1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outline K, L, and 3 to device type 01. Add vendor CAGE 18324 to case outlines K, L, and 3. Editorial changes throughout. 88-10-14 M. A. Frye B Changes IAW NOR 5962-R040-98. cfs 98-02-20 Thomas M. Hess C Update boilerplate to MIL-PRF-3853
2、5 requirements. jak 01-12-13 Thomas M. Hess D Correct waveforms on figure 4. Update boilerplate to MIL-PRF-38535 requirements. - LTG 07-12-17 Thomas M. Hess E Update boilerplate to MIL-PRF-38535 requirements. - jak 12-12-14 Thomas M. Hess Current CAGE CODE is 67268 REV SHEET REV SHEET REV STATUS REV
3、 E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY David W. Queenan DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY N. A. Hauck THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY
4、 N. A. Hauck MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, 4-TO-16 LINE DECODER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 86-10-22 AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 14933 5962-86701 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E106-13 P
5、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86701 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requiremen
6、ts for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-86701 01 J A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (
7、see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54HCT154 4-to-16 line decoder, TTL compatible inputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline lette
8、r Descriptive designator Terminals Package style J GDIP1-T24 or CDIP2-T24 24 Dual-in-line K GDFP2-F24 or CDFP3-F24 24 Flat pack L GDIP3-T24 or CDIP4-T24 24 Dual-in-line 3 CQCC1-N28 28 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Ab
9、solute maximum ratings. 1/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC+0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+0.5 V dc DC input diode current (IIK) 20 mA DC output diode current (IOK) . 20 mA DC output current (per pin) 25 mA DC
10、 VCCor GND current (per pin) . 50 mA Maximum power dissipation (PD) . 500 mW 2/ Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC). See MIL-STD-1835 Junction temperature (TJ) . +150C Storage temperature range (TSTG) . -65C to +150C 1.4 Recommended operating cond
11、itions. 1/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc DC input or output voltage (VIN, VOUT) . 0 V dc to VCCCase operating temperature range (TC) -55C to +125C Input rise or fall time: VCC= 4.5 V 0 to 500 ns 1/ Unless otherwise specified, all voltages are referenced to ground. 2/ For TC= +100
12、C to +125C, derate linearly at 12 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86701 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUM
13、ENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFE
14、NSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List
15、 of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of preced
16、ence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirem
17、ents. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who
18、has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifica
19、tions to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used.
20、3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections sh
21、all be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4. 3.3
22、 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups
23、 specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86701 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E
24、SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to
25、space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a
26、“Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The
27、certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance
28、as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DLA Land and Ma
29、ritime, DLA Land and Maritime s agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networ
30、king permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86701 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Test conditions -55C TC +125C 1/ unless otherwise sp
31、ecified Group A subgroups Limits Unit Min Max High-level output voltage VOHVIN= VIHor VILIOH= -20.0 A VCC= 4.5 V 1, 2, 3 4.4 V VIN= VIHor VILIOH= -4.0 mA VCC= 4.5 V 1, 2, 3 3.7 Low-level output voltage VOLVIN= VIHor VILIOL= 20.0 A VCC= 4.5 V 1, 2, 3 0.1 V VIN= VIHor VILIOL= 4.0 mA VCC= 4.5 V 1, 2, 3
32、 0.4 High-level input voltage VIH2/ VCC= 4.5 V 1, 2, 3 2.0 V Low-level input voltage VIL2/ VCC= 4.5 V 1, 2, 3 0.8 V Quiescent current ICCVIN= VCCor GND VCC= 5.5 V 1, 2, 3 160 A Input leakage current IINVIN= VCCor GND VCC= 5.5 V 1, 2, 3 1.0 A Additional quiescent device current per input pin: 1 unit
33、load ICCVIN = VCC-2.1 V 1, 2, 3 490 A Input capacitance CINVIN = 0.0 V, TC = +25C See 4.3.1c 4 10 pF Functional tests See 4.3.1d 7 Propagation delay, time, address or enable to output tPLH, tPHL3/ CL= 50 pF See figure 4 9, 10, 11 53 ns Transition time, high-to-low low-to-high tTHL, tTLH4/ CL= 50 pF
34、See figure 4 9 15 ns 10, 11 22 1/ For a power supply of 5.0 V 10% the worst case output voltages (VOHand VOL) occur for HCT at 4.5 V. Thus, the 4.5 V values should be used when designing with this supply. The worst case leakage currents (IIN, and ICC) occur for CMOS at the higher voltage so the 5.5
35、V values should be used. 2/ Test not required if applied as a forcing function for VOHor VOL. 3/ For propagation delay tests, all paths must be tested. 4/ Transition times (tTLH, tTHL) shall be guaranteed, if not tested, to the limits specified in table I. Provided by IHSNot for ResaleNo reproductio
36、n or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86701 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines J, K, and L 3 Terminal number Terminal symbol 1 Y0 NC 2 Y1 Y0 3 Y2 Y1 4 Y
37、3 Y2 5 Y4 Y3 6 Y5 Y4 7 Y6 Y5 8 Y7 NC 9 Y8 Y6 10 Y9 Y7 11 Y10 Y8 12 GND Y9 13 Y11 Y10 14 Y12 GND 15 Y13 NC 16 Y14 Y11 17 Y15 Y12 18 E1 Y13 19 E2 Y14 20 A3 Y15 21 A2 E1 22 A1 NC 23 A0 E2 24 VCCA3 25 - - - A2 26 - - - A1 27 - - - A0 28 - - - VCCFIGURE 1. Terminal connections. Provided by IHSNot for Res
38、aleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86701 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 7 DSCC FORM 2234 APR 97 Inputs Outputs E1 E2 A3 A2 A1 A0 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 Y9 Y10 Y11 Y12 Y13 Y14 Y1
39、5 L L L L L L L H H H H H H H H H H H H H H H L L L L L H H L H H H H H H H H H H H H H H L L L L H L H H L H H H H H H H H H H H H H L L L L H H H H H L H H H H H H H H H H H H L L L H L L H H H H L H H H H H H H H H H H L L L H L H H H H H H L H H H H H H H H H H L L L H H L H H H H H H L H H H H
40、H H H H H L L L H H H H H H H H H H L H H H H H H H H L L H L L L H H H H H H H H L H H H H H H H L L H L L H H H H H H H H H H L H H H H H H L L H L H L H H H H H H H H H H L H H H H H L L H L H H H H H H H H H H H H H L H H H H L L H H L L H H H H H H H H H H H H L H H H L L H H L H H H H H H H H
41、H H H H H H L H H L L H H H L H H H H H H H H H H H H H H L H L L H H H H H H H H H H H H H H H H H H H L L H X X X X H H H H H H H H H H H H H H H H H L X X X X H H H H H H H H H H H H H H H H H H X X X X H H H H H H H H H H H H H H H H H = High level L = Low level X = Irrelevant FIGURE 2. Truth ta
42、ble. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86701 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 8 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for Resale
43、No reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86701 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 9 DSCC FORM 2234 APR 97 NOTES: 1. CL= 50 pF minimum or equivalent (includes test jig and probe capacitance). 2.
44、Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, ZO= 50, tr= 6.0 ns, tf= 6.0 ns. 3. The outputs are measured one at a time with one input transition per measurement. FIGURE 4. Switching wavefor
45、ms and test circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86701 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 10 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and insp
46、ection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall ap
47、ply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the input
48、s, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005
