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    DLA SMD-5962-08242-2008 MICROCIRCUIT HYBRID HIGH SPEED LOGIC GATE 3 3V OPTOCOUPLER.pdf

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    DLA SMD-5962-08242-2008 MICROCIRCUIT HYBRID HIGH SPEED LOGIC GATE 3 3V OPTOCOUPLER.pdf

    1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED REV SHET REV SHET 15 16 REV STATUS REV OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Steve L. Duncan CHECKED BY Greg Cecil DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil/ APPROVED BY Robert M

    2、. Heber STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 08-09-29 MICROCIRCUIT, HYBRID, HIGH SPEED LOGIC GATE 3.3V OPTOCOUPLER AMSC N/A REVISION LEVEL SIZE A CAGE CODE 67268 5962-08242 SHEET 1 OF 16 DSC

    3、C FORM 2233 APR 97 5962-E528-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-08242 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope.

    4、This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflec

    5、ted in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 - 08242 01 H X X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radiation h

    6、ardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Gene

    7、ric number Circuit function 01 ACPL-5601L, ACPL-560KL High speed single channel optocoupler 02 ACPL-5631L, ACPL-563KL High speed dual channel optocoupler 03 ACPL-2672L, ACPL-268KL High speed dual channel optocoupler 1.2.3 Device class designator. This device class designator shall be a single letter

    8、 identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation

    9、K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class

    10、. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C and D). E Designates devices which are based upon

    11、 one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system perf

    12、ormance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAW

    13、ING SIZE A 5962-08242 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E CDIP2-T16 16 Dual-i

    14、n-line P CDIP2-T8 8 Dual-in-line T See figure 1 16 Dual-in-line U See figure 1 16 Dual-in-line X See figure 1 8 Dual-in-line Y See figure 1 8 Dual-in-line 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Supply voltage (VCC) (t 1.0 minute) 7

    15、.0 V Peak forward input current (IF(PEAK) (each channel, t 1 ms). 40 mA Average input forward current (IFAVG) (each channel) 20 mA Reverse input voltage (VR) (each channel) 5.0 V Output current (IO) (each channel) . 25 mA Output voltage (VO) (each channel) . 7.0 V Enable input voltage (VE) 3.6 V (de

    16、vice type 01 only) Output power dissipation (PO) (each channel) . 40 mW Input power dissipation (each channel) 35 mW Total package power dissipation (PD) (each channel) 200 mW Lead temperature (soldering, 10 seconds). +260C Storage temperature range -65C to +150C Junction temperature (TJ) +175C 1.4

    17、Recommended operating conditions. Output supply voltage range (VCC) +3.0 V to +3.6 V Low level input current range (IFL) (each channel). 0 to 250 A High level input current range (IFH) (each channel) 10 mA to 20 mA High level enable voltage (VEH) . 2.0 V to VCC(device type 01 only) Low level enable

    18、voltage (VEL). 0 V to 0.8 V (device type 01 only) Fan out (N) (each channel) 6.0 TTL loads maximum Operating temperature range (TA). -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this

    19、 drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test

    20、 Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. _ 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. Provided by IH

    21、SNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-08242 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 4 DSCC FORM 2234 APR 97 DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Mi

    22、crocircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In th

    23、e event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The i

    24、ndividual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as designated in the device manufacturers Quality Management (QM) plan or as designated for the a

    25、pplicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or

    26、function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figu

    27、re 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Switching test circuit(s) and waveform. The switching test circuit(s) and waveform shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the

    28、 electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined

    29、 in table I. 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of

    30、MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested,

    31、 and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DSCC-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufactur

    32、er in order to supply to this drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturers product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38

    33、534 shall be provided with each lot of microcircuits delivered to this drawing. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the Q

    34、M plan shall not affect the form, fit, or function as described herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-08242 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 5 DS

    35、CC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Min Max Unit High level output current IOHVCC= 3.3 V, VO= 3.3 V, IF= 250 A 1/ 1,2,3 All 250 A Low level output voltage VOLVCC= 3.3

    36、V, IF= 10 mA, IOL(Sinking) = 10 mA 1/ 2/ 1,2,3 All 0.6 V Current transfer ratio CTR VO= 0.6V, IF= 10 mA, VCC= 3.3 V 1/ 1,2,3 All 100 % VCC= 3.3 V, IF= 0 mA 01 11 Logic high supply current ICCHVCC= 3.3 V, IF1= IF2= 0 mA 1,2,3 02, 03 22 mA VCC= 3.3 V, IF= 20 mA 01 15 Logic low supply current ICCLVCC=

