1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add vendor CAGE 48726 to the 02XX device. Make corrections to tables I and II. Change name and address for CAGE U4637. Inactivate 01 device for new design. Make changes to 6.4. 88-12-02 M. A. FRYE B Add vendors CAGE 69210 and 27014. Add case outl
2、ines T and U. Editorial changes throughout. 91-11-04 M. A. FRYE C Changes in accordance with NOR 5962-R231-96. 96-09-30 R. MONNIN D Add radiation hardness requirements. Redrawn. -rrp 00-03-28 R. MONNIN E Add case outlines Y and Z. Make change to load regulation test for case outline T as specified i
3、n table I - ro 02-05-14 R. MONNIN F Drawing updated to reflect current requirements. -rrp 09-12-02 C. SAFFLE THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV F F F F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY JOSE
4、PH A. KERBY DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY CHARLES E. BESORE COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, ADJUSTABLE POSITIVE REGULATOR, MONOLITHIC SILI
5、CON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 87-11-18 AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 67268 5962-87675 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E474-07 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCI
6、RCUIT DRAWING SIZE A 5962-87675 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appe
7、ndix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962 R 87675 01 X X Federal RHA Device Case Lead stock class designator type outline finish designator (see 1.2.1) (see 1.2.2) (see 1.2.3) (see 1.2.4) / / Drawing number 1.2.1 RHA designator. RHA mar
8、ked devices shall meet the MIL-PRF-38535 or MIL-PRF-38535, Appendix A specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Cir
9、cuit function 01 150 3.0 A positive regulator, adjustable 02 150A 3.0 A positive regulator, adjustable 1.2.3 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style T See figure 1 3 TO-257 Single row flange
10、mount with non-isolated tab and glass sealed U See figure 1 3 TO-257 Single row flange mount with isolated tab and glass sealed X MBFM1-P2 2 TO-3 Flange mount Y See figure 1 3 Flange mount, glass sealed with gull wing leads Z CBCC1-N3 3 Bottom terminal chip carrier 1.2.4 Lead finish. The lead finish
11、 is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Input to output voltage differential . 35 V Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) +300C Power dissipation (PD) Internally limited 1/ Junction temperature (TJ) +150C _ 1/ Power di
12、ssipation is guaranteed at 30 W up to 15 V input-output differential. Above 15 V, input-output differential power dissipation is limited by device internal protection circuitry. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DR
13、AWING SIZE A 5962-87675 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings Continued. Thermal resistance, junction-to-case (JC): Case T . 3.5C/W Case U . 4.2C/W Case X . 1.5C/W Case Y 6.4C/W Case Z . 3.7C/W 1.4 Recomme
14、nded operating conditions. Ambient operating temperature range (TA) -55C to +125C 1.5 Radiation features: Maximum total dose available (dose rate = 50 300 rads(Si) / s) 100 Krads (Si) 2/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, stan
15、dards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification fo
16、r. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of
17、these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cite
18、d herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 2/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Rad
19、iation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883, method 1019, condition A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87675 DEFENSE SUPPLY
20、 CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this dra
21、wing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity a
22、pproval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A
23、“Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case ou
24、tline. The case outline shall be in accordance with 1.2.3 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 3. 3.3 Electrical performance charac
