1、Comments, suggestions or questions on this document should be addressed to DLA Land and Maritime, ATTN: VAT, Post Office Box 3990, Columbus, OH 43218-3990, or emailed to relaydla.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSI
2、ST Online database at https:/assist.daps.dla.mil/. AMSC N/A FSC 5945 INCH-POUND MIL-R-5757J 11 October 2011 SUPERSEDING MIL-R-5757H 15 October 1998 DETAIL SPECIFICATION RELAYS, ELECTROMAGNETIC, GENERAL SPECIFICATION FOR Inactive for new design after 15 October 1998. No superseding specification This
3、 specification is approved for use by all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the general performance requirements for electrical relays with contact ratings up to and including 10 amperes for use in electronic, communications, and oth
4、er applications (see 6.1). CAUTION: The use of any coil voltage (or current) less than the rated coil voltage (or current) will compromise the operation of the relay. CAUTION: Pick-up, hold, and dropout voltages are for test purposes only and are not to be used as design criteria. For additional app
5、lication and caution information, see 6.1. 1.2 Part or Identifying Number (PIN). The PIN will consist of the letter “M“, the specification sheet number, and an assigned dash number (see 3.1) as shown in the following example: M 5757 /29 -001 I I I I I I I I I Specification Specification Dash number
6、designator sheet number 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. W
7、hile every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3 and 4 of this specification, whether or not they are listed. Provided by IHSNot for ResaleNo reproduction or networkin
8、g permitted without license from IHS-,-,-MIL-R-5757J 2 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documen
9、ts are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-DTL-45204 - Gold Plating, Electrodeposited. STANDARDS MIL-STD-202 - Test Methods Standards Electronics and Electrical Component Parts. MIL-STD-883 - Test Method Standard Microelectronics. MIL-STD-1285 - Mark
10、ing of Electrical and Electronic Parts. (See supplement 1 for list of associated specification sheets.) (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5
11、094.) 2.2 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. AMERICAN NATIONAL STANDARDS INSTITUTE (ANSI) ANSI/NCSL Z540.3 - Calib
12、ration of Measuring and Test Equipment, Requirements for (Application for copies can be found online at http:/www.ansi.org/ or 11 West 42nd Street, New York, NY 10036-8002, telephone 212-642-4900, fax 212-302-1286) INSTITUTE of ELECTRICAL and ELECTRONIC ENGINEERS (IEE) IEEE315 - Graphic Symbols for
13、Electrical and Electronics Diagrams (including reference designation letters). (Applications for copies can be found online at http:/ieee.org/ or 3 Park Avenue, 17th Floor, New York, NY 10016-5997) INTERNATIONAL STANDARDIZATION ORGANIZATION (ISO) ISO-10012 - Equipment, Quality Assurance Requirements
14、 for Measuring, Part 1: Metrological Configuration System for Measuring Equipment. (Application for copies can be found online at http:/www.ansi.org/ or 11 West 42nd Street, New York, NY 10036-8002, telephone 212-642-4900, fax 212-302-1286) SOCIETY OF AUTOMOTIVE ENGINEERS (SAE) SAE-AMS-QQ-N-290 - Ni
15、ckel Plating (Electrodeposited). (Application for copies can be found online at http:/www.sae.org or should be addressed to the Society Of Automotive Engineers (SAE) World Headquarters, 400 Commonwealth Drive, Warrendale, PA 15096-0001) (Non-Government standards and other publications are normally a
16、vailable from the organizations that prepare or distribute the documents. These documents also may be available in or through libraries or other informational services.) Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-R-5757J 3 2.3 Order of prece
17、dence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein (except for related specification sheets), the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws a
18、nd regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Specification sheets. The individual item requirements shall be as specified herein and in accordance with the applicable specification sheet. In the event of any conflict between the requirements of this specification
19、 and the specification sheet, the latter shall govern. 3.2 Qualification. Relays furnished under this specification shall be products which are authorized by the qualifying activity for listing on the applicable Qualified Products List (QPL) at the time of award of contract (see 4.3, 4.4 and 6.3). T
