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    DLA SMD-5962-88682 REV C-2013 MICROCIRCUIT DIGITAL HIGH-SPEED CMOS DUAL 4-LINE TO 1-LINE DATA SELECTOR MULTIPLEXER WITH THREE-STATE OUTPUTS MONOLITHIC SILICON.pdf

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    DLA SMD-5962-88682 REV C-2013 MICROCIRCUIT DIGITAL HIGH-SPEED CMOS DUAL 4-LINE TO 1-LINE DATA SELECTOR MULTIPLEXER WITH THREE-STATE OUTPUTS MONOLITHIC SILICON.pdf

    1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R329-92. - WLM 92-10-30 Monica L. Poelking B Correct title to accurately describe device function. Add notes to figure 4, switching waveforms and test circuit. Update boilerplate to MIL-PRF-38535 requirements.

    2、Editorial changes throughout. LTG 06-10-12 Thomas M. Hess C Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 13-01-25 Thomas M. Hess REV SHEET REV SHEET REV STATUS REV C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Jeffery Tunstall DL

    3、A LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY Thomas J. Riccuiti APPROVED BY William K. Heckman MICROCIRCUIT, DIGITAL, ,

    4、HIGH-SPEED CMOS, DUAL 4-LINE TO 1-LINE DATA SELECTOR/ MULTIPLEXER WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON DRAWING APPROVAL DATE 90-05-29 REVISION LEVEL C SIZE A CAGE CODE 67268 5962-88682 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E215-13 Provided by IHSNot for ResaleNo reproduction or networking

    5、 permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88682 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B micro

    6、circuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88682 01 E A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) ident

    7、ify the circuit function as follows: Device type Generic number Circuit function 01 54HC253 Dual 4-line to 1-line data selector/ multiplexer with three-state outputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Ter

    8、minals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (

    9、VIN) -0.5 V dc to VCC+ 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc Clamp diode current (IIC) 20 mA DC output current (per pin) 25 mA DC VCCor GND current (per pin) . 50 mA Storage temperature range (TSTG) -65C to +150C Maximum power dissipation (PD) . 500 mW 4/ Lead temperat

    10、ure (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) +2.0 V dc to +6.0 V dc Input voltage range (VIN) 0.0 V dc to VCCOutput voltage range (VOUT) . 0.0 V dc t

    11、o VCCCase operating temperature range (TC) . -55C to +125C Input rise or fall time (tr, tf): VCC= 2.0 V . 0 to 1000 ns VCC= 4.5 V . 0 to 500 ns VCC= 6.0 V . 0 to 400 ns _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels

    12、may degrade performance and affect reliability. 2/ Unless otherwise specified, all voltages are referenced to ground. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ For TC= +100C to +125C, derate linearly

    13、 at 11 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88682 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specifi

    14、cation, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-3

    15、8535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit D

    16、rawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following

    17、 document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents cited in the solicitation or contract. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JESD7 - Standard for Description of 54/74HCXXXXX and 54/74HCTXXXXX Advanced High

    18、-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10thStreet, Suite 240-S Arlington, VA 22201-2107). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the ref

    19、erences cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38

    20、535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed

    21、 as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form,

    22、fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction,

    23、and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be

    24、as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without lic

    25、ense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88682 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified

    26、in table I and shall apply over the full (case or ambient) operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in a

    27、ccordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not markin

    28、g the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535

    29、 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime -VA

    30、 prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with

    31、each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activit

    32、y retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUI

    33、T DRAWING SIZE A 5962-88682 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Test conditions 1/ -55C TC +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max High l

    34、evel output voltage VOHVIN= VIHor VILIOH= -20 A VCC= 2.0 V 1, 2, 3 01 1.9 V VCC= 4.5 V 4.4 VCC= 6.0 V 5.9 VIN= VIHor VILIOH= -4.0 mA VCC= 4.5 V 3.7 VIN= VIHor VILIOH= -5.2 mA VCC= 6.0 V 5.2 Low level output voltage VOLVIN= VIHor VILIOL= +20 A VCC= 2.0 V 1, 2, 3 01 0.1 V VCC= 4.5 V 0.1 VCC= 6.0 V 0.1

    35、 VIN= VIHor VILIOL= +4.0 mA VCC= 4.5 V 0.4 VIN= VIHor VILIOL= +5.2 mA VCC= 6.0 V 0.4 High level input voltage 2/ VIHVCC= 2.0 V 1, 2, 3 01 1.5 V VCC= 4.5 V 3.15 VCC= 6.0 V 4.2 Low level input voltage 2/ VILVCC= 2.0 V 1, 2, 3 01 0.3 V VCC= 4.5 V 0.9 VCC= 6.0 V 1.2 Input capacitance CINVIN= 2.0 V to 6.

