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    DLA SMD-5962-87665 REV E-2005 MICROCIRCUIT DIGITAL CMOS 16-BIT MIL-STD-1750 MICROPROCESSOR MONOLITHIC SILICON《硅单块 MIL-STD-1750微处理器 16比特互补金属氧化物半导体 数字微型电路》.pdf

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    DLA SMD-5962-87665 REV E-2005 MICROCIRCUIT DIGITAL CMOS 16-BIT MIL-STD-1750 MICROPROCESSOR MONOLITHIC SILICON《硅单块 MIL-STD-1750微处理器 16比特互补金属氧化物半导体 数字微型电路》.pdf

    1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Added device type 04. Technical changes were implemented. Editorial changes throughout. 92-05-06 Monica L. Poelking B Added device types 05, 06, and 07. Technical changes to table I. Editorial changes throughout. 94-03-03 Monica L. Poelking C Cha

    2、nges in accordance with NOR 5962-R063-99. 99-05-27 Monica L. Poelking D Update boilerplate to MIL-PRF-38535 requirements. - CFS 05-10-03 Thomas M. Hess E Correct dimensioning on case outlines T, U, and X. - CFS 05-11-01 Thomas M. Hess REV D D SHET 5 56 REV D D D D D D D D D D D D D D D D D D D D SHE

    3、ET 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 REV E E D D D D D D D D D D D D D D D D D D SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 REV STATUS REV E D D D D D D D D D D D D E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Todd D. Creek

    4、DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Ray Monnin COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, CMOS, 16-BIT, MIL-STD-1750 MICROPROCESSOR AND AGENCIES OF THE DE

    5、PARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-03-01 MONOLITHIC SILICON AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 67268 5962-87665 SHEET 1 OF 56 DSCC FORM 2233 APR 97 5962-E037-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT D

    6、RAWING SIZE A 5962-87665 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.

    7、 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87665 01 X X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic

    8、number Circuit function Speed 01 P1750A-15 16-bit microprocessor 15 MHz 02 P1750A-20 16-bit microprocessor 20 MHz 03 P1750A-30 16-bit microprocessor 30 MHz 04 P1750A-40 16-bit microprocessor 40 MHz 05 P1750AE-20 16-bit microprocessor 20 MHz 06 P1750AE-30 16-bit microprocessor 30 MHz 07 P1750AE-40 16

    9、-bit microprocessor 40 MHz 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style T See figure 1. 64 Dual-in-line with gull-wing leads U See figure 1. 68 Leaded chip carrier with unformed leads X See figu

    10、re 1. 64 Dual-in-line Y See figure 1. 68 Leaded chip carrier with gull-wing leads Z See figure 1. 68 Pin grid array 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STAND

    11、ARD MICROCIRCUIT DRAWING SIZE A 5962-87665 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. Supply voltage range (VCC) -0.5 V dc to +7.0 V dc Input voltage range -0.5 V dc to VCC+ 0.5 V dc Storage temperature range

    12、-65C to +150C Input current range. -30 mA to +5 mA Voltage applied to inputs range -0.5 V dc to VCC+ 0.5 V dc Current applied to any output . 100 mA Maximum power dissipation (PD) 1.5 W 1/ Lead temperature range (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC): Cases T and X

    13、8C/W Cases U and Y . 5C/W Case Z 6C/W 1.4 Recommended operating conditions. Supply voltage range 4.5 V dc to 5.5 V dc Case operating temperature range (TC) . -55C to +125C Operating worst case power dissipation (outputs open): Device type 01 0.25 W at 15 MHz Device type 02 0.30 W at 20 MHz Device ty

    14、pe 03 0.35 W at 30 MHz Device type 04 0.40 W at 40 MHz Device type 05 0.40 W at 20 MHz Device type 06 0.50 W at 30 MHz Device type 07 0.60 W at 40 MHz 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of

    15、this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS M

    16、IL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online

    17、 at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein

    18、, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Must withstand the added PDdue to short circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking p

    19、ermitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87665 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38

    20、535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed

    21、 as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form,

    22、fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction,

    23、and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein and as specified on figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Functiona

    24、l block diagram. The functional block diagram shall be as specified on figure 3. 3.2.4 Timing waveforms and test circuits. The timing waveforms and test circuits shall be as specified on figure 4. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performan

    25、ce characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking

    26、. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has t

    27、he option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accord

    28、ance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DS

    29、CC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided

    30、with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers

    31、 facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Certification. Certification to MIL-STD-1750A VSW test version 2.2 shall be required and the manufacturer shall be listed on Air Force VSW Compliant Computer Li

    32、st. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87665 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristic

    33、s. Test Symbol Conditions 4.5 V VCC 5.5 V -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max Input high level voltage VIH1, 2, 3 All 2.0 VCC+ 0.5 V Input low level voltage VIL1, 2, 3 All -0.5 0.8 V Input clamp diode voltage VCDVCC= 4.5 V, IIN= -18 mA 1, 2, 3 Al

    34、l -1.2 V IOH= -8.0 mA, VCC= 4.5 V 2.4 High level output voltage VOHIOH= -300 A, VCC= 4.5 V 1, 2, 3 All VCC 0.2 V IOL= 8.0 mA, VCC= 4.5 V 0.5 Low level output voltage VOLIOL= 300 A, VCC= 4.5 V 1, 2, 3 All 0.2 V High level input current, except IB0- IB15, BUS BUSY, BUS LOCK IIH1VIN= VCC, VCC= 5.5 V 1,