    37、3.3 V, IF1= IF2= 20 mA 1,2,3 02, 03 30 mA 1,2 All 1.75 Input forward voltage VFIF= 20 mA 1/ 3 All 1.85 V Input reverse breakdown voltage BVRIR= 10 A 1/ 1,2,3 All 5 V Low level enable current IELVCC= 3.3 V, VE= 0.5 V 1,2,3 01 -2.0 mA High level enable voltage VEH3/ 1,2,3 2.0 V Low level enable voltag

    38、e VEL1,2,3 01 0.8 V Input-output leakage current II-OVI-O= 1500 V, relative humidity 65%, TA= 25C, t = 5 seconds4/ 5/ 1 All 1.0 A Capacitance between input/output CI-Of = 1 MHz, TC= 25C 1/ 6/ 7/ 4 All 4.0 pF 9 100 Propagation delay time to high output level tPLHVCC= 3.3 V, RL= 510 , CL= 50 pF, IF= 1

    39、3mA 1/ 8/ 10,11 All 140 ns 9 100 Propagation delay time to low output level tPHL1/ 8/ 10,11 All 120 ns Output rise time tLHAll 90 ns Output fall time tHLRL= 510 , CL= 50 pF, IF= 13 mA 1/ 9,10,11 All 40 ns Common mode transient immunity at high output level |CMH| VCM= 50 V (peak), VCC= 3.3 V, VO(min)

    40、 = 2 V, RL= 510 , IF= 0 mA 1/ 7/ 9/ 9,10,11 All 1000 V/s Common mode transient immunity at low output level |CML| VCM= 50 V (peak), VCC= 3.3 V, VO(max) = 0.8 V, RL= 510 , IF= 10 mA 1/ 7/ 9/ 9,10,11 All 1000 V/s See footnotes at top of next page. Provided by IHSNot for ResaleNo reproduction or networ

    41、king permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-08242 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 6 DSCC FORM 2234 APR 97 TABLE 1. Electrical performance characteristics Continued. 1/ Each channel. 2/ It is essential that a bypa

    42、ss capacitor (0.01 to 0.1 F, ceramic) be connected from VCCto ground. Total lead length between both ends of this external capacitor and the isolator connections should not exceed 20 mm. 3/ No external pull up is required for a high logic state on the enable input. 4/ All devices are considered two

    43、terminal devices; II-Ois measured between all input leads shorted together and all output leads shorted together. 5/ This is a momentary withstand test, not an operating condition. 6/ Measured between each input pair shorted together and all output connections for that channel shorted together. 7/ P

    44、arameters are tested as part of device initial characterization and after design and process changes. Parameters are guaranteed to limits specified for all lots not specifically tested. 8/ tPHLpropagation delay is measured from the 50% point on the leading edge of the input pulse to the 1.5 V point

    45、on the leading edge of the output pulse. The tPLHpropagation delay is measured from the 50% point on the trailing edge of the input pulse to the 1.5 V point on the trailing edge of the output pulse. 9/ CMLis the maximum rate of the rise of the common mode voltage that can be sustained with the outpu

    46、t voltage in the logic low state (VO2.0 V). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-08242 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 7 DSCC FORM 2234 APR 97 Case out

    47、line T. Millimeters Inches Symbol Min Max Min Max A 4.57 .180 A1 1.40 1.65 .055 .065 b 0.41 0.51 .016 .020 c 0.18 0.33 .007 .013 D 20.07 20.83 .790 .820 e 2.29 2.79 .090 .110 E 9.65 9.91 .380 .390 E1 8.13 .320 L 1.07 1.32 .042 .052 S 0.89 1.52 .035 .060 Case outline U. Millimeters Inches Symbol Min

    48、Max Min Max A 4.32 .170 A1 1.14 1.40 .045 .055 b 0.41 0.51 .016 .020 c 0.18 0.33 .007 .013 D 20.07 20.83 .790 .820 e 2.29 2.79 .090 .110 E 8.13 .320 eA 7.37 7.87 .290 .310 Q 0.51 .020 S 0.89 1.52 .035 .060 NOTES: 1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin 1 is indicated by the ESD triangle marked on the top of the package. FIGURE 1. Case outline(s)


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