    36、0 V; TC= +25C See 4.3.1c 4 01 10 pF Output capacitance COUTVIN= 2.0 V to 6.0 V; TC= +25C See 4.3.1c 4 01 20 pF Quiescent supply current ICCVCC= 6.0 V, IOUT= 0.0 A VIN= VCCor GND 1, 2, 3 01 160 A Input leakage current IINVCC= 6.0 V VIN= VCCor GND 1, 2, 3 01 1 A Three-state output leakage current IOZV

    37、CC= 6.0 V, VOUT= VCCor GND 1, 2, 3 01 10 Functional tests See 4.3.1d 7, 8 01 Propagation delay time, A or B to mY 3/ tPLH1, tPHL1CL= 50 pF 10% See figure 4 VCC= 2.0 V 9 01 150 ns 10, 11 225 VCC= 4.5 V 9 30 10, 11 45 VCC= 6.0 V 9 26 10, 11 38 See footnotes at end of table. Provided by IHSNot for Resa

    38、leNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88682 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Test conditio

    39、ns 1/ -55C TC +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Propagation delay time, mCn to mY 3/ tPLH2, tPHL2CL= 50 pF 10% See figure 4 VCC= 2.0 V 9 01 126 ns 10, 11 210 VCC= 4.5 V 9 28 10, 11 42 VCC= 6.0 V 9 23 10, 11 36 Propagation delay time, output enable, mG

    40、 to mY 3/ tPZH, tPZLRL= 1 k CL= 50 pF See figure 4 VCC= 2.0 V 9 01 100 ns 10, 11 150 VCC= 4.5 V 9 20 10, 11 30 VCC= 6.0 V 9 17 10, 11 26 Propagation delay time, output disable, mG to mY 3/ tPHZ, tPLZVCC= 2.0 V 9 01 135 ns 10, 11 203 VCC= 4.5 V 9 30 10, 11 45 VCC= 6.0 V 9 35 10, 11 38 Transition time

    41、 4/ tTLH, tTHLCL= 50 pF See figure 4 VCC= 2.0 V 9 01 60 ns 10, 11 90 VCC= 4.5 V 9 12 10, 11 18 VCC= 6.0 V 9 10 10, 11 15 1/ For a power supply of 5 V 10 percent, the worst case output voltages (VOHand VOL) occur for HC at 4.5 V. Thus, the 4.5 V values should be used when designing with this supply.

    42、Worst cases VIHand VILoccur at VCC= 5.5 V and 4.5 V, respectively. (The VIHvalue at 5.5 V is 3.85 V). The worst case leakage currents (IIN, ICC, and IOZ) occur for CMOS at the higher voltage so the 6.0 V values should be used. Power dissipation capacitance (CPD), typically 250 pF, determines the no

    43、load dynamic power consumption, PD= CPDx VCC2f + ICCx VCC, and the no load dynamic current consumption, IS= CPDx VCCf + ICC. 2/ VIHand VILtests are not required and shall be applied as forcing functions for VOHand VOLtests. 3/ AC testing at VCC= 2.0 V and VCC= 6.0 V shall be guaranteed, if not teste

    44、d, to the specified limits in table I. 4/ Transition times (tTLH, tTHL), if not tested, shall be guaranteed to the specified limits in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88682 DLA LAND A

    45、ND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outlines E 2 Terminal number Terminal symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 1G B 1C3 1C2 1C1 1C0 1Y GND 2Y 2C0 2C1 2C2 2C3 A 2G VCC- - - - NC 1G B 1C3 1C2 NC 1C1 1C0 1Y GND NC

    46、 2Y 2C0 2C1 2C2 NC 2C3 A 2G VCCNC = No internal connection FIGURE 1. Terminal connections. Select inputs Data inputs Output control inputs Outputs B A mC0 mC1 mC2 mC3 mG mY X X X X X X H Z L L L X X X L L L L H X X X L H L H X L X X L L L H X H X X L H H L X X L X L L H L X X H X L H H H X X X L L L

    47、 H H X X X H L H H = High level voltage L = Low level voltage X = Irrelevant Z = High impedance FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88682 DLA LAND AND MARITIME COLUMBUS, OHI

    48、O 43218-3990 REVISION LEVEL C SHEET 8 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88682 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 9 DSCC FORM 2234 APR 97 NOTES: 1. CL includes test jig and probe capacitance. 2. Input signal from pulse generator: VIN= 0.0 V to VCC; PRR 1 MHz; ZO= 50; tr= 6.0 ns; tf= 6.0 ns; trand tfshall be measure


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