2,3 All 6.0 mA VF= 0.0 V, VCC= 20 V, VE= dont care 1,2,3 All 7.5 ICCHIF= 8.0 mA, VCC= 5.5 V, VE= dont care 1,2,3 All 4.5 mA IF= 8.0 mA, VCC= 20 V, VE= dont care 1,2,3 All 6.0 Output short circuit 2/ current IOSLVF= 0.0 V, VO= VCC= 5.5 V 1,2,3 All 20 mA VF= 0.0 V, VO= VCC= 20 V 35 IOSHIF= 8.0 m
23、A, VCC= 5.5 V, VO= GND 1,2,3 All -10 mA IF= 8.0 mA, VCC= 20 V, VO= GND -25 Input forward voltage VFIF= 8.0 mA 1,2,3 All 1.0 1.8 V Input reverse breakdown voltage VRIR= 10 A 1,2,3 All 3.0 V See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without lic
24、ense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88768 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits Test Symbol Conditions 1/ -55C TA+125C unless otherwise specif
25、ied Group A subgroups Device type Min Max Unit Input to output insulation leakage current 3/ II-OVI-O= 1500 V dc, 45% RH, t = 5 seconds, TA= +25C 4/ 1 All 1.0 A Logic high common mode transient immunity 5/ 6/ CMH VCM= 50 VP-P, IF= 2.0 mA 9,10,11 All 1000 V/s Logic low common mode transient immunity
26、5/ 6/ CML VCM= 50 VP-P, IF= 0.0 mA 9,10,11 All 1000 V/s High impedance output current IOZLVEN= 2.0 V, VO= 0.4 V, VF= 0.0 V 1,2,3 All -20 A IOHZVEN= 2.0 V, VO= 2.4 V, IF= 8.0 mA 1,2,3 All 20 A VEN= 2.0 V, VO= 5.5 V, IF= 8.0 mA 100 VEN= 2.0 V, VO= 20 V, IF= 8.0 mA 500 Logic high enable voltage VEH1,2,
27、3 All 2.0 V Logic low enable voltage VEL1,2,3 All 0.8 V Logic high enable current IEHVEN= 2.7 V 1,2,3 All 20 A VEN= 5.5 V 100 VEN= 20 V 250 Logic low enable current IELVEN= 0.4 V 1,2,3 All -0.32 mA See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted wi
28、thout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88768 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 8 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits Test Symbol Conditions 1/ -55C TA+125C unless otherwi
29、se specified Group A subgroups Device type Min Max Unit Propagation delay time high to low level output tPHLSee figure 5 9,10,11 All 350 ns Propagation delay time low to high level output tPLHSee figure 5 9,10,11 All 350 ns 1/ Unless otherwise specified, 0.0 V dc VF(OFF) 0.8 V dc, 4.5 V dc VCC 20 V
30、dc, 2.0 mA IF(ON) 8.0 mA, 2.0 V VEH 20 V, and 0.0 V VEL .8 V. 2/ Not more than one output should be shorted at a time and duration of short circuit condition shall not exceed 10 ms. 3/ This is a momentary withstand test, not an operating condition. 4/ Device is considered a two terminal device. Pins
31、 1 through 4 shorted together and pins 5 through 8 are shorted together. 5/ CML is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage in the logic low state (VO 0.8 V dc). CMH is the maximum rate of fall of the common mode voltage that can be sustained
32、with the output voltage in the logic high state (VO 2.0 V dc). 6/ Parameters shall be tested as part of device intial characterization and after design and process changes. Parameters shall be guaranteed to the limits specified in table I for all lots not specifically tested. Provided by IHSNot for
33、ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88768 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 9 DSCC FORM 2234 APR 97 Case outline X 50SEATINGPLANESymbol Millimeters Inches Min Max Min Max A
34、4.57 .180 A1 1.40 1.65 .055 .065 b 0.41 0.51 .016 .020 c 0.18 0.33 .007 .013 D 9.40 9.91 .370 .390 e 2.29 2.79 .090 .110 E 9.65 9.91 .380 .390 E1 8.13 .320 L 1.07 1.32 .042 .052 S 0.89 1.27 .035 .050 NOTES: 1. The U.S. government preferred system of measurement is the metric SI. This item was design
35、ed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin 1 is indicated by the ESD triangle marked on top of the package. FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or
36、networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88768 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 10 DSCC FORM 2234 APR 97 Case outline Y Symbol Millimeters Inches Min Max Min Max A 4.32 .170 A1 1.14 1.40 .045 .055 b 0.4
37、1 0.51 .016 .020 c 0.18 0.33 .007 .013 D 9.40 9.91 .370 .390 e 2.29 2.79 .090 .110 E 8.13 .320 eA 7.37 7.87 .290 .310 Q 0.51 .020 S 0.89 1.27 .035 .050 NOTES: 1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In cas
38、e of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin 1 is indicated by the ESD triangle marked on top of the package. FIGURE 1. Case outline - Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license
39、 from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88768 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 11 DSCC FORM 2234 APR 97 Device types All Case outlines P, X, and Y Terminal numbers Terminal symbols 1 2 3 4 5 6 7 8 NC +VF-VFNC GND VEVOVCCNOTE: NC is no co
40、nnection FIGURE 2. Terminal connections. Input Enable Output H H Z L H Z H L H L L L H = Logic high voltage level L = Logic low voltage level Z = High impedance state FIGURE 3. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MIC
41、ROCIRCUIT DRAWING SIZE A 5962-88768 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 12 DSCC FORM 2234 APR 97 FIGURE 4. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A
42、 5962-88768 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 13 DSCC FORM 2234 APR 97 NOTES: 1. Pulse generator having the following characteristics: tR= tF= 5.0 ns f = 100 kHz 10% duty cycle 2. Load capacitance (CL) includes probe and jig capacitance. 3. All diodes (D
43、1through D4) are 1N916 or 1N3064. FIGURE 5. Propagation delay times test circuit and waveform. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88768 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 RE
44、VISION LEVEL G SHEET 14 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-PRF-38534 test requirements Subgroups (in accordance with MIL-PRF-38534, group A test table) Interim electrical parameters 1 Final electrical parameters 1*, 2, 3, 9 Group A test requirements 1, 2, 3, 9, 10, 11
45、Group C end-point electrical parameters 1, 2, 3 End-point electrical parameters for Radiation Hardness Assurance (RHA) devices Not applicable * PDA applies to subgroup 1. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. Burn-in tes
46、t, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outpu
47、ts, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TAas specified in accordance with table I of method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance with MIL-PRF-38534 and as specifi