20、he Qualified Products List (QPL) associated with this inactive for new design specification will be maintained until acquisition of the product is no longer required whereupon the specification and QPL will be canceled. 3.3 Materials. Materials shall be as specified herein. However, when a definite
21、material is not specified, a material shall be used which will enable the relays to meet the performance requirements of this specification. Materials used externally shall be fungus inert, self-extinguishing, and shall not support combustion, nor give off noxious gases in harmful quantities. Materi
22、als used internally shall not give off gases in quantities sufficient to cause explosion of sealed enclosures, cause contamination of the contacts or other parts of the relay that will adversely affect life or reliability, or form current-carrying tracks when subjected to any of the tests specified
23、herein. Cotton-filled or wood-flour-filled materials shall not be used. Ceramic used for external surfaces shall be glazed. The use of silicone (see 6.8) or silicone compounds for any purpose is prohibited. The selection of materials shall be such as to provide maximum shelf life. Acceptance or appr
24、oval of any constituent material shall not be construed as a guaranty of the acceptance of the finished product. 3.3.1 Metals. Metals shall be of a corrosion-resistant type or shall be plated or treated to resist corrosion. The use of mercury or mercury compounds is prohibited. The use of magnesium
25、or magnesium alloys is prohibited (not applicable to contacts). 3.3.1.1 Plated finishes. a. The use of pure tin, as an underplate or final finish, is prohibited both internally and externally. Tin content of switch components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with
26、 a minimum of 3 percent lead, by mass (see 6.5) b. Use of zinc plating is prohibited internally and externally. c. Use of cadmium plating is prohibited internally and externally. 3.3.1.2 Dissimilar metals. When dissimilar metals are used in intimate contact with each other, protection against electr
27、olysis and corrosion shall be provided. The use of dissimilar metals in contact, which tends toward active electrolytic corrosion (particularly brass, copper, or steel used in contact with aluminum or aluminum alloy), is not acceptable. However, metal spraying or metal plating of dissimilar base met
28、als to provide similar or suitable abutting surfaces is permitted. Dissimilar metals should be as defined in 6.6. In hermetic seals, the 0.25 V difference between the header material and the housing material is not applicable. 3.3.2 Magnet wire. Magnet wire used shall enable the relay to meet the pe
29、rformance requirements of this specification. 3.3.3 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance req
30、uirements, and promotes economically advantageous life cycle costs. 3.4 Interface and construction requirements. Relays shall meet the interface and construction requirements as specified (e.g. weight, physical dimensions) (see 3.1). Provided by IHSNot for ResaleNo reproduction or networking permitt
31、ed without license from IHS-,-,-MIL-R-5757J 4 3.4.1 Case. Unless otherwise specified (see 3.1), the case shall not be electrically connected to the contacts or coil; however, it may be used as part of the magnetic circuit. 3.4.1.1 Case grounding. When specified (see 3.1), a means for connecting the
32、relay case to ground shall be provided. 3.4.2 Sealing process. Relays shall be dried, degassed, backfilled with an atmosphere, and sealed in such a manner that all the requirements of this specification are met. Adjunct sealant (see 6.8), if used, must comply with the following characteristics: a. S
33、hall not extend above 20 percent of the length of the exposed terminals above the glass meniscus. b. Trace color is permitted if it is a natural result of the sealant process. c. Shall form, after curing, a permanent nonconductive, noncracking seal under all relay environments. 3.4.3 Contacts. Conta
34、cts shall have load ratings and arrangements as specified (see MIL-STD-1285 and 3.1) and unless otherwise specified (see 3.1), shall be capable of carrying the maximum rated current continuously as well as making and breaking the specified current under all environmental conditions specified herein.
35、 3.4.3.1 Orientation of contact motion (dry reed relays only). The flat surface of the reed contact shall be parallel to two sides at right angles to the relay housing unless otherwise specified (see 3.1). 3.4.3.2. Switch capsules. Unless otherwise specified (see 3.1), switch capsules used in dry re
36、ed relays shall be such that the performance requirements of this specification are met. Switch capsule leads shall not be used as terminals. 3.4.4 Coils. Coils shall be adequately insulated electrically from the contacts and the case. The resistance and rated voltage (or current) shall be as specif
37、ied (see 3.1). Coils shall be designed for continuous operation at maximum rated voltage (or current) and temperature, unless otherwise specified (see 3.1). 3.4.4.1 Terminal identification. When specified (see 3.1), a bead of contrasting color shall be used to designate the X1 (positive, if applicab
38、le) terminal (see figure 1 and MIL-STD-1285). FIGURE 1. Terminal symbols and markings. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-R-5757J 5 3.4.5 Circuit diagram. The circuit diagram as specified (see 3.1), shall be a terminal view. Circuit
39、symbols shall be in accordance with IEEE315. For relays without an orientation tab, the circuit diagram, as specified (see 3.1), shall be oriented so that when the relay is held with the circuit diagram right side up as shown (see 3.1), and rotated away from the viewer about a horizontal axis throug
40、h the diagram until the header terminals face the viewer, then each terminal shall be in the location shown in the circuit diagram. 3.4.6 Mounting means (see 3.1). 3.4.6.1 Bracket. Mounting brackets shall be an integral part of the relay, securely attached thereto in a manner to prevent any movement
41、 between the relay and the mounting bracket. 3.4.7 Terminals (see 3.1). Terminals shall be as specified herein. Manufacturer may supply hot solder dipped terminals provided that the hot solder dipping process has been approved by the qualifying activity and when specified on the individual order (se
42、e 6.2.1a). Solder dipped terminals may be .002 inch (0.05 mm) larger than the maximum dimension specified (see 3.1). Icicles are a normal result of the hot solder dip process and shall not be grounds for rejection (see figure 2). NOTES: 1. No solder is allowed on the header surface. Components (rela
43、y terminals) after solder-dip shall be capable of meeting method 208 of MIL-STD-202, solderability requirements. 2. Solder-coat thickness shall be .0001 inch (.003 mm) minimum. FIGURE 2. Solder-dip acceptability criteria (solder-icicle length limits). Provided by IHSNot for ResaleNo reproduction or
44、networking permitted without license from IHS-,-,-MIL-R-5757J 6 3.4.7.1 Solder lug terminals. Solder lug terminals shall be designed to accommodate two conductors, each rated to carry the maximum rated current of the contact or coil terminated. 3.4.7.2 Wire leads. Wire leads shall be as specified (s
45、ee 3.1). Optional, shortened wire leads may be supplied when specified on the individual order (see 3.1 and 6.2.1b). 3.4.7.2.1 Wire leads, solder pin (SP). Solder pin wire leads shall be as specified (see 3.1). 3.4.7.3 Wire marks. When plating is used, an underplating of copper may be used to assure
46、 good adhesion. A slight exposure of copper underplating or other underplating resulting from wire wrapping necessitated by the plating operation is acceptable (see figure 3). FIGURE 3. Wire marks. 3.4.7.4 Plug-in termination. Plug-in terminations shall conform to the arrangements or dimensions as s
47、pecified (see 3.1). The mounting arrangement of the relay shall be so designed that the entire weight of the relay will be suspended and the stability of its mounting will be provided by an auxiliary mounting means other than the electrical terminals of a socket (see 3.1). Plug-in terminals shall be
48、 gold plated in accordance with MIL-DTL-45204, type II, class I, with a nickel underplating that shall be in accordance with SAE-AMS-QQ-N-290 and 50 microinches to 150 microinches thick. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-R-5757J 7 3
49、.4.7.5 Solder dip (retinning) leads. The manufacturer may solder dip/retin the leads of product supplied to this specification provided the solder dip process has been approved by the qualifying activity. 3.4.7.5.1 Qualifying activity approval. Approval of the solder dip process will be based on one of the following options (NOTE: Solder dip of gold-plated plug-in leads is not allowed.) All visual examination crit