    35、 2, 3 All 10 A High level input current, IB0- IB15, BUS BUSY, BUS LOCK IIH2VIN= VCC, VCC= 5.5 V 1, 2, 3 All 50 A Low level input current, except IB0- IB15, BUS BUSY, BUS LOCK IIL1VIN= GND, VCC= 5.5 V 1, 2, 3 All -10 A Low level input current, IB0- IB15, parity/IB16, BUS BUSY, BUS LOCK IIL2VIN= GND,

    36、VCC= 5.5 V 1, 2, 3 All -50 A Output three-state current IOZHVOUT= 2.4 V, VCC= 5.5 V 1, 2, 3 All 50 A Output three-state current IOZLVOUT= 0.5 V, VCC= 5.5 V 1, 2, 3 All -50 A 01, 02, 03, 04 10 Quiescent power supply current (CMOS input levels) ICCQCVINVCC 0.2 V, f = 0 MHz, outputs open, VCC= 5.5 V 1,

    37、 2, 3 05, 06, 07 20 mA Quiescent power supply current (TTL input levels) ICCQTVIN= 3.4 V, f = 0 MHz, outputs open, VCC= 5.5 V 1, 2, 3 All 50 mA 01 40 02 50 03 60 04 70 05 70 06 85 Dynamic power supply current ICCDVIN= 0 V to VCC, tr= tf= 2.5 ns nominal, outputs open, VCC= 5.5 V 1, 2, 3 07 100 mA See

    38、 footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87665 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical pe

    39、rformance characteristics - Continued. Test Symbol Conditions 4.5 V VCC 5.5 V -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max Output short circuit current IOSVOUT= GND, VCC= 5.5 V 1/ 1, 2, 3 All -25 mA Input capacitance CIN4 All 10 pFOutput capacitance COUT1

    40、5 pFBidirectional capacitance CI/OSee 4.3.1c 4 All 15 pF Functional tests See 4.3.1d 7, 8 01 45 02 33 03, 05, 06 25 BUS REQ tc(BR)L9, 10, 11 04, 07 22 ns 01 45 02 33 03, 05, 06 25 BUS REQ tc(BR)H9, 10, 11 04, 07 22 ns 01 5 02 5 03, 05, 06 5 BUS GNT setup tBGV(C)9, 10, 11 04, 07 5 ns 01 5 02 5 03, 05

    41、, 06 5 BUS GNT hold tC(BG)X9, 10, 11 04, 07 5 ns 01 35 02 25 03, 05, 06 24 BUS BUSY low tC(BB)L9, 10, 11 04, 07 20 ns 01 35 02 25 03, 05, 06 20 BUS BUSY high tC(BB)HSee figure 4. 2/ VCC= 4.5 V 9, 10, 11 04, 07 15 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or netwo

    42、rking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87665 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 4.5 V VCC 5.5 V -55

    43、C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max 01 5 02 5 03, 05, 06 5 BUS BUSY setup tBBV(C)9, 10, 11 04, 07 5 ns 01 5 02 5 03, 05, 06 5 BUS BUSY hold tC(BB)X9, 10, 11 04, 07 5 ns 01 50 02 30 03, 05, 06 25 BUS LOCK low tC(BL)L9, 10, 11 04, 07 21 ns 01 50 02 30

    44、 03, 05, 06 20 BUS LOCK high tC(BL)H9, 10, 11 04, 07 17 ns 01 5 02 5 03, 05, 06 5 BUS LOCK setup tBLV(C)9, 10, 11 04, 07 5 ns 01 5 02 5 03, 05, 06 5 BUS LOCK hold tC(BL)X(IN)9, 10, 11 04, 07 5 ns 01 45 02 30 03, 05, 06 25 M/IO, R/W status tC(ST)VSee figure 4. 2/ VCC= 4.5 V 9, 10, 11 04, 07 20 ns See

    45、 footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87665 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 TABLE I. Electrical pe

    46、rformance characteristics - Continued. Test Symbol Conditions 4.5 V VCC 5.5 V -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max 01 40 02 25 03, 05, 06 20 AS0 AS3, AK0 AK3, D/I status tC(ST)V9, 10, 11 04, 07 20 ns 01 25 02 22 03, 05, 06 17 STRBA high tC(SA)H9,

    47、10, 11 04, 07 16 ns 01 25 02 22 03, 05, 06 17 STRBA low tC(SA)L9, 10, 11 04, 07 16 ns 01 5 02 5 03, 05, 06 5 Address hold from STRBA low tSAL(IBA)X9, 10, 11 04, 07 5 ns 01 5 02 5 03, 05, 06 5 RDYA setup tRAV(C)9, 10, 11 04, 07 5 ns 01 5 02 5 03, 05, 06 5 RDYA hold tC(RA)X9, 10, 11 04, 07 5 ns 01 25

    48、02 22 03, 05, 06 17 STRBD low write tC(SDW)LSee figure 4. 2/ VCC= 4.5 V 9, 10, 11 04, 07 14 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87665 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 9 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 4.5 V VCC 5.5 V -55C TC +125C unless otherwise specified Group A subgroupsDevi


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