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    DLA SMD-5962-87695 REV C-2013 MICROCIRCUIT DIGITAL ADVANCED CMOS OCTAL BUFFER LINE DRIVER WITH THREE-STATE OUTPUTS MONOLITHIC SILICON.pdf

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    DLA SMD-5962-87695 REV C-2013 MICROCIRCUIT DIGITAL ADVANCED CMOS OCTAL BUFFER LINE DRIVER WITH THREE-STATE OUTPUTS MONOLITHIC SILICON.pdf

    1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update boilerplate to MIL-PRF-38535 requirements. Editorial changes throughout. - LTG 05-02-23 Thomas M. Hess B Add device type 02. Add device Class V criteria. Add radiation hardened assurance features in section 1.5 and SEP limits in table IB.

    2、Update boilerplate paragraphs to the current requirements as specified in MIL-PRF-38535. - jak 10-02-17 Thomas M. Hess C Change case outline X (flat pack) dimension A and add dimensions E2 and E3 to figure 1. Update radiation features in section 1.5 and SEP table IB. - MAA 13-07-16 Thomas M. Hess RE

    3、V SHEET REV C C C C C SHEET 15 16 17 18 19 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Greg A. Pitz DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. Di

    4、Cenzo THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, ADVANCED CMOS, OCTAL BUFFER/LINE DRIVER WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 87-12-08 AMSC N/A REVISION LEVEL C SIZE A

    5、 CAGE CODE 67268 5962-87695 SHEET 1 OF 19 DSCC FORM 2233 APR 97 5962-E461-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87695 DLAL LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSC

    6、C FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Numb

    7、er (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 5962 - 87695 01 R A Federal RHA Device Case Lead stock class designator type outline finish designator (see 1.2

    8、.1) (see 1.2.2) (see 1.2.4) (see 1.2.5) / / Drawing number For device class V: 5962 F 87695 01 V X A Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA des

    9、ignator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-)

    10、indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54AC540 Octal buffer/line driver with three-state outputs 02 54AC540 Radiation hardened octal buffer/line driver with three-state outputs 1.2.

    11、3 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line package S GDFP2-F20 or CDFP3-F20 20 Flat pack X See figure 1 20 Flat pack 2 CQCC1-N20 20 Square leadless chi

    12、p carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87695 DLAL LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL

    13、 C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +6.0 V dc DC input voltage (VIN) -0.5 V dc to VCC+ 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc Clamp diode current (IIK, IOK) 20 mA DC output current (IOUT) . 50 m

    14、A DC VCCor GND current (ICC, IGND) 100 mA Storage temperature range (TSTG) . -65C to +150C Maximum power dissipation (PD) . 500 mW Lead temperature (soldering, 10 seconds) +260C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ). +175C 4/ 1.4 Recommended operating

    15、 conditions. 2/ 3/ 5/ Supply voltage range (VCC) +3.0 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT) . +0.0 V dc to VCCCase operating temperature range (TC) . -55C to +125C Input rise or fall times: VCC= 3.6 V . 0 to 116 ns (10% to 90%, 40 ns/V) VCC= 5.5 V .

    16、0 to 88 ns (10% to 90%, 20 ns/V) 1.5 Radiation features. Device type 02: Maximum total dose available (dose rate = 50 300 rads (Si)/s) 300 krads (Si) Single event phenomenon (SEP): No SEU occurs at effective LET (see 4.4.4.2) . 110 MeVcm2/mg No SEL occurs at effective LET (see 4.4.4.2) 110 MeVcm2/mg

    17、 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability 2/ Unless otherwise specified, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall

    18、apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 5/ Operation from 2.0 V dc to 3.0 V dc is provided

    19、 for compatibility with data retention and battery back-up systems. Data retention implies no input transition and no stored data loss with the following conditions: VIH 70% VCC, VIL 30% VCC, VOH 70% VCC -20 A, VOL 30% VCC 20 A. Provided by IHSNot for ResaleNo reproduction or networking permitted wi

    20、thout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87695 DLAL LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handb

    21、ooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF

    22、 DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents

    23、are available online at http:/quicksearch.dla.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise

    24、specified, the issues of these documents cited in the solicitation or contract. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) EIA/JEDEC Standard JESD78 - IC Latch-up Test JEDEC Standard JESD20 - Standard for Description of 54/74ACXXXX and 54/74ACTXXXX Advanced High- Speed CMOS Devices. (Copies of

    25、 these documents are available online at http:/www.jedec.org or from Electronic Industries Alliance, 2500 Wilson Boulevard, Arlington, VA 22201-3834). ASTM INTERNATIONAL (ASTM) ASTM F1192 - Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of semicon

    26、ductor Devices. (Copies of these documents are available online at http:/www.astm.org or from ASTM International, 100 Barr Harbor Drive, P.O. Box C700, West Conshohocken, PA, 19428-2959). 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited he

    27、rein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A

    28、for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product

    29、in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function

    30、 of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS

    31、-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87695 DLAL LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A

    32、 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table. The truth table shall be as specified on figure 3. 3.2.4 Logic diagram. The logic

    33、diagram shall be as specified on figure 4. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 5. 3.2.6 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level co

    34、ntrol and shall be made available to the preparing or acquiring activity upon request. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified

    35、in table IA and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table IA. 3.5 Marking. The part shall be marked with the

    36、 PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA des

    37、ignator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built

    38、in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shal

    39、l be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein)

    40、. The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein, or for device class M, the requirements

    41、 of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notificati

    42、on of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing 3.9 Verification and review for device class M. For device class M, DLA

    43、Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for devic

    44、e class M. Device class M devices covered by this drawing shall be in microcircuit group number 39 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87695 DLAL LAND AND MARITIME

    45、 COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE IA. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TC +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max High level output voltage VOH2/ VIN= VIHor VILIOH= -50 A VC

    46、C= 3.0 V 1, 2, 3 All 2.90 V VCC= 4.5 V 4.40 VCC= 5.5 V 5.40 VIN= VIHor VILIOH= -4 mA VCC= 3.0 V 1, 2, 3 01 2.40 1 02 256 2, 3 2.40 VIN= VIHor VILIOH= -24 mA VCC= 4.5 V 1, 2, 3 01 3.70 1 02 3.86 2, 3 3.70 VCC= 5.5 V 1, 2, 3 01 4.70 1 02 4.86 2, 3 4.70 VIN= VIHor VILIOH= -50 mA VCC= 5.5 V 1, 2, 3 All

    47、3.85 Low level output voltage VOL2/ VIN= VIHor VILIOL= 50 A VCC= 3.0 V 1, 2, 3 All 0.10 V VCC= 4.5 V 0.10 VCC= 5.5 V 0.10 VIN= VIHor VILIOL= 12 mA VCC= 3.0 V 1, 2, 3 01 0.50 1 02 0.36 2, 3 0.50 VIN= VIHor VILIOL= 24 mA VCC= 4.5 V 1, 2, 3 01 0.50 1 02 0.36 2, 3 0.50 VCC= 5.5 V 1, 2, 3 01 0.50 1 02 0.

    48、36 2, 3 0.50 VIN= VIHor VILIOL= 50 mA VCC= 5.5 V 1, 2, 3 All 1.65 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87695 DLAL LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE IA. E


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