25、teristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The
26、 electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PI
27、N number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicat
28、or “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL
29、-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate o
30、f conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent,
31、 and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IH
32、S-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87675 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ 3/ -55C TA +125C unless otherwise specified Group A subgroups De
33、vice type Limits Unit Min Max Reference voltage VREFIOUT= 10 mA, TA= +25C 1 01 1.20 1.30 V IOUT= 10 mA, TA= +25C 1 02 1.238 1.262 M,D,P,L,R 1 1.238 1.262 3.0 V (VIN VOUT) 35 V 10 mA IOUT 3.0 A, P 30 W 4/ 1,2,3 01 1.20 1.30 3.0 V (VIN VOUT) 35 V 10 mA IOUT 3.0 A, P 30 W 4/ 1,2,3 02 1.225 1.270 M,D,P,
34、L,R 1 1.225 1.270 Line regulation 5/ VOUT/ VIN3.0 V (VIN VOUT) 35 V IOUT= 10 mA, TJ= +25C 1 01,02 0.01 %/V M,D,P,L,R 1 02 0.01 3.0 V (VIN VOUT) 35 V IOUT= 10 mA 2,3 01,02 0.05 Load regulation 5/ 6/ VOUT/ IOUT10 mA IOUT 3.0 A VOUT 5.0 V, TJ= +25C Cases X and Z 1 01,02 15 mV Cases T, U, and Y 17.5 M,D
35、,P,L,R Case U 1 02 17.5 10 mA IOUT 3.0 A, VOUT 5.0 V 2,3 01,02 50 10 mA IOUT 3.0 A VOUT 5.0 V, TJ= +25C Cases X and Z 1 0.3 % Cases T, U, and Y 0.35 M,D,P,L,R Case U 1 02 0.35 10 mA IOUT 3.0 A, VOUT 5.0 V 2,3 01,02 1.0 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or ne
36、tworking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87675 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ 2/ 3/ -55C TA
37、 +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Thermal regulation - 20 ms pulse, TA= +25C 1 01,02 0.01 %/W M,D,P,L,R 1 02 0.01 Ripple rejection 7/ VIN/ VREFVOUT= 10 V, f = 120 Hz, CADJ= 10 F 4,5,6 01,02 66 dB M,D,P,L,R 4 02 66 Adjust pin current IADJ1,2,3 01,02 1
38、00 A M,D,P,L,R 1 02 100 Adjust pin current change IADJ10 mA IOUT 3.0 A, IOUT= 10 mA, 3.0 V (VIN VOUT) 35 V 1,2,3 01,02 5.0 A M,D,P,L,R 1 02 5.0 Minimum load current IMIN(VIN VOUT) = 35 V 1,2,3 01,02 5.0 mA M,D,P,L,R 1 02 5.0 Current limit ICLor (VIN VOUT) 10 V 1,2,3 01,02 3.0 A M,D,P,L,R 1 02 3.0 IS
39、C(VIN VOUT) = 30 V 1,2,3 01,02 0.3 M,D,P,L,R 1 02 0.3 Temperature 7/ stability VOUT/ T -55C TJ +125C 1,2,3 02 2.0 % M,D,P,L,R 1 2.0 Long term stability 7/ VOUT/ T TA= +125C, t = 1000 hours 2 01,02 1.0 % See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitt
40、ed without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87675 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. 1/ Devices supplied to this drawing will meet all level
41、s M, D, P, L, R of irradiation. However, this device is only tested at the R level. Pre and Post irradiation values are identical unless otherwise specified in table I. When performing post irradiation electrical measurements for any RHA level, TA= +25C. 2/ These parts may be dose rate sensitive in
42、a space environment and may demonstrate enhanced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883, method 1019, condition A. 3/ Unless otherwise specified, these specifications apply for (VIN VOUT) = 5.0 V and
43、IOUT= 1.5 A. Although power dissipation is internally limited, these characteristics are applicable for power dissipation up to 30 W. 4/ Cases T, U, Y, and Z: For output voltage readings not taken at the case, decrease minimum limits by IOUT(10 m) per inch of case to measurement-point lead length, e
44、.g., 15 mV per inch at 1.5 A and 30 mV per inch at 3.0 A. 5/ Regulation is measured at a constant junction temperature using a pulse technique. Changes in output voltage due to heating effects are covered under the specification for thermal regulation. 6/ Cases T, U, Y, and Z: For load regulation re
45、adings not taken at the case, increase maximum limits by IOUT(10 m) per inch of case to measurement-point lead length, e.g., 30 mV per inch at 3.0 A. 7/ Guaranteed, if not tested, to the limits specified. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in acc
46、ordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test
47、 condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufac
